• Journal of Korea Foresty Energy
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• v.18 no.2
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• pp.84-91
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• 1999

The objective of this study was to present creep and the effects of mechano-sorptive deflection of drift pin moment resisting joint between LVL members under changing relative humidity (RH) conditions. The LVL members with steel gusset were jointed by a square pattern of eight injected drift pin. Three diameter drift pins were used to test specimens (6mm, 10mm, and 16mm). The creep test was conducted under two constant loading conditions : one at 30 kgf(840 kgf-cm) and the other at 60 kgf(1680 kgf-cm). The experiment was conducted in an open shed outside. (1)The total rotation creep model of moment resisting joing can be expressed as the sum of the creep of controlled environment (3-parameter model), dimensional change and mechano-sorptive deflection resulting from the variable environment. (2)Mechanosorptive rotation creep is recoverable as moisture content increases during adsorption. Least squares method for linear regression analysis was performed using mechano-sorptive rotation creep as the dependent variable and moisture content as the independent variable. The slope of low moment specimens are compared with those of high moment. This means that low moment condition is more easily affected by changes in humidity than high moment conditions. (3)Although creep deflection is higher for small diameter drift pin than for large diameter drift pin, the shape of creep deflection curves for all specimens is similar.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.955-962
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• 2005

Power efficiency, lifetime and stable manufacturing processes are the crucial parameters for the success of organic light emitting diodes (OLEDs) in display and lighting applications. Highest power efficiencies of PIN-OLEDs for all principal colours and for bottom and top emission OLED structures have been demonstrated. The PIN structure, which means the incorporation of intentionally doped charge carrier transport layer in a suitable OLED layer setup, lowers the operating voltage to achieve highest power efficiencies. Up to now the n-doping of the electron transport layer has been done by alkali metal co-deposition. This has main draw-backs in terms of manufacturability, since the handling of large amounts of pure Cs is a basic issue in production lines. Here we present in detail results on PIN-OLEDs comprising a newly developed molecular n-dopant. All the previous OLED performance data based on PIN-OLEDs with alkali metal doping could be reproduced and will be further improved in the future. Hence, for the first time, a full manufacturing compatible PIN-OLED is available.

• Proceedings of the KIEE Conference
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• 2002.04a
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• pp.96-98
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• 2002

This paper proposes the digital pin line checker which can extremely improve the efficiency of the pine line checking using a micro processor. The line checker is designed which can check efficiently up to maximum 2048 pin. Alarm busser is designed ringing real-timely the case that the pin line is connected differently with real node number. Accordingly the comparing and identifying work visually the node number showing on the displaying board with real node number is avoided after the electronic stimulus enforce to the pin of the fixture by the test engineer. The digital line checker is designed based on the 8051. And the effectiveness and accuracy of the proposed line checking strategy is tested by simulating the several error connections for pin lines on the small scale board.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.44-51
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• 2017

In the present study, AA 5083-O plates are joined by friction stir welding technique. A universal milling machine was used to perform the welding process of the work-pieces which were fixed on the proper position by a vice. The joints were friction stir welded by two tools with different pin profiles; cylindrical threaded pin and tapered smooth one at different rotational speed values; 400 rpm and 630 rpm, and different welding speed values; 100 mm/min and 160 mm/min. During FSW of each joint, the temperature was measured by infra-red thermal image camera. The welded joints were inspected by visually as well as by the macro- and microstructure evolutions. Furthermore, the joints were tested for measuring the hardness and the tensile strength to study the effect of changing the FSW parameters on the mechanical properties. The results show that increasing the rotational speed results in increasing the peak temperature, while increasing the welding speed results in decreasing the peak temperature for the same tool pin profile. Defect free welds were obtained at lower rotational speed by the threaded tool profile. Moreover, the threaded tool pin profile gives superior mechanical properties at lower rotational speed.

