• Title/Summary/Keyword: Paper-based packaging

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Mechanical Behavior Analysis and Strength Standardization of Paper Angle (종이 앵글의 역학적 거동 분석과 강도 표준화 연구)

  • Park, Jong-Min
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.11 no.1
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    • pp.1-10
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    • 2005
  • Paper angle, environment friendly packaging material, has been mainly used as an edge protector. But, we have perceived its application to package design of heavy product such as strength reinforcement or unit load system (ULS) in the future. Above all, understanding of buckling behavior for angle itself and compression strength and quality standard have to be accomplished for the paper angle to be used for this purpose. The purpose of this study was to elucidate the buckling behavior through theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, increasing rate of buckling of asymmetric paper angle was higher as applied load level was bigger and/or the length of angle was longer than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia was remarkably increased as the extent of asymmetric angle is bigger, and buckling orientation of angle was open direction near the small web. Increasing rate of maximum compression strength (MCS) for thickness of angle was smaller as the web size was bigger in symmetric angle. MCS of asymmetric angle of $43{\times}57$ and $33{\times}67$ was decreased $15{\sim}18%$ and $65{\sim}78%$, and change of buckling was increased $12{\sim}13%$ and $62{\sim}66%$, respectively.

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Design Optimization of Ball Grid Array Packaging by the Taguchi Method

  • Kim, Yeong-K.;Kim, Jae-chang;Choi, Joo-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.67-72
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    • 2010
  • In this paper, a design optimization of ball grid array packaging geometry is studied based on the Taguchi method, which allowed robust design by considering the variance of the input parameters during the optimization process. Molding compound and substrate were modeled as viscoelastic, and finite element analyses were performed to calculate the strain energy densities of the eutectic solder balls. Six quality factors of the dimensions of the packaging geometry were chosen as control factors. After performing noise experiments to determine the dominant factors, main experiments were conducted to find the optimum packaging geometry. Then the strain energy densities between the original and optimized geometries were compared. It was found that the effects of the packaging geometry on the solder ball reliability were significant, and more than 40% of the strain energy density was reduced by the geometry optimization.

LTCC-Based Packaging Technology for RF MEMS Devices (LTCC를 이용한 RF MEMS 소자의 실장법)

  • Hwang, Kun-Chul;Park, Jae-Hyoung;Baek, Chang-Wook;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1972-1975
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    • 2002
  • In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50 ${\Omega}$ matched coplanar waveguide(CPW) transmission line is employed as the test vehicle to evaluate the performances of the proposed package structure. The line is encapsulated with the LTCC packaging lid and connected to the via feed line. To reduce the insertion loss due to the packaging lid, the cavity with via post is formed in the packaging lid. The performances of the package structure is simulated with the different cavity depth and via-to-via length. Simulation results show that the proposed package structure has reflection loss better than 20 dB and insertion loss lower than 0.1 dB from DC to 30 GHz with the cavity depth and via-to-via length of 300 ${\mu}m$ and 350 ${\mu}m$, respectively. To realize the designed package structure, the cavity patterning is tested using the sandblast of LTCC.

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A Study on Sustainable Packaging for Flower Basket Design (지속 가능한 꽃바구니 디자인 패키징에 관한 연구)

  • Ahn, Hye Kyung;Kim, Heung Ryeol
    • Journal of the Korean Society of Floral Art and Design
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    • no.43
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    • pp.81-100
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    • 2020
  • Since sustainable packaging of flower basket designs that are sold from florist shops is needed for both the seller and the buyer, studying of second packaging of flower basket design has begun. In this study, based on the survey that has been done in 2019, and the analysis of the interview that has been done in 2020, the suggestion of sustainable packaging development is the purpose. The definition of flower basket design was done and surveys of the status of domestic flower basket designs' second packaging were done in accordance with the type of basket which is an object, transportation, and characteristic of a florist shop. For sustainable packaging, based on physical theory, second packaging which depends on the packaging that includes design factor, transportation final destination has to be different. The factors to be considered as sustainable packaging are the quality of opaque paper, the necessity of first packaging, packaging structure that can fix an object, the form of second packaging influenced by types of transportation. Suggestions for packaging development included new materials for first packaging, eco-friendly objects that can be recycled and reused, structural packaging design, standardization and variability of packaging, protection of floristry which is the fundamental purpose of packaging, and brand advertisement effect. Based on the result of this study further designs of packaging will be commercialized. This study is significant for serving the opportunity of new packaging design for futuristic floristry that fit for unmanned system and studying of categories of products.

A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J.
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.1
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    • pp.43-48
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    • 2002
  • Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

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A Thermal Model for Electrothermal Simulation of Power Modules

  • Meng, Jinlei;Wen, Xuhui;Zhong, Yulin;Qiu, Zhijie
    • Journal of international Conference on Electrical Machines and Systems
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    • v.2 no.4
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    • pp.441-446
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    • 2013
  • A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

Survey on Packaging Waste Occurrence and Recycling for Each Packaging Material in Europe (유럽의 포장 폐기물 발생 및 포장 재료별 재활용에 관한 고찰)

