• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.298.2-298.2
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• 2016

가공이 까다로운 소재를 가공하기 위한 공구에 적용하기 위해서 Al의 함량이 높은 AlTiN 소재가 개발되어 적용되고 있으며, 이 소재는 공구의 수명향상을 위한 표면처리 소재로 각광을 받고 있다. 본 연구에서는 음극 아크 증착 시 거대입자가 박막에 증착되어 결함을 만들기 때문에 그 밀도를 낮추기 위해서 음극 아크 증착을 이용하여 공정 변화에 따른 AlTiN 박막의 표면형상을 관찰하고 특성을 평가하였다. 또한 빗각 증착을 적용하여 제작한 AlTiN 박막의 특성을 평가하였다. Al-25 at.%Ti 합금타겟을 음극 아크 소스에 장착하여 AlTiN 박막을 코팅하였다. 시편은 스테인리스 강판(SUS304)과 초경(tungsten carbide; WC)을 사용하였다. 음극 아크 소스에 인가되는 전류가 낮을수록 AlTiN 박막 표면에 거대입자의 밀도가 낮아졌으며, 기판 전압과 공정압력이 높을수록 AlTiN 박막의 표면에 존재하는 거대입자의 밀도가 낮아지는 경향을 보였다. 이를 통하여 거대입자밀도를 낮추는 기초공정을 도출하였다. AlTiN 박막 제작 시 빗각을 적용한 결과 $60^{\circ}$의 빗각을 적용한 다층 박막에서 약 33 GPa의 경도를 보였다. 본 연구를 통해 음극 아크 증착을 이용하여 거대입자의 밀도가 낮은 박막을 제작할 수 있는 공정을 도출하였고, 빗각증착을 적용하면 경도가 향상되는 결과를 확인하였다. 이를 통해 절삭공구 등과 같이 고경도의 코팅물성 유지를 위한 코팅분야에 응용이 가능할 것으로 판단된다.

• Progress in Superconductivity and Cryogenics
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• v.17 no.3
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• pp.1-4
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• 2015

Production of $MgB_2$ film on metallic Hastelloy with SiC as the buffer layer was achieved by means of hybrid physical-chemical vapor deposition technique, whereas SiC buffer layers with varied thickness of 170 and 250 nm were fabricated inside a pulsed laser deposition chamber. Superconducting transition temperature and critical current density were verified by transport and magnetic measurement, respectively. With SiC buffer layer, the reduced delaminated area at the interface of $MgB_2$-Hastelloy and the slightly increased $T_c$ of $MgB_2$ tapes were clearly noticed. It was found that the upper critical field, the irreversibility field and the critical current density were reduced when $MgB_2$ tapes were buffered with SiC buffer layer. Clarifying the mechanism of SiC buffer layer in $MgB_2$ tape in affecting the superconducting properties is considerably important for practical applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.318.1-318.1
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• 2014

Metal nano-crystals have been received much attentions owing to their excellent catalytic property and surface plasmon effect. In the last decade, many studies on synthesizing well-dispersive nanoparticles and on understanding their distinct physical properties have been performed. There were tremendous reports revealing the electrochemical activities and enhancement of surface plasmonic effect were dependent mainly on the size, shape, and composition. So far, most fabrication methods have been based on vacuum based deposition techniques, such as chemical vapor deposition and electron-beam evaporation, and then annealed them to transform into the nanoparticles. Recently, there were several reports regarding to the photoinduced nano-crystal synthesis as an effective way to produce the metal nanoparticles. In this study, we report synchrotron x-ray mediated synthesis of Au nanoparticles on ZnO nanowires. ZnO nanowires were fabricated by hydrothermal method, and then they were dip into a solution having Au clusters. Detailed structural evolution of Au nanoparticles was investigated using scanning electron microscopy and photoluminescence measurements. The results on formation of well-dispersive Au nanoparticles on ZnO nanowires will be presented.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.244.2-244.2
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• 2014

금속, 플라스틱, 유리 등의 재료 표면에 다양한 색상을 표현하기 위해 일반적으로 습식 도금을 많이 적용하고 있다. 하지만 습식 도금은 공정 수가 많을 뿐만 아니라 위험물질 및 오염물질을 많이 사용하기 때문에 산업사고, 환경오염 등을 야기 시킨다. 따라서 본 연구에서는 친환경적 방법인 물리적기상증착(PVD ; Physical Vapor Deposition) 방식의 한 종류인 스퍼터링(Sputtering)으로 색상을 구현하였다. PVD 방식의 증착은 습식 도금 방식에 비해 친환경적이며, 전처리에서 후처리까지 한 공정으로 가능하다는 점이다. 스퍼터링은 PVD의 다른 방식인 E-beam 방식에 비해 대량생산을 할 수 있다는 장점이 있다. 양산형 스퍼터링 장비(${\Phi}1200mm{\times}H1400mm$)로 실험을 진행하였으며, 증착 물질은 Ti, Al, Cr 을 사용하였고, 반응성 가스(Reactive Gas) 로는 N2, C2H2 가스를 사용하였다. 전처리는 LIS (Linear Ion Source)로 식각(Etching) 하였고, 펄스직류전원공급장치(Pulsed DC Power Supply)를 사용하여 증착 하였으며, 증착시 기판에 bias (-100 V)를 인가 하였다. 그 결과 회색계열, 갈색계열 등 여러가지 색을 구현할 수 있었으며, 증착된 박막의 특성을 알아보기 위하여 색차계, 내마모 시험기, 연필경도 시험기를 사용하였다. 향후 후처리 공정으로 내지문(AF ; anti fingerprint coating) 박막 등과 같은 실용적인 박막을 증착할 계획이다.

