• Transactions on Electrical and Electronic Materials
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• v.16 no.1
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• pp.20-24
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• 2015

We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of the Sn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, which caused irregular reflection of light. Large, Pb-rich, primary ${\alpha}$-phases were found below the convex surface of the solar ribbon, passing from the surface of the internal Cu ribbon to the surface of the plating layer. The primary ${\alpha}$-phases heterogeneously nucleated on the convex surface of the Cu ribbon, and then largely grew to the convex surface of the plating layer. The restriction of the primary ${\alpha}$-phase's formation was enabled by enhancing the smoothness of the Cu ribbon's surface; it was also possible to increase the adhesive strength and decrease contact resistance. We confirmed that the solar ribbon's surface smoothness depends on the internal Cu ribbon's surface smoothness.

• Electrical & Electronic Materials
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• v.9 no.7
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• pp.680-689
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• 1996

SrCaCuO와 BiPbCuO 화합물로 이루어진 이중층시료가 만들어 졌으며, 소결과정에서 나타나는 확산과 입자간의 상호작용으로 108K의 임계온도를 나타내었다. 이 시료는 820.deg. C에서 0-210 시간동안 소결되었다. 초전도체의 생성, 성장메카니즘과 임계온도의 관계가 연구되었으며, 최적조건은 820.deg. C에서 210시간 소결하고 SrCaCuO와 BiPbCuO의 도포비가 1:0.6인 시편에서 나타났다. 또한 이중층시료에서 가장 좋은 조성비는 S $r_{2}$C $a_{2}$C $u_{2}$ $O_{x}$와 B $i_{1.9}$P $b_{0.5}$C $u_{3}$ $O_{y}$ 이었다.다.

• Progress in Superconductivity
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• v.2 no.2
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• pp.65-70
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• 2001

$Pb/Bi_2Sr_2CaCu_2O_{8+\delta}$-single-crystal junctions with the tunneling direction along the c axis of the crystal were fabricated to obtain an s-wave-superconductor/d-wave-superconductor Josephson junctions. The tunneling R (T) curves and current-voltage characteristics show distinct features which can be explained only under the assumption that the order parameter of high-$T_c/Bi_2Sr_2CaCu_2O_{8+{\delta}}$ superconductors has a pure d-wave symmetry, which is in contrast to the case of $YBa_2Cu_3O_{7+{\delta$}}$erconductors where a minor s-wave component is also present..

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.05a
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• pp.22-27
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• 1993

we prepared 70K new BiPbAgSrCaCuO superconductor used diffusion of dual layer which composed of SrCaCuO and BiPbAgCuO compound. This method is used permeation and diffusion on partial melting point of BiPbAgCuO compound. Samples were analyzed by means of X-ray diffraction analysis, Thermal analysis, critical temperature and scanning electron microscopy. It was found that the best results were obtained for spread volume (A:B=1:0.6) and sintring time 210hours.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.216-226
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• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• Journal of Environmental Science International
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• v.6 no.1
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• pp.61-67
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• 1997

Heavy metal adsorption by microbial cells is an alternative to conventional methods of heavy metal removal and recovery from metal-bearing wastewater The waste Sac-chuomyces cerevisiae is an inexpensive, relatively available source of biomass for heavy metal biosorption. Biosorption was investigated by free and immobilized-S. cerevisiae. The order of biosorption capacity was Pb>Cu>Cd with batch system. The biosorption parameters had been determined for Pb with free , cells according to the Freundlich and Langmuir model. It was found that the data fitted reasonably well to the Freundlich model. The selective uptake of immobilized-S. cerevisiae was observed when all the metal ions were dissolved in a mixed metals solution(Pb, Cu, Cr and Cd). The biosorption of mixed metals solution by immobilized-cell was studied in packed bed reactor. The Pb uptake was Investigated in particular, as it represents one of the most widely distributed heavy metals in water. We also tested the desorption of Pb from immobilized-cell by us- ing HCI, $H_2SO_4$ and EDTA.

• Conservation Science in Museum
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• v.2
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• pp.57-68
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• 2000

This study is a scientific analysis of 12 bronze materials which were excavated from Sanoisa temple in Chongju. Analysis of crystalline shape, size and distribution of the each sample metal suggested that they can be classified as tableware(wrought), vessels for memorial service(casting) and bell bronze, which is the same result as classification based on elemental composition. Most of the tableware are forging wares with composition of 8:2:0 in Cu:Sn:Pb, and vessels for memorial service are casting wares whose composition is 7:1:2 in Cu:Sn:Pb, and bell bronze's composition is Cu:Sn:Pb = 85:10:5/9:1:0. The result clearly shows that composition is closely related with usage and manufacturing method of wares. Trace elements such as Co, Fe and As are the elements with high correlation coefficient with Cu, which means they exist as impurities in Cu, and the content of As showed an increase in the order of tableware, memorial service vessels and bell bronze. In addition, the analysis of lead isotope ratio showed that 3 bronze materials with high lead content were made from the lead coming from Japan and China. The composition of the solder was Cu:Sn:Pb = 83:12:5 where small Pb crystals were distributed evenly.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Journal of Environmental Health Sciences
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• v.21 no.2
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• pp.27-35
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• 1995

In order to investigate acute toxicity and bioconcentration of heavy metals for a freshwater fish, the fish used in this experiment was goldfish, Carassius auratus. Each ten goldfish was accommonidated in a water and was treated with different concentration of Pb and Cu compound. The 24 $hr-LC_{50}$ was obtained by plotting on the log-normal distribution graph. Furthermore, the combined effect of Pb and Cu was also investigated the fish was treated with Pb or Cu compound only, and Pb and Cu compound together, respectively. These results were summarized as follows: 1. The 24 $hr-LC_{50}'s$ of Pb and Cu were 7.48 mg/l and 0.666 mg/l, respectively. 2. When single or/and combined treatment with Pb(7.0 mg/l) or/and Cu(0.6 mg/l) to Carassius auratus for 24 hours were performed, there was significant difference between the single or/and the combined treatment in their bioaccumulated Cu concentrations. Cu concentrations in goldfish were higher in the combined treatment than in the single treatment. 3. When Carassius auratus was exposed to 0.748 mg/l (1/10 of 24 $hr-LC_{50}$) and 1.496 mg/l of Pb (1/5 of 24 $hr-LC_{50}$) for 7 days, the bioconcentration factors (BCF) were 79.14 and 100.11 for Pb, respectively. The BCF of Pb was obtained as a linearity according to the concentration and exposure time as follows log BCF=1.014 log $P\cdot T$+1.011 ($r^2$=0.9041) where, P: pollutant concentration(mg/l) T: exposure time(day) 4. When Carassius auratus was pxposed to 0.0666 mg/l (1/10 of 24 $hr-LC_{50}$) and 0.1332 mg/l of Cu (1/5 of 24 $hr-LC_{50}$) for 7 days, the bioconcentration factors (BCF) were 55.42 and 63.24 for Cu respectively. The BCF of Cu was obtained as a linearity according to the concentration and exposure time as follows log BCF=0.571 log $P\cdot T$+1.823 ($r^2$=0.8974) where, P: polutant concentration(mg/l) T: exposure time(day)