• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.178.2-178.2
• /
• 2013

Conventional ultraviolets A,B,C are known to be very important factor of killing, changing surface properties of biological cells and materials. It is of great importance to investigate the influence of extreme ultraviolet (EUV) exposure on the biological cell. Here we have studied high density EUV plasma and its emission characteristics, which have been generated by plasma focus device with hypercycloidal pinch (HCP) electrode under various Ar gas pressures ranged from 30~500 mTorr in this experiment. We have also measured the plasma characteristics generated from the HCP plasma focus device such as electron temperature by the Boltzman plot, plasma density by the Stark broading method, discharge images by open-shuttered pin hole camera, and EUV emission signals by using the photodiode AXUV-100 Zr/C.

• Carbon letters
• /
• v.4 no.2
• /
• pp.74-78
• /
• 2003

Four kinds of plasma blacks were prepared by plasma pyrolysis under various metallic catalysts coated on honeycomb, and investigated the catalytic effect on the characteristics of the plasma blacks prepared under plasma pyrolysis condition. Pt, Pt-Rh, and Pd catalysts were employed as active materials to prepare the plasma blacks. In the experimental range studied, the metallic catalysts influenced on surface area, particle size, surface oxygen content and electrical conductivity of the plasma blacks prepared. It was showed that more dense particle of plasma blacks were prepared under existence of metallic catalysts. Presence of the metallic catalyst reduces the electrical resistivity of plasma blacks due to the decrease in the amount of oxygen functional groups. The highest electrical conductivity of plasma black was observed in the Pt catalyst and then followed by those Pt-Rh, Pd and bare cordierite honeycomb.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.57 no.4
• /
• pp.648-652
• /
• 2008

Corona discharge and ozone generation characteristics of a wire-plate plasma reactor, with a biased third electrode, have been investigated with an emphasis on the role of the bias voltage and frequency applied on the third electrode. It was found that the wire-plate plasma reactor, with the biased third electrode, had a switching characteristic on its I-V characteristics for negative and positive discharges, which is very different from that of a conventional wire-plate plasma reactor without the third electrode. As a result, the corona discharge and ozone generation characteristics of the proposed plasma reactor could be controlled by adjusting the bias voltage and frequency of the third electrode. The corona onset and breakdown voltages, and ozone generation and yield, were increased compared with those of without the third electrode. These, however, reveal the effectiveness of the biased third electrode.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.2 no.2
• /
• pp.2-8
• /
• 1965

This paper shows the characteristics of microwaves in a plasma medium bounded by a waveguide. A standing wave detector which has VSWR less than 1.05 is designed and constructed. The electromagnetic waves which propagate through the plasma is reflected partly by the interaction between the external magnetic fields and plasma. The plasma is consisted of the electrons and positive ions ionized by high temperature of tungsten filament inserted in the waveguide. The transmitted power through the plasma was reduced by the amount of 1.5db from the reference.

• Applied Science and Convergence Technology
• /
• v.26 no.5
• /
• pp.114-117
• /
• 2017

Plasma characteristics of two-dimensional inductively coupled discharge simulation is investigated. Impedance of an inductively coupled plasma discharge was considered. Voltage drops across antenna coils and current variation between coils made different profiles of plasma characteristics. Importance of the capacitive field effect in some case was analyzed.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2011.11a
• /
• pp.737-744
• /
• 2011

The success of continuous aluminum powder combustion with steam plasma is different from hydrocarbon ignition source. Ignition characteristics of aluminum powder with high temperature thermal plasma is studied with oxidizer-free environment. Experiment with argon plasma has same temperature conditions at 4500 K and particle feeding condition for previous combustion test with steam plasma and swirl combustor. The temperature of the plasma was measured using Optical Emission Spectroscopy method. Ignition characteristics were analyzed by SEM image and EDS. Aluminum powder with plasma has rapid evaporation mechanism contrast to hydrocarbon ignition source. It enhances to aluminum powder effective ignition characteristics.

• Proceedings of the KIPE Conference
• /
• 2003.07b
• /
• pp.611-615
• /
• 2003

In this paper, a operation characteristics and analysis of the HB(half bridge) inverter for remote plasma system are studied. the remote plasma system is cleaning system for the chemical vapor deposition (CVD) chamber in semiconductor processing. The remote plasma system is powered by the RF generator The main power stage of the RF generator is used for the HB PWM inverter with an low pass filter in the secondary circuit of the transformer. The detailed mode analysis of HB invertor was described. The operation characteristics of Remote Plasma Source are verified by simulation and experimental results.

• International journal of advanced smart convergence
• /
• v.10 no.1
• /
• pp.159-165
• /
• 2021

Electronic devices used in the mobile environments fabricated under the plasma conditions in high vacuum system. Especially for the development of advanced electronic devices, high quality plasma as the process conditions are required. For this purpose, the variable conductance throttle valves for controllable plasma employed to the high vacuum system. In this study, we analyzed the effects of throttle valve applications on vacuum characteristics simulated to obtain the optimum design modelling for plasma conditions of high vacuum system. We used commercial simulator of vacuum system, VacSim(multi) on this study. Reliability of simulator verified by simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve schematized as the modelling of throttle valve for the constant process-pressure of below 10-3 torr. Simulation results plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably in plasma process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.616-619
• /
• 2000

It is important to control the plasma characteristics for high quality plasma process. Recently, a novel method proposed by us, named as Enhanced-ICP, using periodic weak time-varying axial magnetic field added to a normal ICP source, has improved etch characteristics much. Variation of plasma characteristics according to the frequency of time-varying axial magnetic field have been measured and analyzed.

• Journal of Welding and Joining
• /
• v.20 no.4
• /
• pp.498-504
• /
• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.