Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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A Reliability Test for ph-free SnCu Plating Solution and It's Deposit

Sn-Cu 무연 도금용액 및 피막의 신뢰성평가

  • Lee Hong-Kee (Korea Institute of Industrial Technology, Nano Surface Technology Team) ;
  • Hur Jin-Young (Korea Institute of Industrial Technology, Nano Surface Technology Team)
  • Published : 2005.12.01
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Abstract

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

Keywords

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