  • Kim, Doyeon;Ko, Euisuk;Lee, Hakrae;Shim, Woncheol;Yang, Liming;Kim, Jaineung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.23 no.1
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    • pp.17-26
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    • 2017
  • In order to confirm European packaging waste statistics, this study was investigated annual variability of packaging waste generated, target of recovery and recycling rate for packaging waste and recycling rate of European countries based on Eurostat database. Eurostat is regional society statistics organization designated by European community to distribute development, production and European statistics. From 2005 to 2013, paper and paperboard packaging were generated the largest amount among the total amount of packaging waste generated during the period and the share of main packaging materials were generally constant among the packaging materials. In addition, European Union member countries have established target for the recycling rate and recycling rate for packaging waste which has been well maintained by most EU countries since the 2008 directive was enacted. The recycling rate for whole packaging waste such as glass, paper and paperboard, metal, plastic, wood continues to increase in Europe. In this study, Europe packaging waste statistics were organized and analyzed as yearly transformation of Europe packaging waste occurrence and disposal, recycling rate and recovery rate target value of Europe countries and recycling rate of each country in Europe base on centralized Eurostat database. Moreover GDP reduction were also confirmed due to trend changes and indirect impacts such as economic slump by packaging waste and recycling.

A Survey on the Consumer Preferences for Korean Rice Cake Packaging in the Seoul Metropolitan Area (떡 포장 개선을 위한 국내 수도권 지역 소비자의 기호도 조사)

  • Choi, Woo-Suk;Park, Sang-Kyu;Lee, Youn-Suk
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.41 no.3
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    • pp.418-429
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    • 2012
  • In this study we surveyed the packaging preferences of consumers for Korean rice cakes as current commercial products in Korea. The questionnaire was developed from a preliminary investigation of typical rice cake packaging patterns and sent to 2332 residents in Korea by random sampling mail. The questionnaire contained questions on the preferences of interior design in packaging, opening methods, individually separated types, printing position, packaging methods, and packaging materials such as paper and plastic. There were responses from 304 residents. The collected data was analyzed by an SPSS package program. Most of the packaging used for Korean rice cakes was plastic (58.9%) which was used for packaging materials and stretch wrap (42.9%) as packing methods. The results showed the preference was the perforated line type used by hand for opening a packaging and interior packaging design with 2~3 partitions. Most respondents expressed an interest in using individual packaging and having printing directly on the packaging. Also, the respondents preferred the packaging design that let them see the contents of a package. Based on the results of the questionnaire, this paper suggested that most consumers would prefer to choose a packaging system with a partition design in a plastic container, individually separated products, and a transparent container for Korean rice cakes. The results of packaging preferences could provide important information for suitable packaging development for Korean rice cakes. Further research should be conducted to improve the shelf life of Korean rice cakes with functional packaging systems such as modified atmosphere packaging or anti-microbial packaging.

Preparation and Characterization of Sodium Caseinate (CasNa)/Transglutaminase (TG)-coated Papers for Packaging (포장용 Sodium Caseinate(CasNa)/Transglutaminase(TG) 코팅지 제조 및 특성 분석)

  • Hwang, Jihyeon;Kim, Dowan
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.28 no.2
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    • pp.81-87
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    • 2022
  • Paper is a promising alternative to petroleum-based plastic materials for sustainable packaging applications. However, paper exhibits poor gas and water vapor barrier properties, which restrict its effective application in the packaging industry. To enhance the properties of papers, sodium caseinate (CasNa)/transglutaminase (TG) coating solutions with various TG contents were prepared and coated on the papers. The chemical and morphological structures, mechanical properties, seal strength, and water vapor barrier properties of the coated papers were thoroughly investigated. The paper properties depended significantly on the chemical and morphological structures. Pristine CasNa and CasNa/TG coating solutions were evenly coated on the paper surfaces, without any cracks. The chemical structure of the CasNa/TG coated papers was slightly influenced by TG addition, resulting in increased elongation at break and enhanced water barrier properties. To promote the use of CasNa-coated papers in packaging applications, additional investigations must be performed to prevent gas and moisture permeation and enhance the mechanical strength of these papers via chemical reactions and introduction of organic/inorganic composites.

A SCORM-based e-Learning Process Control Model and Its Modeling System

  • Kim, Hyun-Ah;Lee, Eun-Jung;Chun, Jun-Chul;Kim, Kwang-Hoon Pio
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.5 no.11
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    • pp.2121-2142
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    • 2011
  • In this paper, we propose an e-Learning process control model that aims to graphically describe and automatically generate the manifest of sequencing prerequisites in packaging SCORM's content aggregation models. In specifying the e-Learning activity sequencing, SCORM provides the concept of sequencing prerequisites to be manifested on each e-Learning activity of the corresponding tree-structured content organization model. However, the course developer is required to completely understand the SCORM's complicated sequencing prerequisites and other extensions. So, it is necessary to achieve an efficient way of packaging for the e-Learning content organization models. The e-Learning process control model proposed in this paper ought to be an impeccable solution for this problem. Consequently, this paper aims to realize a new concept of process-driven e-Learning content aggregating approach supporting the e-Learning process control model and to implement its e-Learning process modeling system graphically describing and automatically generating the SCORM's sequencing prerequisites. Eventually, the proposed model becomes a theoretical basis for implementing a SCORM-based e-Learning process management system satisfying the SCORM's sequencing prerequisite specifications. We strongly believe that the e-Learning process control model and its modeling system achieve convenient packaging in SCORM's content organization models and in implementing an e-Learning management system as well.