• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.186-189
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• 2004

Sensor used by semiconductor process produced an MAP sensor and applied to several industry. Among those sensors divided as transducer which convert physical quantity into electrical value, piezoresistive type sensor has been studied for the properties and sensitivity of piezoresistor. In this paper, the variation of seismic mass which have been functioned as actuator moving the cantilever beam analyzed the effect on distribution of resistance change ratio and supposed the optimal shape and position of piezoresistor. The resulting are following; According to the increment of seismic mass size, the value of resistance change ratio decreased caused by improve the stiffness. Y directional piezoresistor is formed in spot of 100 m apart from cantilever edge and length of that is 800$\mu$m. To increase the sensitivity, piezoresistor is made as n-type and x-direction.

• 센서학회지
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• 제20권6호
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• pp.393-399
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• 2011

In this paper, we designed and fabricated the novel air flow sensor using air drag force, which can be applied to the low air flow detection. To measure the low air flow, we should enlarge the air drag force and the output signal at the given air flow. The paddle structure is applied to the device, and the device is vertically located against the air flow to magnify the air drag force. We also adapt the corrugation structure to improve the output signals on the given air velocity. The device structure is made up of the silicon nitride layer and the output signal is measured with the piezoresistive layer. The output signals from the corrugated device show the better measurement sensitivity and the response time than that of flat one. The repeated measurement also shows the stabilized signals.

• 센서학회지
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• 제19권2호
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• pp.137-141
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• 2010

In this paper, we fabricated silicon piezoresistive pressure sensor with dry etching technology which used Deep-RIE and etching delay technology which used SOI(silicon-on-insulator) wafer. We improved pressure sensor offset and its temperature dependence by removing oxidation layer of SOI wafer which was used for dry etching delay layer. Sensitivity of the fabricated pressure sensor was about 0.56 mV/V${\cdot}$kPa at 10 kPa full-scale, and nonlinearity of the fabricated pressure sensor was less than 2 %F.S. The zero off-set change rate was less than 0.6 %F.S.

• 센서학회지
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• 제15권1호
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• pp.7-12
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• 2006

The multi-functional one-chip sensor has been fabricated to reduce output variation under various water environment. There were a temperature sensor, a piezoresistive type pressure sensor, and a electrode type conductivity sensor in the fabricated one-chip sensor. This sensor was measured water depth in the range of $0{\sim}180cm$, temperature in the range of $0{\sim}50^{\circ}C$, and salinity in the range of 0 $0wt%{\sim}5wt%$, respectively. Since the change of water depth in solution environment depends on various factors such as salinity, latitude, temperature, and atmospheric pressure, the water depth sensor is needed to be compensated. We tried to compensate the salinity and temperature dependence for the pressure in water by using lookup-table method.

• 센서학회지
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• 제22권5호
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• pp.321-326
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• 2013

In this paper, the usability of a compact silicon strain gauge load cell in a weighting disdrometer for measuring the impact load of a falling raindrop is introduced for application in a multi-meteorological sensor. The silicon strain gauge load cell is based on the piezoresistive effect, which has a high linearity output from the momentum of the raindrop and the simplicity of signal processing. The weighting disdrometer shows a high sensitivity of 7.8 mV/g in static load measurement when the diaphragm thickness of the load cell is $250{\mu}m$.

• 전자공학회논문지D
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• 제36D권7호
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• pp.26-33
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• 1999

4빔 브릿지형 압저항형 실리콘 가속도 센서에서 빔의 위치가 가속도 센서의 특성에 어떤 영향을 주는지 조사하기 위해서 빔의 위치가 서로 다른 3가지 형태의 가속도 센서를 FEM(finite element method)을 사용하여 해석하고, SDB(silicon direct bonding) 웨이퍼를 사용하여 RIE(reactive ion etching)와 KOH(potassium hydroxide) 애칭 공정으로 제조하였다. 세가지 형태의 가속도 센서에 대한 FEM 해석 경과, 첫 번째 공진 주파수와 Z축 감도는 세구조 모두 같게 나타났으나, 두 번째와 세 번째의 공진 주파수 및 X, Y축의 감도는 다른 것으로 나타났다. 제조된 가속도 센서의 특성을 살펴볼 때, 세 가지 형태의 센서는 비록 첫 번째 공진 주파수와 Z축 감도가 정확하게 일치하지는 않았지만, 첫 번째 공진 주파수는 1.3 ~ 1.7 KHz, Z축 감도는 5 V 인가시 180 ~ 220 lN/G, 타축감도는 1.7 ~ 2 %를 가지는 것으론 나타났다.

