• Title/Summary/Keyword: Pad thickness

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Precise composition control of Sn-3.0Ag-0.5Cu lead free solder bumping made by two binary electroplating (이원계 전해도금법에 의한 Sn-3.0Ag-0.5Cu 무연솔더 범핑의 정밀 조성제어)

  • Lee Se-Hyeong;Lee Chang-U;Gang Nam-Hyeon;Kim Jun-Gi;Kim Jeong-Han
    • Proceedings of the KWS Conference
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    • 2006.05a
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    • pp.218-220
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    • 2006
  • Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

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A Study on the Sleeve Cap Ease of Leather Garment (피혁 의류의 Sleeve Cap Ease 분량에 관한 연구)

  • 최보람;서미아
    • The Research Journal of the Costume Culture
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    • v.9 no.1
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    • pp.33-43
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    • 2001
  • In this study, both kinds of materials, that is, leather and woolen fabrics, which have similar thickness, have been adopted. To determine proper length of ease, not only sleeve cap height but also sleeve width has been adjusted mainly based on 5cm length of the ease, which follows maximum sleeve cap height, and then different length of ease, for example, 4cm, 3cm, 2cm and 1cm of ease, have been made. As a result, eighteen kinds in total of sleeves have been made: In other words, each nine kinds of both leather and woolen fabrics have different ease lengths. In addition, each sleeve has been inspected visually and functionally. Following conclusion has been gotten based on outcome of the study: 1. Proper ease length for manufacture of leather garment is said to be 1∼2 cm. As a result, ease length with higher sleeve cap height shall be 1∼2cm, while the length with lower sleeve cap height shall be 1cm or less. 2. Wider sleeve width has better function. Considering relations with sleeve cap height, sleeve width shall exceed +4cm of bicep line. 3. to satisfy a variety of those conditions while manufacturing leather garment, sleeve cap height, which is used for the manufacture of full dress and street wear garment, To lessen the ease length, body A.H shall be relatively loose under the arms, or pad shall be supplemented on the shoulder, so that the difference had better be lessened to solve such problems.

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A Study on the Initial Bonding Strength of Solder Ball and Au Diffusion at Micro Ball Grid Array Package (${\mu}BGA$ 패키지에서 솔더 볼의 초기 접합강도와 금 확산에 관한 연구)

  • Kim, Kyung-Seob;Lee, Suk;Kim, Heon-Hee;Yoon, Jun-Ho
    • Journal of Welding and Joining
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    • v.19 no.3
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    • pp.311-316
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    • 2001
  • This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

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Evaluation of design variables to improve noise radiation and insulation performances of a dash panel component of an automotive vehicle (방사소음 및 투과소음에 대한 승용차량 대시패널의 설계인자별 영향도분석)

  • Yoo, Ji-Woo;Chae, Ki-Sang;Park, Chul-Min;Suh, Jin-Kwan;Lee, Ki-Yong
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2011.04a
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    • pp.526-531
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    • 2011
  • A dash panel component, close to passengers, plays a very important role to protect heat and noise from a power train. Meanwhile, it is also a main path that transfers vibration energy and eventually radiates acoustic noise into the cavity. Therefore, it seems important to provide an optimal design scheme incorporating sound packages such as dash isolation pad and carpet, as well as structures. The present study is the extension of the previous investigation how design variables affect sound radiation, which was carried out using the simple plate and framed system. The system taken into account in this paper is a dash panel component of a sedan, which includes A pillar, front side member, dash panel and the corresponding sound packages. Design variables such as panel thickness and sound package layers are investigated how they are related for the better radiation performance (i.e. structure-borne) and sound transmission loss (i.e. air borne).

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Fabrication and Reliability Test of Device Embedded Flexible Module (디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가)

  • Kim, Dae Gon;Hong, Sung Taik;Kim, Deok Heung;Hong, Won Sik;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.84-88
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    • 2013
  • These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

Study of the immunosuppressive activity of methanolic extract of Madhuca longifolia (Koenig)

  • V., Chitra;Ganesh, Dhawle;Shrinivas, Sharma
    • Advances in Traditional Medicine
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    • v.10 no.3
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    • pp.150-154
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    • 2010
  • The immunosuppressive activity of the Methanol extract of bark of Madhuca longifolia (Koenig) consisting of a mixture of saponins, flavonoids, tannins, steroids, phenol and glycosides was studied on the immune responses in mice. Methanol extract of Madhuca longifolia (MLL) was administered orally at doses of 50, 100 and 150 mg/kg/day to healthy mice divided into four groups consisting of six animals each. The assessment of immunomodulatory activity was carried out by testing the humoral (antibody titre) and cellular (foot pad swelling) immune responses to the antigenic challenge by sheep RBCs. Furthermore, the effect on hematological parameters as well as relative organ weight was determined. On oral administration MML showed a significant decrease delayed type hypersensitivity (DTH) response whereas the humoral response to sheep RBCs was unaffected. Thus MLL significantly suppressed the cellular immunity by decreasing the footpad thickness response to sheep RBCs in sensitized mice. With a dose of 100 and 150 mg/kg/day the DTH response was $7.66{\pm}2.75$ and $6.41{\pm}1.21$ respectively in comparison to corresponding value of $14.50{\pm}2.38$ for untreated control group. These differences in DTH response were statistically significant (P < 0.05). The study demonstrates that MLL shows preferential suppression of the components of cell-mediated immunity and shows no effect on the humoral immunity.

