• Title/Summary/Keyword: Piezo devices

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Removal of Flooding in a PEM Fuel Cell at Cathode by Flexural Wave (Flexural wave를 이용한 고분자 전해질 연료전지 공기극 내에서의 플러딩 제거)

  • Kim, Kyoung-Rock;Han, Seong-Ho;Ahn, Deuk-Kuen;Choi, Young-Don
    • Transactions of the Korean hydrogen and new energy society
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    • v.21 no.1
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    • pp.35-41
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    • 2010
  • Water management is an important issue of PEM fuel cell operation. Water is the product of the electrochemical reactions inside fuel cell. If liquid water accumulation becomes excessive in a fuel cell, water columns will clog the gas flow channel. This condition is referred to as flooding. A number of researchers have examined the water removal methods in order to improve the performance. In this paper, a new water removal method that investigates the use of vibro-acoutic methods is presented. Piezo-actuators which are devices to generate the flexural wave are attached at the end of a cathode bipolar plate. Flexural wave is used to impart energy to resting droplets and thus cause movement of the droplets in the direction of the traveling wave.

Deposition and characterization of ZnO thin films for piezo-electric devices (압전 소자용 ZnO 박막의 증착 및 물성 분석)

  • Lee, Jin-Bock;Kim, Kwi-Hyun;Shin, Yang-Ho;Seo, Soo-Hyung;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.959-961
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    • 1999
  • ZnO thin films are deposited by using an RF magnetron sputtering system. Structural and electrical properties are analyzed as a function of deposition conditions, such as RF power, Ar/($Ar+O_2$) ratio, and substrate temperature. The c-axial growth of ZnO is observed to be preferable to the $SiO_2$/Si substrate, rather than the Si substrate. By adding the oxygen gas during deposition, the electrical resistivity of films is increased, but the c-axial growth is inhibited. A pizoelectric resonator of Al/ZnO/Al is also fabricated to estimate the electric-mechanical coupling coefficient($k^2$) of ZnO film. The value of $k^2$ obtained from our work is about 10.14 %.

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Design and Development of Micro Combustor (I) - Combustion Characteristics in Scale-Downed Combustor - (미세 연소기 개발(I) - 소형 연소기 환경에서의 연소 특성 -)

  • Lee, Dae-Hun;Choe, Gwon-Hyeong;Gwon, Se-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.1
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    • pp.74-81
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    • 2002
  • Combustion phenomena in a sub-millimeter scale combustor have been investigated. To evaluate scale effect on flame propagation characteristics, a cylindrical combustion chamber with variable depth was built in-house. The combustor was charged with premixed gas of hydrogen and air and ignited electronically. A piezo electric pressure transducer recorded transient pressure after the ignition. Measurements were made at different test conditions specified with chamber depth and initial pressure as parameters. Visual observation was made through a quartz glass window on top side of the combustion chamber using high speed digital video camera. From the pressure data, available work was estimated and compared with energy input required for stable ignition. The preliminary results suggested that the net thermal energy release is sufficient to generate power and enables a combustor of the size in the present study to be used as the energy source of a micro power devices .

Fabrication of Three-Dimensional Micro Optical and Fluidic System Using Dual Stage Nanostereolithography Process (이중 스테이지를 이용한 대면적 3차원 광/유체 마이크로 디바이스 제작에 관한 연구)

  • Lim, Tae Woo;Yang, Dong-Yol
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.10
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    • pp.552-557
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    • 2015
  • The nanostereolithography process using a femtosecond laser has been shown to have strong merits for the direct fabrication of 2D/3D micro structures. In addition, a femtosecond laser provides efficient tools for precise micromachining owing to the advantages of a small and feeble heat effect zone. In this paper, we report an effective fabrication process of 3D micro optical and fluidic devices using nanostereolithography process composed of a dual stage system. Process conditions for additive and subtractive fabrication are examined. The Piezo stage scanning system is used for 3D micro-fabrication in unit area of sub-mm scale, and the motor stage is employed in fabrication on the scale of several mm. The misalignment between the pizeo- and motor- stages is revised through rotational transformation of CAD data in the unit domain. Here, the effectiveness of the proposed process is demonstrated through examples using 3D optical and microfluidic structures.

Micro-positioning of a Smart Structure Using an Enhanced Stick-slip Model (향상된 스틱-슬립 마찰 모델을 이용한 스마트 구조물의 마이크로 위치제어)

  • Lee, Chul-Hee;Jang, Min-Gyu;Choi, Seung-Bok
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.18 no.11
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    • pp.1134-1142
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    • 2008
  • In this paper, a model-based stick-slip compensation for the micro-positioning is proposed using an enhanced stick-slip model based on statistical rough surface contact model. The smart structure is comprised with PZT(lead (Pb) zirconia(Zr) Titanate(Ti)) based stack actuator incorporating with the PID(proportional-integral-derivative) control algorithm, mechanical displacement amplifier and positioning devices. For the stick-slip compensation, the elastic-plastic static friction model is used considering the elastic-plastic asperity contact in the rough surfaces statistically. Mathematical model of system for the positioning apparatus was derived from the dynamic behaviors of structural parts. PID feedback control algorithms with the developed stick-slip model as well as feedforward friction compensator are formulated for achieving the accurate positioning performance. Experimental results are provided to show the performances of friction control using the developed positioning apparatus.

