• Korean Journal of Materials Research
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• v.15 no.8
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• pp.528-535
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• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.580-585
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• 2009

The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of $450{\mu}m$ in diameter were reflowed at $245^{\circ}C$ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to $135{\mu}m$, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and $135{\mu}m$, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

• Environmental Mutagens and Carcinogens
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• v.23 no.2
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• pp.56-62
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• 2003

The liver progenitor cells could form a potential target cell population fore both tumor-initiating and -promoting chemicals. Induction of drug-metabolizing and antioxidant enzymes, including AhR-dependent CYP1A1, NQO-1 and AKR1C9, was detected in the rat liver epithelial WB-F344 "stem-like" cells. Additionally, WB-F344 cells express a functional, wild-type form of p53 protein, a biomarker of genotoxic events, and connexin 43, a basic structural unit of gap junctions forming an important type of intercellular communication. In this cellular model, two complementary assays have been established for detection of the modes of action associated with tumor promotion: inhibition of gap junctional intercellular communication (GJIC) and proliferative activity in confluent cells. We found that the PAHs and PCBs, which are AhR agonists, released WB-F344 cells from contact inhibition, increasing both DNA synthesis and cell numbers. Genotoxic effects of some PAHs that lead to apoptosis and cell cycle delay might interfere with the proliferative activity of PAHs. Contrary to that, the nongenotoxic low-molecular-weight PAHs and non-dioxin-like PCB congeners, abundant in the environment, did not significantly affect cell cycle and cell proliferation; however both groups of compounds inhibited GJIC in WB-F344 cells. The release from contact inhibiton by a mechanism that possibly involves the AhR activation, inhibition of GJIC and genotoxic events induced by environmental contaminants are three important modes of action that could play an important role in carcinogenic effects of toxic compounds. The relative potencies to inhibit GJIC, to induce AhR-mediated activity, and to release cells from contact inhibition were determined for a large series of PAHs and PCBs and their metabolites. In vitro bioassays based on detection of events on cellular level (deregulation of GJIC and/or proliferation) or determination of receptor-mediated activities in both ?$stem-like^{\circ}{\times}$ and hepatocyte-like liver cellular models are valuable tools for detection of modes of action of polyaromatic hydrocarbons. They may serve, together with concentration data, as a first step in their risk assessment.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Analytical Science and Technology
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• v.16 no.1
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• pp.48-58
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• 2003

The effects of physico-chemical properties of soils on PCBs analysis in Korea was studied Three kinds of extraction solvents(toluene, acetone:hexane, dichloromethane) was selected to apply three different soils. The silicagel, florisil and alumina column cleanup also performed to compare the elution patterns, and three different methods (EPA, Japan, Proposed method in this study) of 62 PCBs also compared the individual peaks recoveries. The solvent average recovery was surveyed the order of toluene, acetone:hexane, dichloromethane as 77.94%, 58.59%, 54.20% for soil A, 53.65%, 80.32%, 68.27% for soil B and 44.52%, 60.35%, 56.36% for soil C, respectively. The average recovery was depended on the soil characters. The highest recoveries of each soil were obtained the toluene for soil A, acetone:hexane for soil B and C. However, the coplanar PCBs was obtained the highest recovery with dichloromethane. Thus, to select the solvent for the analysis of PCBs in solid, the selected compounds have to consider to get good result. The silicagel, florisil, alumina I and alumina II column cleanup process were surveyed the range of 38.73%~98.26%, and the higher chlorinated compounds was obtained the lower recovery compared to the low chlorinated compounds, generally. This results are also consistent with the coplanar PCBs isomers. The compared results of three different countries were obtained the 37.15% for USA, 45.92% for Japan and 44.46% for proposed method in this study.

• Resources Recycling
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• v.10 no.5
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• pp.29-35
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• 2001

This study was carried out to recover gold, silver and valuable metals from the printed circuit boards (PCBs) of waste computers. PCBs samples were crushed under 1 mm by a shredder and separated into 30% conducting and loft nonconducting materials by an electrostatic separator. The conducting materials contained valuable metals which were then used as feed materials for magnetic separation. 42% of magnetic materials from the conducting materials was removed by magnetic separation as nonvaluable materials and the others, 58% of non magnetic materials, was used as leaching samples containing 0.227 mg/g Au and 0.697 mg/g Ag. Using the materials of leaching from magnetic separation, more than 95% of copper, iron, zinc, nickel and aluminium was dissolved in 2.0M sulfuric acid solution, added with 0.2M hydrogen peroxide at $85^{\circ}C$. Au and Ag were not extracted in this solution. On the other hand, more than 95% of gold and 100% of silver were leached by the selective leaching with a mixed solvent (0.2M($NH_4$)$_2$$S_2$$O_3$,0.02M $CuSO_4$,0.4M $NH_4$OH). Finally, the residues were reacted with a NaCl solution to leach Pb whereas sulfuric acid was used to leach Sn. Recoveries reached 95% and 98% in solution, respectively.

