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Characteristics of the High Speed Shear Test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder Ball Joints  

Lee, Young-Gon (Department of Materials Science and Engineering, University of Seoul)
Lee, Hee-Yul (Department of Materials Science and Engineering, University of Seoul)
Moon, Jeong-Tak (MK ELECTRON Co., LTD)
Park, Jai-Hyun (Research Institute of Industrial Science & Technology)
Han, Shin-Sik (Korea Polytechnic)
Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Korean Journal of Metals and Materials / v.47, no.9, 2009 , pp. 580-585 More about this Journal
Abstract
The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of $450{\mu}m$ in diameter were reflowed at $245^{\circ}C$ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to $135{\mu}m$, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and $135{\mu}m$, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.
Keywords
high speed shear test; solder ball; shearing tip height; shearing speed; shear strength;
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