• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.759-762
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• 2000

Present transistors which have vertical structure show increased parasitic capacitance characteristics in accordance with the increase of non-active base area and collector area, consequently have disadvantage for high speed switching performance. In this paper, a horizontal structure transistor which has minimized parasitic capacitance in virtue of SDB(Silicon Direct Bonding) wafer and oxide sidewall isolation utilizing silicon trench technology is presented. Its structural characteristics were designed by ATHENA(SUPREM4), the process simulator from SILVACO International, and its performance was proven by ATLAS, the device simulator from SILVACO International. The performance of the proposed horizontal structure transistor was certified through the VCE-lC characteristics curve, $h_{FE}$ -IC characteristics, and GP-plot.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• Proceedings of the KIPE Conference
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• 2020.08a
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• pp.346-347
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• 2020

This paper presents the two combination methods for leakage current reduction in photovoltaic system PCS. The leakage current in the photovoltaic system generated from the parasitic capacitance existing between the photovoltaic system and ground relevance to common mode voltage caused by PWM switching. Firstly, Leakage current reduced by a PWM method using two carriers with 180-degree phase different. Secondly, the leakage current is more reduced by connecting LCL filter to the mid-point of DC link. This combining method is revealed in PSIM simulation with 1 uF parasitic capacitance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.4
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• pp.350-357
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• 2016

In this paper, a small mu-zero zeroth order resonance(ZOR) antenna based on meta structure is proposed using parasitic patch at 5.8 GHz. The mu-zero ZOR antenna is designed by utilizing the resonance of series inductance and capacitance of mu-negative transmission line and its size can be further reduced by a simple parasitic patch. The parasitic patch can increase series capacitance of mu-negative transmission line related to a resonant frequency. We have simulated and optimized dimension of the parasitic patch using Ansys commercial simulator(HFSS). As a result, the antenna has the following characteristics: kr of 0.59, efficiency of 92 %, and gain of 6.57 dBi. Also, its size is reduced by 24 % compared to a conventional mu-zero ZOR antenna. The measured results are in good agreement with the simulated results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.6
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• pp.1297-1303
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• 2003

This paper propose an advanced circuit for fingerprint sensor signal processing. We increased the voltage between ridge and valley by modifying the parasitic capacitance eliminating circuit of sensor plate. The analog comparator was designed for comparing the sensor signal voltage with the reference signal voltage. We also propose an effective isolation strategy for removing noise and signal coupling, ESD of each sensor pixel. The 128${\times}$l44 pixel fingerprint sensor circuit was designed and simulated, and the layout was performed.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.181-184
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• 1999

This paper presents the accurate deembeding method for pad and parasitics of MOSFET device. rad effects are deembedded using THRU LINE, which is much simpler method without laborious fitting procedure compared with conventional OPEN and SHORT pad modeling. Parasitic resistance extraction uses the algebraic relation between increments of inversion layer charge and oxide capacitance. It is especially adequate for insulating gate junction device. Extracted parasitics are verified through comparing modeled and measured S parameters.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 2002.06a
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• pp.195-199
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• 2002

This paper describes the effect of substrate back bias of CMOS Inverter. When the substrate back bias applied in body, the MOS transistor threshold voltage increased and drain saturation current decreased. The back gate reverse bias or substrate bias has been widely utilized and the following advantage has suppressing subthreshold leakage, lowering parasitic junction capacitance, preventing latch up or parasitic bipolar transistor, etc. When the reverse voltage applied substrate, this paper stimulated the propagation delay time CMOS inverter.

• Journal of Sensor Science and Technology
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• v.19 no.3
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• pp.191-196
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• 2010

In this paper, modeling of the non-ideal frequency response, especially "notch-and-spike" magnitude phenomenon and phase lag distortion, are discussed. To characterize the non-ideal frequency response, a new electro-mechanical simulation model based on SPICE is proposed using the driving loop of the capacitive vibratory gyroscope. The parasitic components of the driving loop are found to be the major factors of non-ideal frequency response, and it is verified with the measurement results.

• Journal of Power Electronics
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• v.18 no.3
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• pp.892-901
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• 2018

SiC MOSFETs have been used to improve system efficiency in high frequency converters due to their extremely high switching speed. However, this can result in undesirable parasitic oscillations in practical systems. In this paper, models of the key components are introduced first. Then, theoretical formulas are derived to calculate the switching oscillation frequencies after full turn-on and turn-off in clamped inductive circuits. Analysis indicates that the turn-on oscillation frequency depends on the power loop parasitic inductance and parasitic capacitances of the freewheeling diode and load inductor. On the other hand, the turn-off oscillation frequency is found to be determined by the output parasitic capacitance of the SiC MOSFET and power loop parasitic inductance. Moreover, the shifting regularity of the turn-off maximum peak voltage with a varying switching speed is investigated on the basis of time domain simulation. The distortion of the turn-on current is theoretically analyzed. Finally, experimental results verifying the above calculations and analyses are presented.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.9
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• pp.1378-1385
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• 1990

In this paper we propose a model which can predict well the logical errors come from the charge redistribution in domino gates. In this model the effect of the intrinsic capacitance between gate and channel of MOSFET's is considered. This effect is more important than the parasitic capacitance effect. The error by the proposed model is only 8% of that by the currently used model. This model can be used as a guide-line in the design of domino circuits.