• Asian Journal of Business Environment
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• 제7권4호
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• pp.27-33
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• 2017

Purpose - The paper aims to explore the critical and uncover issues encountered to the supply-chain companies in launching halal based services in India. Research design, data, and methodology - After a meticulous review of relevant literature on the halal concept and halal logistics, researchers involved in a data collection by conducting semi-structured focus group interviews. Four groups with a maximum of 5 members each have chosen from the areas of transportation, warehousing, certification, and packaging. A total of 20 questionnaires were collected by applying purposive sampling method. Results - More than 95 percent of the chosen focus groups agreed that they know only about halal but don't have any exposure to halal logistics. The discussion has revealed that the adoption rate for halal transportation, warehousing, halal certification, and packaging is almost zero. The respondents were chosen only from transportation, warehousing, certification and packaging companies from south India which are operating throughout India. This research never attempts to be acquainted with the opinions of channel members who directly or indirectly involved in meeting customer demands. Conclusions - This is a ground-breaking effort aimed to study the critical issues related to Indian halal logistics which is beneficial to both logistic companies as well as to the academic world.

• 마이크로전자및패키징학회지
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• 제26권2호
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• pp.59-64
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• 2019

본 논문에서는 근적외선 다채널 형광 영상 시스템을 소개하고, 노출시간, 작동거리, 여기광의 강도에 따른 형광 영상 시스템의 특성에 대해 분석하였다. 노출시간이 길수록, 작동거리가 짧을수록, 여기광의 강도가 강할수록 형광신호가 증가하였다. 필터의 적절한 구성과 영상 모듈의 정밀한 패키징으로 배경신호의 증가를 억제하여 SBR이 증가하는 것을 확인하였다. 본 연구의 결과를 바탕으로 다채널 형광 영상 시스템을 활용할 수 있는 방안에 대해 제안하였다.

• 한국언어정보학회지:언어와정보
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• 제5권2호
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• pp.87-102
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• 2001

This paper deals with interpretation of pronouns in terms of Information Packaging Theory, proposed in Vallduvi(1994) and Engdahl and Vallduvi (1996), which depicts how discourse participants update new information, using three informational components: link, tail and focus. Based on empirical evidence, this paper argues that the information structure of an utterance is not enough for the hearer to process its information in accordance with the speaker's intention. It suggests that the hearer should be able to activate lexical file cards and frame file cards when necessary to designate the proper file card in which the information of the utterance should be recorded. It also proposes that, contrary to Vallduvi's claim, pronouns may create a new file card.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제8권10호
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• pp.3520-3537
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• 2014

Video copy detection methods have emerged in recent years for a variety of applications. However, the lack of efficiency in the usual retrieval systems restricts their use. In this paper, we propose a parallel implementation strategy for content based video copy detection (CBCD) by using a multi-core processor. This strategy can support video copy detection effectively, and the processing time tends to decrease linearly as the number of processors increases. Experiments have shown that our approach is successful in speeding up computation and as well as in keeping the performance.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.53-57
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• 2001

사출성형공정에서 미성형은 가장 빈번하게 발생하는 성형불량중의 하나이다. 이러한 미성형을 해결하기 위해 가상 경제적인 효율적인 방법은 공정조건을 개선하는 일이다. 그러나 대부분의 경우 사출 전문가의 오랜 기간 축적된 경험과 지식에 의존하기 때문에 여러 번의 시행착오을 겪어야 한다. 따라서 본 논문에서는 퍼지 알고리즘을 기반으로 하여 시스템에 적합한 공정조건을 찾는데 있어 시행착오를 줄이고, 또한 비전문가도 쉽게 적용학 수 있는 지능형 공정조건 생성 시스템을 제안하였다.

• 펄프종이기술
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• 제35권1호
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• pp.7-12
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• 2003

The test results for water repellency of paper and paperboard according to KS M 7057 can readily be influenced by an operator's bias. In order to discard such bias, the automatic analysis program of water repellency was developed based on different shape features of a liquid trace formed on a specimen. That is, the shape of a liquid track flowing down on the specimen with an angle of $45^{\circ}$ was evaluated according to width variation between head and tail of the trace($S_{Hr}$), uniformity of a liquid flow($S_{d}$), length of long traces($L_{SHr}$), eccentricity of liquid traces($E_{i}$), and then was recognized as a specific degree of water repellency. Finally, the automatic analysis system of water repellency based upon KS M 7057 made it possible to readily measure water resistance of paper and paperboards classified into R0 to R10.

• 펄프종이기술
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• 제37권3호
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• pp.41-49
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• 2005

Styrofoam as shock-absorbing materials for packaging has been regarded as one of non-biodegradable products leading to soil contamination at a landfill and release of dioxine during its incineration. For avoiding severe burdens on our environments by styrofoam, it must be replaced by environment-friendly materials. In order to evaluate availability of pulp fibers as a substitute for styrofoam, various extrusion processes were applied for making optimal biodegradable products. Then thermomechanical pulp fibers made of Pinus radiata and Pinus rigida were uniformly mixed with other additives such as starch and polyvinyl alcohol prior to expansion. The physical properties of the final products were examined by measuring expansion efficiency, compression strength, and elastic modulus. Wheat starch played a key role to maintain optimal flowing conditions within the barrel of the extruder irrespective of addition of soluble starch and polyvinyl alcohol. However, as the amounts of wheat starch in raw-materials increased, the elastic modulus of the expanded materials greatly increased. High elastic modulus is not suitable as shock-absorbing products for packaging. Thus the wheat starch must be added at a minimum if possible, that is, below 20% based on oven-dried weight of pulp fibers. the elastic modulus of the expanded products was decreased as their moisture contents increased. For the products containing 20% wheat starch, the lowest elastic modulus, 844.64 kPa was obtained under 10% of the moisture content. This was similar to that of styrofoam.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• Transactions on Electrical and Electronic Materials
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• 제17권5호
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.15-22
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• 2019

In these days, importance of the power electronic devices and modules keeps increasing due to electric vehicles and energy saving requirements. However, current silicon-based power devices showed several limitations. Therefore, wide band gap (WBG) semiconductors such as SiC, GaN, and $Ga_2O_3$ have been developed to replace the silicon power devices. WBG devices show superior performances in terms of device operation in harsh environments such as higher temperatures, voltages and switching speed than silicon-based technology. In power devices, the reliability of the devices and module package is the critically important to guarantee the normal operation and lifetime of the devices. In this paper, we reviewed the recent trends of the power devices based on WBG semiconductors as well as expected future technology. We also presented an overview of the recent package module and fabrication technologies such as direct bonded copper and active metal brazing technology. In addition, the recent heat management technologies of the power modules, which should be improved due to the increased power density in high temperature environments, are described.