• The Korean Journal of Ceramics
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• v.5 no.3
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• pp.245-249
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• 1999

A new type of nonthermal plasma reactor utilizing ferroelectric pellets is proposed to generate nonthermal plasma efficiently, which is used for simultaneous control of various pollutant gases. Electric charges stored on ferroelctric pellets by corona discharge between a corona tip and a mesh electrode provide partial electrical discharges among ferroelectric pellets. These partial electrical discharges can enhance partial discharges around the surface of ferroelectric pellets. This method utilizes wide reacting area of ferroelectric pellets and partial discharge. Positive and negative dc voltage are applied to the corona tip to generate partial discharges, and corona currents are estimated to investigate charge storage on ferroelectric pellets as function of time and charge relaxation time constants of ferroelectric pellects. As a result, charge relaxationtime, dielectric constants of ferroelectric pellets, polarity of applied voltage and applied time influence partial discharges among ferroelectric pellect.

• Journal of Korean Vacuum Science & Technology
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• v.2 no.1
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• pp.25-31
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• 1998

The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

• Journal of the Korean Society of Combustion
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• v.22 no.1
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• pp.23-31
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• 2017

Large-scale fuel tanks emit massive amount of hardly-combustible VOC mixtures which are light hydrocarbon species in dilution with nitrogen and carbon dioxide. We have developed a lab-scale burner to combust those VOC mixtures by use of a turbulent partially-premixed flame as a pilot flame. For a higher HC treatment ratio, the mixture gases were reformed by a rotating arc plasma device. The results showed that the nitrogen mole fraction and the injecting speed of the VOC mixture influence on the performance of the burner. It was also found that the size of the pilot flame and the power supplied to the plasma device determine the overall HC treatment ratio and the concentrations of CO and NOx in the exhaust gas.

• Proceedings of the KIEE Conference
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• 1999.07e
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• pp.2233-2235
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• 1999

The ac plasma display panel(PDP) is a flat light-emitting gas discharge device. Discharge gases directly take effects to the discharge phenomena of ac PDP. Therefore it is necessary to understand the characteristics of the discharge gases. In this paper, we have studied the effects of discharge gases by voltage transfer curves which show the discharge characteristics of ac PDP and the change of the effective wall capacitance during a discharge which depends on lateral spreading of charge distribution and the strength of discharge. As gas pressure increases, memory margins increases. and the firing voltage of a mixed gas is lower than that of a single gas such as He gas. The minimum sustain voltage and the maximum sustain voltage or firing voltage increases with decrease in the frequency. The effective wall capacitance increases as the discharge strength that is, the gap voltage between discharge electrodes increases.

• Transactions on Electrical and Electronic Materials
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• v.12 no.2
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• pp.60-63
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• 2011

We investigated the etching characteristics of zinc oxide (ZnO) and the effect of additive gases in a $Cl_2$-based inductively coupled plasma. The inert gases were argon, nitrogen, and helium. The maximum etch rates were 44.3, 39.9, and 37.9 nm/min for $Cl_2$(75%)/Ar(25%), $Cl_2$(50%)/$N_2$(50%), and $Cl_2$(75%)/He(25%) gas mixtures, 600 W radiofrequency power, 150 W bias power, and 2 Pa process pressure. We obtained the maximum etch rate by a combination of chemical reaction and physical bombardment. A volatile compound of Zn-Cl. achieved the chemical reaction on the surface of the ZnO thin films. The physical etching was performed by inert gas ion bombardment that broke the Zn-O bonds. The highly oriented (002) peak was determined on samples, and the (013) peak of $Zn_2SiO_4$ was observed in the ZnO thin film sample based on x-ray diffraction spectroscopy patterns. In addition, the sample of $Cl_2$/He chemistry showed a high full-width at half-maximum value. The root-mean-square roughness of ZnO thin films decreased to 1.33 nm from 5.88 nm at $Cl_2$(50%)/$N_2$(50%) plasma chemistry.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.390-390
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• 2012

