• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.57-64
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.1
• /
• pp.51-59
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Proceedings of the Korean Environmental Sciences Society Conference
• /
• 2005.05a
• /
• pp.241-244
• /
• 2005

The aim of this study was to determine the first outbreaks of nontoxic Gonyaulax polygramma Stein in Yeosu waters in place of harmful Cochlodinium polykrikoides Margalef, which has occurred annually in the same coastal region since 1995. The observation of cellular arrangement and structure by electron microscopy showed that G. polygramma isolated from Yeosu waters had a few spines connecting with mem-branes and prominent longitudinal ridges on the cell surface, with a cingular dis-placement 1.5 times their cell width. Furthermore, the location of the nucleus wasposterior of large oval formation according to electron microscopy. On 6 August, 2004,the first bloom of G. pozygramma occurred, the date of own its disappearance was with a maximum cell density of 8,000 cells ml$^{-1}$ on 21 August, 2004. During the period of this study, the horizontal distribution of sea water temperature and salinity showed a strong coastal front, whereas the front of DIN (Dissolved Inoganic Nitrogen) was significantly different between the occurrence and disappearance of G. polygramma blooms. These results suggested that the process of the breakdown of stratification by wind and a low level of inorganic nitrogen play important roles in the rapid growth of G. polygrmma, which is associated with a greater robustness in growth against DIN than that of C.polykrikoides in nature.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.17 no.4
• /
• pp.364-369
• /
• 2005

An experimental study was conducted on the thermal conductivity of various grouting materials for geothermal heat exchanger which is used as a heat sink or source in the heat pump system. The grouting of the vertical heat exchanger is important for environmental and heat transfer reasons and is generally accomplished by the placement of a low permeability material into the annular space between the borehole wall and the pipes suspended in the borehole. In this study, a lab scale test apparatus was made and measured the thermal conductivity of four grouting materials. As a result, the temperature rising tendency was similar among them, but the increasing rate was different. Thus the thermal conductivity showed a maximum difference of $27\%$ among grouting materials.

• International Journal of High-Rise Buildings
• /
• v.2 no.4
• /
• pp.293-314
• /
• 2013

Double-Skin Façade (DSF), which is a kind of passive indoor environmental control technique, is effective way to control environmental loads while maintaining the transparency especially in perimeter zone and hence the adoption example of DSF keep increasing recently. The objective of this study was to perform a field survey of air quality environment with natural ventilation through DSF and thermal environment within office building with six stories during a mild climate period in Japan. Moreover, to understand the comprehensive environmental performance of the target building, questionnaire survey was conducted to subjectively evaluate the productivity and satisfaction with the environmental factors in office space. In this field measurement, there was a positive correlation between the DSF internal ventilation flow and the amount of solar radiation on the DSF normal surface; the primary driving force for ventilation in the DSF was considered to be the buoyancy force caused by solar radiation. The results of questionnaire survey with regard to productivity level indicated the need for improvement in the thermal (temperature) and spatial environment (room size and furniture placement).

• Journal of the Korea Concrete Institute
• /
• v.11 no.6
• /
• pp.3-12
• /
• 1999

The larger, loftier and more highly strengthened the recent structures become, the greater attention is paid to the problem of thermal crack occurrence associate with hydration heat. As one of methods to solve the problem, a care has been taken to the improvement of construction such as the application of pre-cooling or pipe-cooling, adjustment of concrete block size, concrete placement timing, joint arrangement and so on. But it is expected that a proper selection of cement shall additionally contribute to the control of thermal cracks. In this study, thus, we selected 4 types of cements such as Type V for anti-sulphate, blast furnace cements (slag content of 45% and 65% respectively)and ternary blended low heat cement, and carried out mock-up tests. In every assigned time, temperatures and thermal stresses were measured and calculated from raw data. As a result of measurement, it was found that the magnitude of hydration heat is in order of blast furnace slag cement. Type V and ternary blended low heat cement. Results of thermal stresses were same as the order of temperature. In addition, thermal stresses calculated from the data of strain gauges showed almost similar to those measured from effective stress gauges only when strain values were adjusted properly in accordance with initial time of stress appearance. Theoretical results agreed well with the measured values comparatively, but showed slight differences. It is inferred that these differences shall be reduced if more tests capable of evaluating thermal characteristics of concrete are carried out.

• International Journal of Highway Engineering
• /
• v.7 no.1 s.23
• /
• pp.31-38
• /
• 2005

Concrete has higher vapor pressure than its surrounding ambient air immediately after placement. Moisture at concrete surface evaporates to the ambient air to adjust equilibrium of the vapor pressure between them. The moisture inside the concrete moves to the surface because the evaporation at the surface causes gradient of vapor pressure inside the concrete. Plastic cracking, degree of hydration, strength development, and others caused by velocity of the moisture movement significantly influences quality of concrete. In this paper, the moisture diffusivity of early-age concrete was back-calculated using governing equation of the moisture diffusion, and temperature and relative humidity of concrete measured in a laboratory. The moisture diffusivity of the concrete was modeled using the back-calculated moisture diffusivity. The relative humidity of the concrete calculated by finite element method (FEM) using the modeled moisture diffusivity as Input data coincided with the measured relative humidity well.

• Journal of the Korean Society of Safety
• /
• v.30 no.3
• /
• pp.59-66
• /
• 2015

The undesirable effects of elevated external temperatures at placement on the properties of the fresh and hardened concrete are discussed briefly, and the possible use of the mineral admixtures to mitigate them and the association with water-reducing and retarding admixtures in terms of the mix design which are critical for minimizing slump loss and entrained air loss are examined in this study. To investigate the effects of such the mineral and chemical admixtures on the fresh and hardened properties of concrete exposed to high temperature, a series of concrete mixtures subjected to the high temperature were carried out and then fresh and hardened properties of the mixtures were analyzed and evaluated. Based on the results, new guide lines concerning the appropriate admixtures for hot weather are suggested.

• International Journal of Highway Engineering
• /
• v.13 no.1
• /
• pp.177-183
• /
• 2011

VES-LMC(very-early strength latex modified concrete) has been widely used as repair material for bridge deck overlay or rehabilitation, because it could be opened to the traffic after 3 hours of curing. However, the bright color of VES-LMC disturb driver's sigh. A black VES-LMC, matching to asphalt concrete, was developed and applied at a filed for driver's comfort and safety. The black VES-LMC included 2% carbon black in cement weight ratio. A series of performance evaluation for black VES-LMC was done in terms of field applicability, pavement color and temperature change. The field applicability test result showed that there were no change of workability, slump and air void, and the compressive strengthen developed more than 20MPa after 4 hours of placement. The thermal stress of black VES-LMC was smaller than that of OPC and asphalt concrete, which means the stability of black VES-LMC. The performance evaluation result showed that the black VES-LMC could prevent road icing at below zero temperatures and promote thawing at melting temperature.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2008.11a
• /
• pp.517-520
• /
• 2008

Gravity dam use self weight to stand external force like hydraulic pressure. In general, gravity dam concrete is divided into internal and external concrete. Seongdeok dam is gravity dam which is being constructed in Cheongsong-gun, Gyeonsangbuk-do. And upstream cofferdam was constructed to examine the temperature crack due to hydration heat and to decide the height of placement. In this study, we examined the mix design of internal/external concrete and physical properties(compressive strength, adiabatic temperature rise). And we also performed laboratory tests to verify exothermic properties. Lastly, we measured the hydration heat and thermal stress of upstream cofferdam.