• Progress in Superconductivity and Cryogenics
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• v.16 no.2
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• pp.20-23
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• 2014

We have grown $MgB_2$ on SiC buffer layer by using metallic Hastelloy tape as the substrate. Hastelloy tape was chosen for its potential practical applications, mainly in the power cable industry. SiC buffer layers were deposited on Hastelloy tapes at 400, 500, and $600^{\circ}C$ by using a pulsed laser deposition method, and then by using a hybrid physical-chemical vapor deposition technique, $MgB_2$ films were grown on the three different SiC buffer layers. An enhancement of critical current density values were noticed in the $MgB_2$ films on SiC/Hastelloy deposited at 500 and $600^{\circ}C$. From the surface analysis, smaller and denser grains of $MgB_2$ tapes are likely to cause this enhancement. This result infers that the addition of SiC buffer layers may contribute to the improvement of superconducting properties of $MgB_2$ tapes.

• Journal of the Korean Applied Science and Technology
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• v.15 no.1
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• pp.91-97
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• 1998

Thin films of $Eu(TTA)_3(phen)$, which was known to show red-light emitting properties, were deposited under various deposition condition. The thickness, surface morphology, and photoluminescence(PL) were measured with ${\alpha}$-step profiler, Atomic Force Microscopy(AFM), and PL measurement apparatus. It was found that the thickness of $Eu(TTA)_3(phen)$ film can be controlled precisely by adjusting the amounts of $Eu(TTA)_3(phen)$ in the boat. As the thickness of these films increases, the surface roughness also increases. A structure of $Al/Eu(TTA)_3(phen)(850{\AA})/TPD(600{\AA})/ITO$ was fabricated, Electroluminescence(EL) spectrum of which shows the peak at the wavelength of 618nm.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.22.2-22.2
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• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• Korean Journal of Materials Research
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• v.25 no.1
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• pp.54-59
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• 2015

Glancing angle deposition (GLAD) is a powerful technique to control the morphology and microstructure of thin film prepared by physical vapor deposition. Chromium (Cr) thin films were deposited on a polymer substrate by a sputtering technique using GLAD. The change in thickness and Vickers microhardness for the samples was observed with a change in the glancing angle. The adhesion properties of the critical load (Lc) by a scratch tester for the samples were also measured with varying the glancing angle. The critical load, thickness and Vickers microhardness for the samples decreased with an increase in the glancing angle. However, the thickness of the Cr thin film prepared at a $90^{\circ}$ glancing angle showed a relatively large value of 50 % compared to that of the sample prepared at $0^{\circ}$. The results of X-ray diffraction and scanning electron microscopy demonstrated that the effect of GLAD on the microstructure of samples prepared by sputter technique was not as remarkable as the samples prepared by evaporation technique. The relatively small change in thickness and microstructure of the Cr thin film is due to the superior step-coverage properties of the sputter technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.11
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• pp.1241-1245
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• 2004

Continuous physical vapor deposition (PVD) method is one of many processes to fabricate long length coated conductor which is required for successful large-scale application of superconducting power devices. Three film deposition systems (pulsed laser deposition, sputtering, and evaporation) equipped with reel-to-reel(R2R) metal tape moving apparatus were installed and used to deposit multi-layer oxide thin films. Both RABiTS and IBAD texture templates are used. IBAD template consists of CeO$_2$(PLD)/YSZ(IBAD) on stainless steel(SS) metal tape, and RABiTS template has the structure of CeO$_2$/YSZ/Y$_2$O$_3$ which was continuously deposited on Ni-alloy tape using R$_2$R evaporation and DC reactive sputtering in a deposition system designed to do both processes. 0.4 m-long coated conductor with Ic(77 K) of 34 A/cm was fabricated using RABiTS template. 0.5 m and 1.1 m-long coated conductor with Ic(77 K) of 41 A/cm and 26 A/cm were fabricated using IBAD template.

• Journal of the Korean institute of surface engineering
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• v.45 no.3
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• pp.111-116
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• 2012

Oblique angle deposition (OAD) is a physical vapor deposition method which utilizes non-normal angles between the substrate and the vaporizing source. It has been known that tilting the substrate changes the properties of the film deposited on it, which was thought to be a result of morphological change of the film. In this study, OAD has been applied to prepare single and multilayer Al films by magnetron sputtering. The magnetron sputtering source of 4 inch diameter was used to deposit the films. Al films have been deposited on Si wafers and cold-rolled steel sheets. The multilayer films were prepared by changing the tilting angle upside down at each layer interval, which means that when the first layer was deposited at an angle of $+45^{\circ}$, the second layer was deposited at an angle of $-45^{\circ}$, and vice versa. The microstructure, surface roughness and reflectance of the films were investigated using a scanning electron microscope, a surface profiler and a spectrophotometer, respectively. The corrosion resistance was measured and compared using the salt spray test. The single layer film prepared at an oblique angle of $60^{\circ}$ prepared at other angles. However, for the multilayer films, the film prepared at an oblique angle of $45^{\circ}$ showed the most compact and featureless structure. The multilayer films were found to exhibit higher corrosion resistance than the single layer films.