Information technology industries has grown rapidly and demanded alternative memories for the next generation. The most popular random access memory, dynamic random-access memory (DRAM), has many advantages as a memory, but it could not meet the demands from the current of developed industries. One of highlighted alternative memories is magnetic random-access memory (MRAM). It has many advantages like low power consumption, huge storage, high operating speed, and non-volatile properties. MRAM consists of magnetic-tunnel-junction (MTJ) stack which is a key part of it and has various magnetic thin films like CoFeB, FePt, IrMn, and so on. Each magnetic thin film is difficult to be etched without any damages and react with chemical species in plasma. For improving the etching process, a high density plasma etching process was employed. Moreover, the previous etching gases were highly corrosive and dangerous. Therefore, the safety etching gases are needed to be developed. In this research, the etch characteristics of CoFeB magnetic thin films were studied by using an inductively coupled plasma reactive ion etching in $CH_4/O_2/Ar$ gas mixes. TiN thin films were used as a hardmask on CoFeB thin films. The concentrations of $O_2$ in $CH_4/O_2/Ar$ gas mix were varied, and then, the rf coil power, gas pressure, and dc-bias voltage. The etch rates and the selectivity were obtained by a surface profiler and the etch profiles were observed by a field emission scanning electron microscopy. X-ray photoelectron spectroscopy was employed to reveal the etch mechanism.

• Korean Chemical Engineering Research
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• v.49 no.4
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• pp.485-490
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• 2011

Tetrafluoromethane($CF_4$) has been used as etching and chamber cleaning gases for semiconductor manufacturing processes. These gases need to be removed efficiently because of their strong absorption of infrared radiation and long atmospheric lifetime which causes the global warming effect. We have developed a waterjet gliding arc plasma system in which plasma is combined with waterjet and investigated optimum operating conditions for efficient $CF_4$ destruction through enlarging discharge region and producing large amount of OH radicals. The operating conditions are waterjet flow rate, initial $CF_4$ concentration, total gas flow rate, specific energy input. Through the parametric studies, the highest $CF_4$ destruction of 97% was achieved at 2.2% $CF_4$, 7.2 kJ/L SEI, 9 L/min total gas flow rate and 25.5 mL/min waterjet flow rate.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.171-171
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• 2012

We have studied the effects of plasma treatments on CdS buffer layers in CIGS thin film solar cells. The CdS layers were deposited on CIGS films by chemical bath deposition (CBD) method. The RF plasma treatments of the CdS thin films were performed with Ar, $O_2 and $N_2 gases, respectively. After plasma treatments, the solar cells with Al:ZnO/i-ZnO/CdS/CIGS structures were fabricated. The surface properties of the CdS/CIGS thin films after plasma treatments were investigated with SEM, EDX and AFM measurements. The electrical properties of manufactured solar cell were discussed with the results of current-voltage measurements. The plasma treatments have a strong influence on the open circuit voltage (VOC) and the fill factor of the solar cells. Finally, a correlation between the surface properties of CdS layer and the efficiencies of the CIGS thin film solar cells is discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.96-96
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• 2010

To improve surface wettability, each sample was treated by atmospheric pressure plasma (APP) using dielectric barrier discharge (DBD) system. Argon and oxygen gases were used for treatment gas to modify the $TiO_2$ surface by APP with RF power range from 50 to 200 W. Water contact angle was decreased from $20^{\circ}$ to $10^{\circ}$ with argon only. However, water contact angle was decreased from $20^{\circ}$ to < $1^{\circ}$ with mixture of argon and oxygen. Water contact angle with $O_2$ plasma was lower than water contact angle with Ar plasma at the same RF power. It seems to be increasing the polar force of $TiO_2$ surface. Also, analysis result of X-ray photoelectron spectra (XPS) shows the increase of intensity of O1s shoulder peak, resulting in increasing of surface wettability by APP. Moreover, each water contact angle increased according to increase past time. However, contact angle increase with plasma treatment was lower than without plasma treatment. Additionally, the efficiency of $TiO_2$ photocatalyst was improved by plasma surface-treatment through the degradation experiment of phenol

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.494-494
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• 2013

Atmospheric pressure non-thermal plasma of the needle-typed interaction with aqueous solutions has received increasing attention for their biomedical applications [1]. In this context, surface discharges at bio-solutions were investigated experimentally. We have generated the non-thermal plasma jet bombarding the bio-solution surface by using an Ar gas flow and investigated the emission lines by OES (optical emission spectroscopy) [2]. Moreover, The non-thermal plasma interaction with bio-solutions has received increasing attention for their biomedical applications. So we researched, the OH radical density of various biological solutions in the surface by non-thermal plasma were investigated by Ar gases. The OH radical density of DI water; deionized water, DMEM Dulbecco's modified eagle medium, and PBS; 1x phosphate buffered saline by non-thermal plasma jet. It is noted that the OH radical density of DI water and DMEM are measured to be about $4.33{\times}1016cm-3$ and $2.18{\times}1016cm-3$, respectively, under Ar gas flow 250 sccm (standard cubic centimeter per minute) in this experiment. The OH radical density of buffer solution such as PBS has also been investigated and measured to be value of about $2.18{\times}1016cm-3$ by the ultraviolet optical absorption spectroscopy.