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An Analysis of Vacuum Plasma Phenomena in DBD(Dielectric Barrier Discharges)  

Shin, Myoung-Soo (Graduate School of NID, Seoul National Univ. of Technology)
Cha, Sung-Hoon (Graduate School of NID, Seoul National Univ. of Technology)
Kim, Jong-Bong (Department of Automotive Engineering, Seoul National Univ. of Technology)
Kim, Jong-Ho (Department of Die & Mould Design, Seoul National Univ. of Technology)
Kim, Seong-Young (Applied Plasma Co.)
Lee, Hye-Jin (Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean Society for Precision Engineering / v.26, no.3, 2009 , pp. 122-128 More about this Journal
Abstract
DBD(Dielectric Barrier Discharges) plasma is often used to clean the surface of semiconductor. The cleaning performance is affected mainly by plasma density and duration time. In this study, the plasma density is predicted by coupled simulation of flow, chemistry mixing and reaction, plasma, and electric field. 13.56 MHz of RF source is used to generate plasma. The effect of dielectric thickness, gap distance, and flow velocity on plasma density is investigated. It is shown that the plasma density increases as the dielectric thickness decreases and the gap distance increases.
Keywords
DBD (Dielectric Barrier Discharges); Plasma; Simulation;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 Kim, Y. S., Lim, H. E., Han, S. H., Lee, Y. H. and Kim, Y. S., "Wettability and Aging Effect of Polystyrene Film Treated by PSII according to the Molecular Weight," Analytical Science & Technology, Vol. 15, No. 3, pp. 229-235, 2002   DOI   ScienceOn
2 Kolobov, V. I., "Fokker-Planck modeling of electron kinetics in plasmas and semiconductors," Computational Materials Science, Vol. 28, Issue 2, pp. 302-320, 2003   DOI   ScienceOn
3 Yi, C. H., Jeong, C. H., Lee, Y. H., Ko, Y. W. and Youm, G. Y., "Oxide surface cleaning by an atmospheric pressure plasma," Suface & Coatings Technology, Vol. 177-178, pp. 711-715, 2004   DOI   ScienceOn
4 Li, X., Li. L., Hua, X., Oehrlein, G. S., Wang, Y., Vasenkov, A. V. and Kushner, M. J., "Properties of C4F8 inductively coupled plasmas. I. Studies of Ar/c- $C_4F_8 $ magnetically confined plasmas for etching of $SiO_2$," Journal of Vacuum Science & Technology A, Vol. 22, No. 3, pp. 500-510, 2004   DOI   ScienceOn
5 Arslandbekov, R. R. and Kolobov, V. I., "Twodimensional simulations of the transition from Townsend to glow discharge and submormal oscillations," J. of Phys. D: Appl. Phys., Vol. 36, No. 23, pp. 2986-2994, 2003   DOI   ScienceOn
6 Hollander, A. and Behnisch, J., "Low pressure plasma treatments inside a closed package," Surface & Coatings Technology, Vol. 142-144, pp. 1074-1077,2001   DOI   ScienceOn
7 Han, S. M., Kim, S. J., Park, J. H., Choi, S. H. and Han, M. K., "High quality nanocrystalline silicon thin film fabricated by inductively coupled plasma chemical vapor deposition at 350$^{\circ}C$," J. of Noncrystalline Solid, Vol. 354, Issues 19-25, pp. 2268- 2271, 2008   DOI   ScienceOn
8 Kim, N. H., "Studies on the developing metal dry etcher with lower source power," Report of Energy/Resource Technology Development, pp. 10- 16, 2006
9 Sze, S. M., "Pina Technology, 2nd.," Mcgraw-Hill International, p. 184, 1988
10 Lee, C. H., Kim, D. H., Lee, N. E. and Kwon, G. C., "Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas," Journal of Vacuum Science & Technology A, Vol. 24, No. 4, pp. 1386-1394, 2006   DOI   ScienceOn
11 Ko, S. K., "Molecular Design and Surface Modification by Ion beam/Plasma Irradiation," Report of Molecular Design and Surface Modification by Ion beam/Plasma Irradiation, pp. 19- 22, 2000
12 Jiang, W., Xu, X., Dai, Z. -L. and Wang, Y. -N., "Heating mechanisms and particle flow balancing of capacitively coupled plasmas driven by combined dc/rf sources," Physics of Plasmas, Vol. 15, No. 3, pp. 033502-033505, 2008   DOI   ScienceOn
13 Lee, E. S., Choi, J. H. and Baik, H. K., "Surface cleaning of indium tin oxide by atmospheric air plasma treatment with the steady-state airflow for organic light emitting diodes," Surface & Coatings Technology, Vol. 201, No. 9-11, pp. 4973-4978, 2007   DOI   ScienceOn
14 Cho, J. -H., Kang, B. -K., Kim, K. -S., Choi, B.- K., Kim, S. -H. and Choi, W. -Y., "Hydrophilic Effect of the Polymide by Atmospheric Low-temperature Plasma Treatment," J. of the Korean Institute ofElectrical and Electronic Material Engineers, Vol. 18, No. 2, pp. 148-152, 2005   DOI   ScienceOn