Upper Wafer Handling Module Design and Control for Wafer Hybrid Bonding (Wafer Hybrid Bonding을 위한 Upper Wafer Handling 모듈 설계 및 제어)

  • Kim, Tae Ho;Mun, Jea Wook;Choi, Young Man;An, Dahoon;Lee, Hak-Jun
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.142-147
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    • 2022
  • After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

Multi-functional (Temperature, Pressure, Humidity) Sensor by MEMS technology (MEMS 기술을 이용한 온도, 압력, 습도 복합 센서)

  • Kwon Sang-wook;Won Jong-Hwa
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.11
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    • pp.1-8
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    • 2005
  • In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

Implant placement in severely atrophic mandible using alveolar ridge splitting procedure and small block bone graft: A case report of 4-year follow-up (심하게 위축된 하악 구치부에 치조제 분할술과 블록형 골이식술을 이용한 임플란트 식립: 4년 관찰 증례보고)

  • Kim, Na-Hong;Bang, Joo-Hyuk;Lee, Dong-Woon
    • Journal of the Korean Academy of Esthetic Dentistry
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    • v.28 no.2
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    • pp.64-73
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    • 2019
  • Various techniques have been developed, and the development of piezo electric devices have made it possible to widen the alveolar ridge even if the residual bone is dense or if there is a lack of cancellous bone between the cortical bones. In the operation of the mandibular posterior area, the flap is easily accessible to the ramus bone, from which high quality autogenous bone can be obtained, compared to other parts. A small autologous bone block can be used with particulated bone graft material using one screw for bone regeneration instead of a large autologous bone with two screws. The tapered implant design can minimize buccal bone fracture, even in severely atrophic mandibular areas. We report a case of 4 years following implant placement with ridge splitting and small autogenous bone graft in severly atrophic mandible. This report demonstrates a case of functional and aesthetic restoration in a patient through a collaboration.

A Development of P-EH(Practical Energy Harvester) Platform for Non-Linear Energy Harvesting Environment in Wearable Device (비연속적 에너지 발전 환경을 고려한 웨어러블 기반 P-EH 플랫폼 개발)

  • Park, Hyun-Moon;Kim, Byung-Soo;Kim, Dong-Sun
    • The Journal of the Korea institute of electronic communication sciences
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    • v.13 no.5
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    • pp.1093-1100
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    • 2018
  • Fast progress in miniaturization and reducing power consumption of semiconductors for wearable devices makes it possible to develop extremely small wearable systems for various application services. This results recent wearable applications to be powered from extremely low-power energy harvesters based on solar, piezo, and TENG sources. In most cases, the harvesters generate power in non-linear manner. Therefore, we implemented and experimented the device platforms to utilize natural frequency of around 3Hz. We also designed two-stage power storages and high efficiency conversion platform to consider such non-linear power harvesting sources. The experiment showed power generation of about 4.67mW/min from these non-linear sources with provision of stable energy storages.

Small-Scale Wind Energy Harvester Using PZT Based Piezoelectric Ceramic Fiber Composite Array (PZT계 압전 세라믹 파이버 어레이 복합체를 이용한 미소 풍력 에너지 하베스터)

  • Lee, Min-Seon;Na, Yong-Hyeon;Park, Jin-Woo;Jeong, Young-Hun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.5
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    • pp.418-425
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    • 2019
  • A piezoelectric ceramic fiber composite (PCFC) was successfully fabricated using $0.69Pb(Zr_{0.47}Ti_{0.53})O_3-0.31[Pb(Zn_{0.4}Ni_{0.6})_{1/3}Nb_{2/3}]O_3$ (PZT-PZNN) for use in small-scale wind energy harvesters. The PCFC was formed using an epoxy matrix material and an array of Ag/Pd-coated PZT-PZNN piezo-ceramic fibers sandwiched by Cu interdigitated electrode patterned polyethylene terephthalate film. The energy harvesting performance was evaluated in a custom-made wind tunnel while varying the wind speed and resistive load with two types of flutter wind energy harvesters. One had a five-PCFC array vertically clamped with a supporting acrylic rod while the other used the same structure but with a five-PCFC cantilever array. Stainless steel (thickness: $50{\mu}m$) was attached onto one side of the PCFC to form the PZT-PZNN cantilever. The output power, in general, increased with an increase in the wind speed from 2 m/s to 10 m/s for both energy harvesters. The highest output power of $15.1{\mu}W$ at $14k{\Omega}$ was obtained at a wind speed of 10 m/s for the flutter wind energy harvester with the PZT-PZNN cantilever array. The results presented here reveal the strong potential for wind energy harvester applications to supply sustainable power to various IoT micro-devices.