• Title/Summary/Keyword: Pin-driver

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Communication Method for Torque Control of Commercial Diesel Engine in Range-Extended Electric Trash Truck (주행거리 연장형 청소용 전기자동차에 장착된 상용 디젤엔진의 토크제어를 위한 통신 방안)

  • Park, Young-Kug
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.7
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    • pp.1-8
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    • 2018
  • This paper describes new communication methods for transmitting torque commands between the vehicle controller that determines the amount of power generation in a range-extended electric vehicle and the engine controller that performs it. Generally, vehicles use CAN communication, but in this case, the hardware and software of the existing engine controller must be modified. For this reason, it is not easy to apply CAN communication to small and medium sized automotive reorganize companies. Therefore, this research presents a pin-pin communication method for applying the existing mass produced engine controller to range-extended electric vehicles. The pin-pin communication method converts the driver's demand torque control map inside an mass produced engine controller into a virtual accelerator opening position according to the target speed and target torque of the engine, and converts this to a voltage signal for the existing mass produced engine controller to recognize it. The virtual accelerator opening positions are mounted in the form of a control map in the vehicle controller through the reverse conversion process in an offline environment and are determined by the engine generating power requirements and engine optimal operating point algorithm. These algorithms and signal conversion circuits for engine torque transmission have been mounted on the vehicle controller to conduct the virtual accelerator opening position conversion process according to the engine target torque and to establish the virtual accelerator voltage signal using the signal converter.

Study of Examples for Air Bag Non-deployment Including Rear Collision and Failure Phenomenon by Damage of Control Parts in Vehicle Air Bag (자동차 에어백의 제어부품 불량에 의한 고장현상 및 후방 추돌에 관련된 에어백 미전개에 대한 사례 연구)

  • Lee, Il Kwon;Kim, Young Gyu;Moon, Hak Hook
    • Journal of the Korean Institute of Gas
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    • v.16 no.6
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    • pp.102-106
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    • 2012
  • The purpose of this paper is to study the failure cases in relation to system of Air Bag in vehicle happened in the field. In the first example, it was separated the soldering parts connected the wire pin between air bag module and clock spring of air bag. Whenever the pin shake by the car's vibration, the driver verified the malfunction phenomenon appeared air bag warning lamp on instrument panel in front of driver's seat. in car inside room. The second example, it verified the warning lamp lighting phenomenon of air bag by produced the circuit plate non-contacting of single an element in air bag electronic control unit. The third example, it verified the light of air bag warning indicator lamp by separated with soldering parts connecting inner pin and resistance terminal of seat belt pretensioner using passenger seat. The fourth example, when the passenger car crash a back of truck, the former bumper get jammed under the latter as the roof height of car low less than that. Therefore, the impact of Car's collision verified that don't transfer with body frame of vehicle because of no attachment impact sensor in it.

Design Procedure for System in Package (SIP) Business

  • Kwon, Heung-Kyu
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.109-119
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    • 2003
  • o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

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A Study of Wireless LAN Communication using Embedded System (임베디드 시스템을 이용한 무선랜 통신에 관한 연구)

  • Lee, Chang-Keun;Choi, Jae-Woo;Ro, Bang-Hyun;Hwang, Hee-Yeung
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.673-676
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    • 2003
  • In this paper, we designed the embedded system used for wireless LAN communication. Embedded system kernel is made from general linux kernel 2.4.18 by applying the ARM patch (2.4.18-rmk7) and the SA1100 patch(2.4.18-rmk7), then porting board level suitable to target system. The SA-1110 PCMCIA interface provides controls for one PCMCIA card slot with a PSKTSEL pin for support of a second slot. The embedded system requires external logic to complete the PCMCIA socket interface. For dual-voltage support, level shifting buffers are required for all SA-1110 input signals. Hot insertion capability requires that each socket be electrically isolated from each other, and from the remainder of the memory system. embedded system is for socket services approaching PCMCIA socket, detecting number of sockets, sensing insertion and removal, and applying power. It also provides interface with Card services. Embedded system supports Host driver for lucent chips that is installed orinoco driver cross compiled. The meaning can say that is doing wireless LAN communication through wireless LAN in imbedded system.

