• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.817-821
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• 2000

In this work, we have investigated the dependence of annealing temperature(T$\_$a/) on optical and electrical properties of amorphous hydrogenated SiC(a-SiC:H) films. The a-SiC:H films were deposited on corning glass and p-type Si(100) wafer by PECVD (plasma enhanced vapor deposition) using SiH$_4$+CH$_4$+N$_2$ gas mixture. The experimental results have shown that the optical energy band gap(E$\_$opt/)of the thin films annealed at high temperatures have shown that the graphitization of carbon clusters and micro-crystalline silicon occurs. The current-voltage characteristics have shown good electrical properties at the annealed films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.747-750
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• 2000

In this work, we investigated the dependence of optical and electrical properties of amorphous hydrogenated SiC (a-SiC:H) films on annealing temperature(T$\sub$a/). The a-SiC:H films were deposited by PECVD(plasma enhanced vapor deposition) on coming glass, p-type Si(100) wafer using SiH$_4$+CH$_4$+N$_2$gas mixture. The experimental results have shown that the optical energy band gap(E$\sub$g/) of the a-SiC thin films unchanged in the range of T$\sub$a/ from 400$^{\circ}C$ to 600$^{\circ}C$. The Raman spectrum of the thin films, annealed at high temperatures, has shown that graphitization of carbon clusters and micro-crystalline silicon occurs. The current-voltage characteristics have shown good electrical properties at the annealed films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.180-180
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• 2010

The design and implementation of high rate deposition process and anti-scratch property of silicon oxide film by PECVD with UHF power were investigated according to the effect of UHF input power with HF bias. New regime of high rate deposition of SiOx films by hybrid plasma process was investigated. The dissociation of OMCTS (C8H24Si4O4) precursor was controlled by plasma processes. SiOx films were deposited on polyethylene terephthalate (PET) and polycarbonate substrate by plasma enhanced chemical vapor deposition (PECVD) using OMCTS with oxygen carrier gas. As the input energy increased, the deposition rate of SiOx film increased. The plasma diagnostics were performed by optical emission spectrometry. The deposition rate was characterized by alpha-step. The mechanical properties of the coatings were examined by nano-indenter and pencil hardness, respectively. The deposition rate of the SiOx films could be controlled by the appropriate intensity of excited neutrals, ionized atoms and UHF input power with HF bias at room temperature, as well as the dissociation of OMCTS.

• 대한기계학회논문집
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• 제16권12호
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• pp.2340-2348
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• 1992

본 연구에서는 드릴(SKH9종)에 스퍼터링법으로 Ti 중간층을 약 0.2$\mu\textrm{m}$의 두께 로 코팅한후, 그 위에 플라즈마 화학증착법으로 TiN박막을 코팅한 드릴로 드릴링 시험 을 행하여 수명을 평가하였으며, 드릴의 내마멸성 및 드릴링한 구멍 내면의 조도를 코 팅하지 않은 드릴 및 TiN 코팅한 드릴과 비교하므로서 Ti/TiN코팅처리에 의한 공구성 능 및 수명향상 효과를 평가하고자 하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.147.1-147.1
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• 2016

Hydrophobic thin films are variously applicable for encapsulation of organic devices and water repulsive glass, etc. In this work, the stability of hydrophobic characteristics of plasma polymerized tetrakis (trimethylsilyloxy) silane (ppTTMSS) thin films were investigated. The films were deposited with plasma enhanced chemical vapor deposition (PECVD) on the glass. The deposition plasma power and deposition pressure was 70 W and 600 mTorr, respectively. Thereafter, deposited films were treated by 248nm KrF excimer laser. Stability of hydrophobic properties of plasma polymerized tetrakis(trimethylsilyloxy)silane film surface was tested by excimer laser irradiation, which is thought to simulate severe outdoor conditions. Excimer laser irradiation cycles changed from 10 to 200 cycles. The chemical structure and hydrophobicity of ppTTMSS films were analyzed by using Fourier transform infrared (FTIR) spectroscopy and water contact angle (WCA) measurement, respectively. Absorption spectra peaks and WCA of excimer laser treated ppTTMSS films did not change notably. These results show that our ppTTMSS films possess stable hydrophobic properties.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.89-94
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• 2011

The cause of the thickness non-uniformity in the large area deposition of $SiO_2$ films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the $SiO_2$ films, it was conformed that the non-uniform deposition of $SiO_2$ films was related with the spatial distribution of the oxygen radical density and electron temperature.