• International Journal of Internet, Broadcasting and Communication
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• v.14 no.4
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• pp.198-205
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• 2022

Along with a variety of coding education, physical computing education for controlling various sensors is being actively conducted for elementary, middle, and high school students in line with the era of the fourth industrial revolution. A problem with physical computing education using Arduino is pin connection errors between Arduino and various sensors. Most of the students who come into contact with the Arduino for the first time often do not know the purpose of the Arduino pin and the connection position of the pin. Also, hardware built with incorrect pin connections to the Arduino board often does not work properly. If this case continues, students will lose interest in coding education. Therefore, in this paper, we implemented an augmented reality application that informs the connection process of the Arduino board and the sensor during physical computing coding education using Arduino, and designed and implemented educational content for the Arduino pin position and connection process. First, we explain the role of the Arduino board and the sensor and the location of the pins. After that, the students run the educational augmented reality educational content using their smartphones and check the correct pin connection process between the Arduino and the sensor. In the physical computing education, augmented reality content is used to increase the understanding and immersion of the class. It is expected that the educational effect will also increase by inducing fun and interest in physical computing coding education.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.6
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• pp.625-629
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• 2003

Low loss and high power MMIC limiters with GaAs PM diode were designed and fabricated. The new epitaxial structure of GaAs PIN diode was proposed in order to increase the high power capability. 2 types of limiter circuits have been designed and the limiting powers have been measured. Results indicated that the limiting power was depended on the circuit topology. Limiting power levels of 2-stage limiters are measured 16 ㏈m and 22 ㏈m at 14 ㎓, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.2
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• pp.199-204
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• 2017

In this study, analytical methods for designing a torque arm pin and elastomeric bushings of a conventional-type three-point-suspension gearbox of a wind turbine are investigated. The design loads for the torque arm were derived by considering the effects of the transmitted torque and self-weight of the gearbox. Based on the design loads, design methods for the torque arm pin and elastomeric bushings were introduced in the terms of material and size selection. Finally, a small-scale conventional-type gearbox was designed by applying the derived design methods. This study is an elementary and analytical study for the design of the torque arm pin and elastomeric bushings. It is necessary to verify and supplement the results further through extensive experimentation.

• Nuclear Engineering and Technology
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• v.49 no.6
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• pp.1339-1345
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• 2017

In the framework of the EU funded project NURESAFE, the subchannel code CTF and the neutronics code DYN3D were integrated and coupled on the NURESIM platform. The developments achieved during this 3-year project include assembly-level and pin-by-pin multiphysics thermal hydraulics/neutron kinetics coupling. In order to test this coupling, a PWR rod ejection transient was simulated on a MOX/UOX minicore. The transient is simulated using two different models of the minicore. In the first simulation, both codes model the core with an assembly-wise resolution. In the second simulation, a pin-by-pin fuel-centered model is used in CTF for the central assembly, and a pin power reconstruction method is applied in DYN3D. The analysis shows the influence of the different models on global parameters, such as the power and the average fuel temperature, but also on local parameters such as the maximum fuel temperature.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Clinics in Shoulder and Elbow
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• v.8 no.2
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• pp.105-109
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• 2005

Purpose: To Analyze the exit site of pin inserted at the anterior glenoid rim in the reconstruction of the Bankart lesion and SLAP lesion using transglenoid suture technique. Materials and Methods: In the twenty adult right cadeveric scapula, insertions of pin were performed using guide at the position of 1, 2, 3 O'clock of glenoid rim. We measured the exit site of dorsal surface of the scapula by medial distance from sagittal plane of lateral border of scapular spine and the vertical distance from posterior border of the scapular spine. Results: When the pin was inserted caudally within 10 degree, at the position of 1, 2, 3 O'clock, the medial distance from lateral border of the scapula is averaged 29.4, 19.2, 34.0 mm respectively and the vertical distance from posterior border of the scapular spine is averaged 15.0, 18.6, 17.2 mm respectively. When the pin was inserted caudally within 20-30 degree, the medial distance is averaged 14.6, 14.2, 15.8 mm respectively and the vertical distance is averaged 31.6, 31.9, 32.1 mm respectively. Conclusion: When the pin was inserted caudally within ten degrees using the guide, the pin exit appeared at the more medial side of the base of scapular spine and the more inferior of scapular spine. This can make the firm suture tied over scapular spine during repair SLAP and the Bankart lesion, and also prevent the injury of suprascapular nerve.