• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3168-3172
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• 2007

As the minimum feature size decreases, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT and designed a particle deposition system which consists of scanning mobility particle sizer (SMPS) and deposition chamber. Charged monodisperse particles are generated using SMPS and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well in terms of particle number and deposition area according to particle size, flow rate and deposition voltage.

• Particle and aerosol research
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• v.5 no.1
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• pp.17-27
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• 2009

Particle deposition on a semiconductor wafer larger than 100 mm was studied experimentally and numerically. Particularly the electrostatic effect on particle deposition velocity was investigated. The experimental apparatus consisted of a particle generation system, a particle deposition chamber and a wafer surface scanner. Experimental data of particle deposition velocity were obtained for a semiconductor wafer of 200 mm diameter with the applied voltage of 5,000 V and PSL particles of the sizes between 83 and 495 nm. The experimental data of particle deposition velocity were compared with the present numerical results and the existing experimental data for a 100 mm wafer by Ye et al. (1991) and Opiolka et al. (1994). The present numerical method took into consideration the particle transport mechanisms of convection, Brownian diffusion, gravitational settling and electrostatic attraction in an Eulerian frame of reference. Based on the comparison of the present experimental and numerical results with the existing experimental results the present experimental method for a 200 mm semiconductor wafer was found to be able to present reasonable data.

• Particle and aerosol research
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• v.13 no.2
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• pp.53-63
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• 2017

As semiconductor process was highly integrated, particle contamination became a major issue. Because particle contamination is related with process yields directly, particles with a diameter larger than half pitch of gate should be controlled. PBMS (Particle beam mass spectrometry) is one of powerful nano particle measurement device. It can measure 5~500 nm particles at ~ 100 mtorr condition in real time by in-situ method. However its usage is restricted to research filed only, due to its big device volume and high price. Therefore aperture changeable aerodynamic lenses (ACALs) which can control particle focusing characteristics by changing its aperture diameter was proposed in this study. Unlike conventional aerodynamic lenses which changes particle focusing efficiency when operating condition is changed, ACALs can maintain particle focusing efficiency. Therefore, it can be used for a multi-monitoring system that connects one PBMS and several process chambers, which greatly improves the commercialization possibility of the PBMS. ACALs was designed based on Stokes number and evaluated by numerical method. Numerical analysis results showed aperture diameter changeable aerodynamic lenses can focus 5 to 100 nm standard particles at 0.1 to 10 torr upstream pressure.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.86-91
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• 2021

Recently, functional clothes that can reduce deposition and/or penetration of fine dust have been developed. However, there are no methods to quantitatively evaluate the performance of these clothes. In this study, we developed a method to contaminate a fabric using fine dust and established an approach to quantitatively assess the degree of particle contamination on the fabric surface. Silicate powder was chosen as the particle to simulate fine dust because silicate particles are fluorescent under UV light; therefore, they can be distinguished from any color of non-fluorescent fabric surface. A camera with a high-resolution lens system was used to scan the surface of the contaminated fabric surface, and the degree of particle contamination of the fabric surface was analyzed in terms of the pixels corresponding to the area of the fabric surface contaminated by silicate particles. Finished or unfinished nylon fabrics as well as cotton fabrics were contaminated with silicate particles, and their surfaces were scanned using the established camera. The proposed assessment method was found to be useful for quantitatively comparing the degree of particle contamination of the fabrics.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.26-33
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• 2002

• Particle and aerosol research
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• v.5 no.3
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• pp.95-109
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• 2009

A low temperature plasma process has been widely used for semiconductor fabrication and can also be applied for the preparation of solar cell, MEMS or NEMS, but they are notorious in the point of particle contamination. The nano-sized particles can be generated in the low temperature plasma process and they can induce several serious defects on the performance and quality of microelectronic devices and also on the cost of final products. For the preparation of high quality thin films of high efficiency by the low temperature plasma process, it is desirable to increase the deposition rate of thin films with reducing the particle contamination in the plasmas. In this paper, we introduced the studies on the generation and growth of nanoparticles in the low temperature plasmas and tried to introduce the recent interesting studies on nanoparticle generation in the plasma reactors.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.1-6
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• 2023

In CO₂ laser surface machining of plastic films in modern display manufacturing, scattering of fume particles could be a major source of well-recognized film surface contamination. This computational fluid dynamics research investigates the suction air flow patterns over a film surface as well as the dispersion of micron-sized fume particles with low-Reynolds number particle drag model. The numerical results show the recirculatory flow patterns near laser machining point on film surface and also over the surface of vertical suction slot, which may hinder the efficient removal of fume particles from film surface. The dispersion characteristics of fume particles with various particle size have been tested systematically under different levels of suction flow intensity. It is found that suction removal efficiency of fume particles heavily depends on the particle size in highly nonlinear manners and a higher degree of suction does not always results in more efficient particle removal.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.1
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• pp.66-71
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• 2004

Airborne contaminant particles are intruded into optical disk drive(ODD) due to the flow caused by disk rotation and can be adhered to objective lens, which causes read/write errors. Such a phenomenon can be a serious problem for high-density storage devices. The purpose of this paper is to understand the effect of particle contamination of objective lens in a CD-ROM drive on laser diode power and photo diode RF signal. The measurements of laser power and readout RF signal were carried out by using a laser power meter and a time interval analyzer, respectively. The parameters for estimating a readout-signal' distortion were its jitter and amplitude. Alumina(Al$_2$O$_3$) particles were used as test dust particles. The results show that the failure for data access happened as the degree of lens contamination was greater than 20％.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.11-15
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• 2018

The parts of equipment for semiconductor are protected by anodic aluminum oxide film to prevent corrosion. This study investigated contamination particle and cracking behavior of anodic oxidation in sulfuric acid containing cerium salt. The insulating properties of the sample were evaluated by measuring the breakdown voltage. It was confirmed that the breakdown voltage was about 50% higher when the cerium salt was added, and that the breakdown voltage after the heat treatment was 55% and 35% higher at $300^{\circ}C$ and $400^{\circ}C$, respectively. After heating at $300^{\circ}C$ and $400^{\circ}C$, cracks were observed in non cerium and cerium 3mM, and more cracks occur at $400^{\circ}C$ than at $30^{\circ}C$. The amount of contamination particles generated in the plasma is about 45% less than that of non-cerium specimens.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.04a
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• pp.124-130
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• 1998

A mathematical model describing gear pump flow degradation in the presense of abrasive particles is presented. The model considers the operating parameters as Sommerfeld number, so that contamination sensitivity test results could be conversed to field application to predict contamination service life. A method to estimate the volumetric efficiency and the contamination level of a pump is proposed by measuring the temperature differences in the fluid. Test results show the validity of the theoretical establishments.