• Journal of Navigation and Port Research
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• v.26 no.4
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• pp.419-426
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• 2002

The conventional RTK-GPS technique has many problems which are permission using RF wireless modem, influence of geographic obstacle using radio wave, frequency interference, finiteness of frequency resources. To solve these problems, in this paper, we designed the DGPS correction message transmission system as a method to substitute the RF wireless modem of RTK-DGPS receiver. Then the interface module was designed and implemented for linkage of GPS receiver and mobile phone. As a result worked differential surveying using receiving correction message using RS-232C and communication control, users of mobile station were worked differential surveying correction between mobile phones. Interface module system was received the same result of precision which was compared RF wireless modem system.

• Journal of Environmental Health Sciences
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• v.27 no.2
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• pp.127-137
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• 2001

Polychlorinated biphenyls(PCBs) are halogenated aromatic compounds with the empirical formula $C_{12}$ $H_{10-n}$C $l_{n}$(n=1~10), and are a mixture of possible 209 different chlorinated congeners. PCBs were widely used as dielectric fluids for capacitors and transformers, plasticizers, lubricant inks and paint addirives. Once released into the environment, PCBs persist for years because they are so resistant to degradation. In addition to their persistence in the environment, PCBs in ecological food chains undergo biomagnification because of their high degree of lipophilicity. In 1970s, the worldwide production of PCBs was ceased and the import of PCBs was prohibited since 1983 in Korea. In spite of these actions, many PCBs seems to be still in use. The environmental load of PCBs will continue to be recycled through air, land, water, and the biosphere for decades to come. This study was conducted to measure the concentrations of PCBs in the serum samples of 112 women by GC/MSD and GC/ECD. The main results of this study were as follows. 1. PCBs were detected in all samples. The mean $\pm$SD levels of PCBs in the serum were 3.613$\pm$0.759 ppb, and median were 3.828 ppb. 2. The correlation coefficients of the concentrations of 13 PCB congeners were from minimum, 0.7913 to maximum, 0.9985, and all was significant(p=0.0001). The correlation coefficient between the concentrations of PCBs and p,p'-DDE was 0.9641(p=0.0001). 3. There was a positive association between age and PCBs' concentrations (simple linear regression ; $R^2$=0.86, $\beta$=0.08023, p<0.001). 4. There was a positive association between total lipids in the serum and PCBs' concentrations (simple linear regression ; $R^2$=0.7058, $\beta$=0.00486, p<0.001). 5. For possible predictors of PCBs and p,p' -DDE levels in the serum, age adjusted model (Y=$\beta$$_{0}$+$\beta$$_1$age+ $B_2$X) was applied. For BMI, major residential area, wether to eat caught fish by angling, where to eat caught fish by angling(by parents in the past), fish consumption, meat consumption, meat consumption, and dairy consumption, there was no association. For total conception frequency and lactation frequency and lactation period, there was negative association.ion.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.504-510
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• 2017

This paper presents an AC-DC power module design and evaluates its efficiency and reliability when used for electronics appliances. This power module consists of a PWM control IC, power MOSFETs, a transformer and several passive devices. The module was tested at an input voltage of 220V (RMS) (frequency 60 Hz). A test was conducted in order to evaluate the operation and power efficiency of the module, as well as the reliability of its protection functions, such as its over-current protection (OVP), overvoltage protection (OVP) and electromagnetic interference (EMI) properties. Especially, we evaluated the thermal shut-down protection (TSP) function in order to assure the operation of the module under high temperature conditions. The efficiency and reliability measurement results showed that at an output voltage of 5 V, the module had a ripple voltage of 200 mV, power efficiency of 73 % and maximum temperature of $80^{\circ}C$ and it had the ability to withstand a stimulus of high input voltage of 4.2 kV during 60 seconds.