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The Friction and Wear Characteristics of the Seat Recliner Parts Based on Lubricant Characteristics (윤활제 특성에 따른 시트 리클라이너 부품의 마찰 및 마모 특성)

  • Hong, Seok-June;Lee, Kwang-Hee;Lim, Hyun-Woo;Kim, Jae-Woong;Lee, Chul-Hee
    • Tribology and Lubricants
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    • v.35 no.3
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    • pp.183-189
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    • 2019
  • The driver seat of an automobile is in direct contact with the driver and provides the driver with a safe and comfortable ride. The seat consists of a frame, a rail, and many recliners. In recent years, strength and operating force measurement testing of the recliner have become vital for designing car seats. However, performance evaluation requires expensive testing equipment, numerous seat products, and considerable time. Therefore, the trend is to reduce experimentation through interpretation. This study examines the lubrication of solid lubricant for automotive seat recliners and confirms the friction and wear performance. In this study, the lubrication behavior of solid lubricants for car seat recliners is investigated to ascertain the friction and wear performance and to provide accurate values for the strength analysis. The friction material consists of a pin and a plate made from steel, which is widely used in recliners. The friction and wear under lubrication conditions are measured by a reciprocating friction wear tester. The friction coefficient is obtained according to the load and speed. Based on the obtained results, it is possible to achieve a reduction in the error of the test value and the analysis by providing the friction coefficient and wear of the lubricant. The results can be applied to the analysis of automobile seat design.

Analytic Map Algorithms of DDI Chip Test Data (DDI 칩 테스트 데이터 분석용 맵 알고리즘)

  • Hwang Kum-Ju;Cho Tae-Won
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.1 s.14
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    • pp.5-11
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    • 2006
  • One of the most important is to insure that a new circuit design is qualified far release before it is scheduled for manufacturing, test, assembly and delivery. Due to various causes, there happens to be a low yield in the wafer process. Wafer test is a critical process in analyzing the chip characteristics in the EDS(electric die sorting) using analytic tools -wafer map, wafer summary and datalog. In this paper, we propose new analytic map algorithms for DDI chip test data. Using the proposed analytic map algorithms, we expect to improve the yield, quality and analysis time.

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3-Element Quasi-Yagi Antenna with a Modified Balun for DTV Reception (변형된 밸런을 갖는 DTV 수신용 3소자 준-야기 안테나)

  • Lee, Jong-Ig;Yeo, Junho
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.21 no.4
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    • pp.672-678
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    • 2017
  • In this paper, we studied a design method for a broadband quasi-Yagi antenna (QYA) for terrestrial digital television (DTV) reception. The proposed antenna is composed of a dipole driver, a rectangular patch type director close to the dipole, and a ground reflector printed on an FR4 substrate. A balun between a microstrip line and a coplanar strip (CPS) line is a rectangular patch inserted along the center of the CPS. The end of the balun is connected to the CPS line through a shorting pin. An antenna, as an design example for the proposed antenna, is designed for the operation in the frequency band of 470-806 MHz for terrestrial DTV, and the characteristics of the designed antenna are examined. The antenna has a good performance such as a frequency band of 430-842 MHz for a voltage standing wave ratio < 2, a gain > 3.7 dBi, and a front-to-back ratio > 7.4 dB.

The robust design of Ball-Stop part for power shift for vehicle with more heaver than 5 ton by using DFSS (DFSS 를 적용한 5 톤 이상 상용차용 변속배력장치의 BALL-STOP 구조부 강건설계)

  • Chung W.J.;Jung D.W.;Song T.J.;Cho Y.D.;Yoon C.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1664-1667
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    • 2005
  • The main function of Ball-Stop part is to operate power shift for vehicle with more than 5 ton when a driver changes gear using suitable force. This paper presents the implementation of a DFSS(Design For Six Sigma) for robust design of Ball-Stop part of power shift. The factors influencing Ball-Stop part performance is derived to find control factor. Based on this factor, contact force between head and detent pin analysis is performed to get optimal factor is analyzed and compared with contact force test result to verify reliability of design. This makes clear the reason why the proposed one is necessary and the role of DFSS.

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Study on a Novel Feeding Method for Broadband Yagi Antenna for DTV (DTV용 광대역 야기 안테나 새로운 급전방법 연구)

  • Lee, Jong-Ig;Park, Jin-Taek;Yeo, Junho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.05a
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    • pp.475-476
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    • 2015
  • In this paper, we introduce a novel feeding method for a broadband planar quasi-Yagi antenna (QYA) for terrestrial digital television (DTV) receiving. The balun between the balanced coplanar strip (CPS) line feeding the driver dipole and the unblanaced microstrip line is a rectangular patch inserted into the CPS line along the center of the CPS. The end of the balun is connected to the CPS line through a shorting pin. The effects of various geometrical parameters and balun on the antenna characteristics are examined. An antenna, as an design example for the proposed antenna, is designed for the operation in the frequency band of 470-806 MHz for terrestrial DTV.

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A 3.1 to 5 GHz CMOS Transceiver for DS-UWB Systems

  • Park, Bong-Hyuk;Lee, Kyung-Ai;Hong, Song-Cheol;Choi, Sang-Sung
    • ETRI Journal
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    • v.29 no.4
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    • pp.421-429
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    • 2007
  • This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

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