• ETRI Journal
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• 제38권4호
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• pp.685-694
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• 2016

A surface micromachined piezoresistive pressure sensor with a novel internal substrate vacuum cavity was developed. The proposed internal substrate vacuum cavity is formed by selectively etching the silicon substrate under the sensing diaphragm. For the proposed cavity, a new fabrication process including a cavity side-wall formation, dry isotropic cavity etching, and cavity vacuum sealing was developed that is fully CMOS-compatible, low in cost, and reliable. The sensitivity of the fabricated pressure sensors is 2.80 mV/V/bar and 3.46 mV/V/bar for a rectangular and circular diaphragm, respectively, and the linearity is 0.39% and 0.16% for these two diaphragms. The temperature coefficient of the resistances of the polysilicon piezoresistor is 0.003% to 0.005% per degree of Celsius according to the sensor design. The temperature coefficient of the offset voltage at 1 atm is 0.0019 mV and 0.0051 mV per degree of Celsius for a rectangular and circular diaphragm, respectively. The measurement results demonstrate the feasibility of the proposed pressure sensor as a highly sensitive circuit-integrated pressure sensor.

• 대한기계학회논문집B
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• 제27권7호
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• pp.948-955
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• 2003

Pressure coefficient in rotating discharge hole was measured to gain insight into the influence of rotation to the discharge characteristics of rotating discharge hole. Pressure measurements were done by the telemetry system that had been developed by the authors. The telemetry system measures static pressure using piezoresistive pressure sensors. Pressure coefficients in rotating discharge hole were measured in longitudinal direction and circumferential direction with various rotating speed and 3 pressure ratios. From the results, the pressure coefficient, and therefore the discharge coefficient, is known to decrease with the increase of Ro number owing to the increase of flow approaching angle to the discharge hole inlet. However, there exists critical Ro number where the decrease rate of discharge coefficient with the increase of Ro number changes abruptly; flow separation occurs from the discharge hole exit at this critical Ro number. Critical Ro number increases with the increase of length-to-diameter ratio, but the increase is small where the length-to-diameter ratio is higher than 3. The decrease rate of discharge coefficient with the increase of Ro number depends on the pressure recovery at the discharge hole, and the rate is different from each length-to-diameter ratio; it has tendency that the short discharge hole shows higher decrease rate of discharge coefficient.

• 센서학회지
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• 제11권3호
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• pp.138-144
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• 2002

스테인레스 봉입형 압력센서를 제작하기 위하여 먼저 반도체 제조 및 식각 공정을 통하여 반도체 압력센서를 제작하였다 그리고 이를 glass molding된 스테인레스 housing에 올려놓고 $50\;{\mu}m$ 두께의 스테인레스 박판을 용접한 후 실리콘 오일을 채워 넣고 봉입하여 압력 범위 10 bar 센서를 완성하였다. 이와 같이 제작한 센서와 XTR105 발신기 전용 회로를 결합하여 $4{\sim}20\;mA$ 출력의 압력 발신기를 제작하고 그 특성을 조사하였다. 온도 보상 전 정확도는 ${\pm}5%$ FS이었으나 보상 후 정확도 ${\pm}1%$ FS로 개선되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.573-576
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromium nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5∼25 %)Na$_2$). The deposited CrN thin-films with thickness of 3577${\AA}$ and annealing conditions(300$^{\circ}C$, 48 hr) in Ar-10 % N$_2$deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho$=1147.65 ${\mu}$$\Omega$cm, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.