• Steel and Composite Structures
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• v.39 no.3
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• pp.337-352
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• 2021

The study presented experimental and numerical investigation on the seismic performance of steel reinforced concrete (SRC) L-shaped column- reinforced concrete (RC) beam joints. Various parameters described as steel configuration form, axial compressive ratio, loading angle, and the existence of slab were examined through 4 planar joints and 7 spatial joints. The characteristics of the load-displacement response included the bearing capacity, ductility, story drift ratio, energy-dissipating capacity, and stiffness degradation were analyzed. The results showed that shear failure and flexural failure in the beam tip were observed for planar joints and spatial joint, respectively. And RC joint with slab failed with the plastic hinge in the slab and bottom of the beam. The results indicated that hysteretic curves of spatial joints with solid-web steel were plumper than those with hollow-web specimens. The capacity of planar joints was higher than that of space joints, while the opposite was true for energy-dissipation capacity and ductility. The high compression ratio contributed to the increase in capacity and initial stiffness of the joint. The elastic and elastic-plastic story deformation capacity of L-shaped column frame joints satisfied the code requirement. A design formula of joint shear resistance based on the superposition theory and equilibrium plasticity truss model was proposed for engineering application.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• ETRI Journal
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• v.27 no.1
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• pp.122-125
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• 2005

A polymer-based planar-lightwave-circuit-type variable optical attenuator (VOA) was fabricated using a hot embossing process. With an optimized one-step embossing process, forty micro-channels for the guidance of light were defined on a polymer thin film with an accuracy of ${\pm}0.5{\mu}m$. The fabricated polymeric thermo-optic VOA shows 30 dB attenuation with 110 mW electrical input power at $1.55{\mu}m$. The rise and fall times are less than 5 ms.

• ETRI Journal
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• v.32 no.6
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• pp.837-842
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• 2010

This paper proposes robust source localization methods for estimating the azimuth angle, elevation angle, velocity, and range using a low-complexity planar antenna array in impulsive non-Gaussian noise environments. The proposed robust source localization methods for wireless communication applications are based on nonlinear M-estimation provided from Huber and Hampel. Simulation results show the robustness performance of the proposed robust methods in impulsive non-Gaussian noise.

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.233-234
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• 2009

The theoretical study of a surface-plasmon wave at a planar metal-chiral interface is presented in this communication. It is found that a surface-plasmon wave can be excited at the planar interface of a thin metal film and a structurally dielectric chiral medium, if the exciting plane wave is P-polarized.

• Proceedings of the KIEE Conference
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• 2006.04b
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• pp.127-129
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• 2006

In this paper, a synchronous permanent magnet planar motor (SPMPM) with Halbach array is proposed for its high energy density. The magnetization and flux density distribution are obtainedby magnet scalar potential the characteristics such as inductance, back-EMF and thrust are evaluated. It can be concluded that the analysis of SPMPM with Halbach magnet array is credible and feasible.

• Journal of applied mathematics & informatics
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• v.10 no.1_2
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• pp.27-40
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• 2002

For two integers m, n with m $\leq$ n, an [m,n]-factor F in a graph G is a spanning subgraph of G with m $\leq$ d$\_$F/(v) $\leq$ n for all v ∈ V(F). In 1996, H. Enomoto et al. proved that every 3-connected Planar graph G with d$\_$G/(v) $\geq$ 4 for all v ∈ V(G) contains a [2,3]-factor. In this paper. we extend their result to all 3-connected locally finite infinite planar graphs containing no unbounded faces.

• Journal of the Korean Mathematical Society
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• v.48 no.6
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• pp.1143-1152
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• 2011

The existence of periodic solutions for the planar Hamiltonian systems with positively homogeneous Hamiltonian is discussed. The asymptotic expansion of the Poincar$\acute{e}$ map is calculated up to higher order and some sufficient conditions for the existence of periodic solutions are given in the case when the first order term of the Poincar$\acute{e}$ map is identically zero.

• Journal of applied mathematics & informatics
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• v.26 no.3_4
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• pp.511-517
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• 2008

Let G be a planar graph. It is proved that if G does not contain a k-cycle with a chord for some k ${\ni}$ {4,5,6}, then G is total-($\Delta(G)+2$)-colorable.

• Proceedings of the KIPE Conference
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• 2004.07b
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• pp.677-681
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• 2004

This paper presents the design and implementation of a low-profile power supply developed for AC-PDP application systems. In the proposed power supply, planar magnetics and SMD devices are integrated into advanced power conversion techniques to implement a low-profile power supply applicable to most AC-PDP application systems. Engineering details on the design and fabrication of planar magnetic components are presented. The performance of the prototype power supply is also demonstrated to validate the application potentials of the proposed power supply.