• Tribology and Lubricants
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• 제22권3호
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• pp.127-130
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• 2006

DLC (Diamond Like Carbon) films show very desirable surface interactions with high hardness, low friction coefficient, and good wear-resistance properties. The friction behavior of hydrogenated DLC film is dependent on tribological environment, especially surrounding temperature. In this work, the tribological behaviors of DLC (Diamond-like carbon) films, prepared by the radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) method, were studied in elevated temperatures. The ball-on-disk tests with DLC films on steel specimens were conducted at a sliding speed of 60 rpm, a load of 10N, and surrounding various temperatures of $25^{\circ}C,\;40^{\circ}C,\;55^{\circ}C\;and\;75^{\circ}C$. The results show considerable dependency of DLC tribological parameters on temperature. The friction coefficient decreased as the surrounding temperature increased. After tests the wear tracks of hydrogenated DLC film were analyzed by optical microscope, scanning electron spectroscopy (SEM) and Raman spectroscopy. The surface roughness and 3-D images of wear track were also obtained by an atomic force microscope (AFM).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.121-122
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• 2011

광도파로 기반 센서의 성능을 개선시키기 위해서는 코어와 클래딩 층의 굴절률 차를 크게 하여 표면감도를 향상시켜야 한다. 이를 위해 센서용 광도파로 코어 층을 위한 고굴절률 SiNx 박막을 플라즈마 화학기상증착(PECVD, plasma enhanced chemical vapor deposition)법을 이용하여 성장한 후 그 표면특성을 분석하였다. 이 때 플라즈마 화학기상증착 공정 조건 중 NH3 가스를 제외하여 Si 성분이 많은 고굴절률 SiNx 박막의 성장을 유도하고 He/SiH4 가스유량비를 0에서 100까지 변화시켜 SiNx 박막의 표면거칠기를 제어하였다. Si기판 위에 SiNx 박막을 10분 성장 후 BOE(buffered oxide etchant)로 선택식각하여 그 박막두께를 alpha step으로 측정하는 방법으로 He/SiH4 가스유량비 조건별 박막성장률을 계산하였다. 그 결과 He/SiH4 가스유량비 증가함에 따라 박막성장률이 33 nm/min에서 19 nm/min으로 선형적인 감소함을 알 수 있었다. 박막두께가 190 nm가 되도록 He/SiH4 가스유량비 조건별 SiNx 박막을 성장한 후 그 표면특성을 AFM (atomic force microscope)으로 관찰하였다. 이를 통해 He/SiH4 가스유량비가 50일 때 SiNx 박막의 표면거칠기가 최소가 됨을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.253-253
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• 2012

Low temperature SiOx film process has being required for both silicon and oxide (IGZO) based low temperature thin film transistor (TFT) for application of flexible display. In recent decades, from low density and high pressure such as capacitively coupled plasma (CCP) type plasma enhanced chemical vapor deposition (PECVD) to the high density plasma and low pressure such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) have been used to researching to obtain high quality silicon oxide (SiOx) thin film at low temperature. However, these plasma deposition devices have limitation of controllability of process condition because process parameters of plasma deposition such as RF power, working pressure and gas ratio influence each other on plasma conditions which non-leanly influence depositing thin film. In compared to these plasma deposition devices, neutral beam assisted chemical vapor deposition (NBaCVD) has advantage of independence of control parameters. The energy of neutral beam (NB) can be controlled independently of other process conditions. In this manner, we obtained NB dependent high crystallized intrinsic and doped silicon thin film at low temperature in our another papers. We examine the properties of the low temperature processed silicon oxide thin films which are fabricated by the NBaCVD. NBaCVD deposition system consists of the internal inductively coupled plasma (ICP) antenna and the reflector. Internal ICP antenna generates high density plasma and reflector generates NB by auger recombination of ions at the surface of metal reflector. During deposition of silicon oxide thin film by using the NBaCVD process with a tungsten reflector, the energetic Neutral Beam (NB) that controlled by the reflector bias believed to help surface reaction. Electrical and structural properties of the silicon oxide are changed by the reflector bias, effectively. We measured the breakdown field and structure property of the Si oxide thin film by analysis of I-V, C-V and FTIR measurement.

• Applied Science and Convergence Technology
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• 제23권1호
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• pp.44-47
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• 2014

In this study, we investigated the basic properties of N-doped ethylcyclohexene plasma polymer thin films that deposited by radio frequency (13.56 MHz) plasma-enhanced chemical vapor deposition (PECVD) method with controlled ammonia flow rate. Ethylcyclohexene was used as organic precursor with hydrogen gas as the precursor bubbler gas. Additionally, ammonia ($NH_3$) gas was used as nitrogen dopant. The as-grown polymerized thin films were analyzed using ellipsometry, Fourier-transform infrared [FT-IR] spectroscopy, UV-Visible spectroscopy, and water contact angle measurement. We found that with increasing plasma power, film thickness is gradually increased while optical transmittance is drastically decreased. However, under the same plasma condition, water contact angle is decreased with increasing $NH_3$ flow rate. The FT-IR spectra showed that the N-doped ethylcyclohexene plasma polymer films were completely fragmented and polymerized from ethylcyclohexane.