Trend of hand dimensions for Koreans and Comparison with foreigners' data (한국인 손 치수의 추세 변동 및 외국 자료와의 비교)

  • Kee, Do-Hyung
    • Journal of Korean Institute of Industrial Engineers
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    • v.36 no.3
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    • pp.146-153
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    • 2010
  • The purposes of this are (1) to present representative five hand dimensions by measurement year, (2) to investigate hand characteristics based on relative ratios of varying hand dimensions and (3) to compare Korean hand dimensions to other countries' data. Comparing to those of 1979, statures of 2004 increased by 3.0~3.5%, while males' hand dimensions of hand length, medius finger length, hand circumference, hand breadth and hand thickness decreased by 2.0~5.0%. Ratios of hand dimensions to those of medius finger were not significantly different depending upon age group and gender, but were significantly different depending upon races of Korean and American. Hand lengths of Koreans were shorter by about 4.0% than those of Japanese irrespective of gender, while the other compared dimensions for Koreans were larger than those of Japanese. Hand dimensions used in this study of Koreans were generally smaller that those of Americans. It is recommended from this study that when designing hand relevant things including glove, computer keyboard, smart phone key pad, etc., the different hand characteristics found in this study be fully reflected to develop competitive products.

System Mode and Sensitivity Analysis for Brake Judder Reduction (브레이크 저더 개선을 위한 시스템 모드분석 및 민감도해석)

  • Hwang In-Jin;Park Gyung-Jin
    • Transactions of the Korean Society of Automotive Engineers
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    • v.13 no.6
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    • pp.142-153
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    • 2005
  • The brake judder is a phenomenon that the steering wheel is abnormally vibrating when the car is braked at a high speed. It is classified by the cold and the hot judder. The former is generated due to the initial uneven disk surface and the latter is resulted from the uneven heat spots on disc surface by repeatedly braking. There are two ways to reduce the judder. One is to control vibration by modification of the disk shapes and pad ingredients. The other is to improve modal characteristics of the suspension system. The latter approach is used in this research. In this paper, the real vehicle test and computer simulation are considered to systematically understand the judder phenomenon of the vehicle. The Macpherson strut suspension is employed. Especially, the judder sensitivity is calculated based on design sensitivity analysis. A bush stiffness was reworked and braking test was done to verify the sensitivity result. The judder reduction by the mode control was verified.

The Changes of Transfer film and friction Characteristics with the Relative Amounts of Raw Materials (자동차용 마찰재에서 각 원료의 상대량에 따른 전이막 형성 및 마찰특성의 변화)

  • Cho, Min-Hyung;Lee, Jae-Young;Kim, Dae-Hwan;Cheong, Geun-Joong;Choi, Chun-Rak;Jang, Ho
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2001.06a
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    • pp.271-280
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    • 2001
  • An NAO friction material (low-steel type) containing 15 ingredients was investigated to study the role of transfer film on the friction characteristics. The friction material specimens with extra 100% of each ingredient were tested using a pad-on-disk type tribotester. A non-destructive method of measuring the transfer film was developed by considering the electric resistance of the transfer film. Results showed that solid lubricants and iron powder assisted transfer film formation on the rotor surface. Average friction coefficient was independent of transfer film thickness in this experiment. On the other hand, the thick transfer film on the rotor surface reduced the amplitude of friction oscillation under temperature conditions ( 250$^{\circ}C$) that transfer film forms.

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An Automated Process Planning System of Lead Frame for Progressive Working (반도체 리드프레임의 프로그레시브 가공을 위한 공정설계 자동화 시스템)

  • Kim, Jae-Hun;Yun, Ji-Hun;Kim, Cheol;Kim, Byeong-Min;Choe, Jae-Chan
    • Transactions of Materials Processing
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    • v.7 no.6
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    • pp.554-561
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    • 1998
  • This paper describes a research work of developing a computer-aided design of lead frame semicon-ductor with piercing operation which is very precise for progressive working. An approach to the sys-tem is based on to knowledge-based rules. Knowledge for the system is formulated from plasticity theories experimental results and the empirical knowledge of field experts. This system has been writ-ten using AutoLISP to AutoCAD on a personal computer and is composed of three main modules which are input and shape treatment production feasibility check and strip-layout module. Based on the knowledge-based rules the system is designed by considering several factors such as material and thickness of product complexities of blank geometry and punch profile, and availability of press. Also strip-layout drawing generated by piercing operation according to punch profiles considered V-notch dimple. pad chamfer spank cavity punch camber and cross bow of lead frame is displayed in graphic forms. This system can be used by a novice who may not have any knowledge of tool design and will invrease efficiencies to the designer in this field.

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