• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• Journal of Welding and Joining
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• 제31권5호
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• 한국강구조학회 논문집
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• 제17권3호통권76호
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• pp.307-316
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• 2005

본 연구에서는 철도교량에 교량받침으로 사용될 수 있는 4종류의 고무패드의 사용상의 특성을 분석하고, 강성과 감쇠비를 결정하기 위한 방법을 제시하였다. 고무패드의 강성을 결정하기 위해서는 정적 실험을 통한 직접적인 방법과 동적 실험을 통한 간접적인 방법이 가능하다. 본 연구에서 두 가지 방법에 의해서 고무패드의 강성을 평가하고 비교하였다. 고무패드의 감쇠비는 동적 실험에 의해서만 파악이 가능하며 폴리우레탄 고무의 경우 천연고무나 크로로프렌 고무와 유사한 감쇠비를 가지는 것으로 나타났다. 폴리우레탄 고무는 천연고무나 크로로프렌 고무에 비해 경도가 크기 때문에 작은 면적으로도 큰 하중을 견딜 수 있으며, 또한 같은 형상계수를 가지는 패드에서도 더 큰 강성을 보여 철도교의 교좌로서 활용성이 더 큰 것으로 판단되었다. 천연고무나 크로로프렌 고무 패드는 수직하중에 의한 수평 변형이 크게 발생하는데 비해, 폴리우레탄 고무패드는 수직하중에 의한 수평방향의 변형이 거의 발생하지 않기 때문에 보강재에 의한 보강이 필요하지 않다.

• 한국의류산업학회지
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• 제16권6호
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• pp.1001-1007
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• 2014

We surveyed the wearing characteristics of hip protectors. The problems of existing hip protectors were identified and the directions for improvement were presented. The evaluation of wearing characteristics was conducted on the 100 elderly women (60 to 85 years) with 5 types of hip protector. The questionnaire was composed of history and characteristics on falling, hip protector acceptance, preference, use characteristics and improvement requirements. The result of wearing characteristic evaluation indicated that 52% of the subject experienced falling in winter. Incidents resulting from falling occurred: outdoors (74.5%), bathroom (10.9%), and kitchen (5.5%). Body parts to be protected were in several areas: 35.6% for lumbar, 26.9% for hip joint, and 15% for hip bone. Participants prefer a belt B type design at a rate of 56.9% because it provided a sense of stability by clinging to the body and upholding the waist. Belt B type was the most appropriate in terms of fit, allowance, mobility, and design except pad thickness. To reduce the risk of hip fracture, hip protector needs to be designed in consideration of user's type of fall and body shape. The pattern and size of a hip protector has to be improved in regards to the amount of discomfort. An objective evaluation is needed for the ergonomic design of a hip protector based on and analysis of 3D body image of the elderly and the shock-absorbing quality of pad.

• 대한치과의사협회지
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• 제54권1호
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• pp.49-56
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• 2016

An oro-antral fistula(OAF) is one of the most common complications after procedures at the maxillary posterior area. The purpose of this study was to introduce the closure of OAF with repair of the Schneiderian membrane. This case report includes three patients with OAF arising after dental surgery on molar region of maxilla. Under general anesthesia, fistulectomy was achieved in all three patients and the full thickness flap around OAF was raised. After removal of inflammatory tissue, the Schneiderian membrane was repaired with suture or application of fibrin sealant. Additional closures were then performed with a buccal fat pad flap and a buccal mucoperiosteal flap. All OAF in three patients enrolled in this study were closed successively without recurrence of fistula. Treatment of oroantral fistula using repair of the Schneiderian membrane is a good alternative option for patients with OAF accompanied by chronic maxillary sinusitis.

• 한국산업정보학회논문지
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• 제17권7호
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• pp.209-214
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• 2012

본 논문은 항만폐기물 수거에 및 관리에 자동인식 시스템인 RFID를 활용하기 위한 선행연구로써, 최근 급속히 늘고 있는 구리와 아연합금의 양식용 철제 가두리에 대하여 RFID를 부착하는 효율적인 방안을 제시하고자 한다. 이는 재활용률 향상과 환경오염 예방을 위하여 꼭 해결이 필요한 과제인데, 철제 가두리는 사용 환경 특성으로 인하여 수분이 함유된 철제 어구(fishing equipment)인 바, 금속 혹은 고무, 유리 등과 같은 물질에 RFID 태그를 부착할 때 발생하는 RFID 인식률과 관련된 중요한 기술적 난제인 RFID에너지의 반사와 흡수 현상을 극복할 수 있는 실용적 방안이 강구되어야 한다. 최근 스티로폼(Styrofoam)이나 합성수지 등을 이용하여 금속에 부착할 수 있는 900MHz 대역의 금속태그가 개발되어 보급되고 있으나, 이 또한 일반 태그에 비하면 가격이 상대적으로 고가인 현실적인 문제점이 있다. 본 연구에서는 전형적 금속형 어구인 철제 가두리를 대상으로 RFID 인식률 향상을 위한 스치로폼 패드(styrofoam pad) 활용 방안을 제시하고, 아울러 안테나 각도 등의 리더기 활용 최적조건 등을 실험을 통하여 살펴본다. 실험계획 및 분석은 다구찌(Taguchi)기법을 적용하였고, Minitab S/W를 활용하였다. 실험결과로써, 스티로폼 패드의 두께는 두꺼울수록 좋으며, 태그의 부착위치는 모서리(edge)부분, 리더기 각도는 $0^{\circ}$(정면)가 인식률이 가장 좋은 것으로 나타났다.

• The Korean Journal of Physiology and Pharmacology
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• 제15권6호
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• pp.363-369
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• 2011

The present study elucidated the effect of the selective inducible nitric oxide synthase (iNOS) inhibitor $N^6$-(1-iminoethyl)-L-lysine (L-NIL) on monosodium urate (MSU) crystal-induced inflammation and edema in mice feet. L-NIL (5 or 10 mg/kg/day) was administered intraperitoneally 4 h before injection of MSU (4 mg) into the soles of mice hindlimb feet. Twenty-four hours after MSU injection, foot thickness was increased by 160% and L-NIL pretreatment reduced food pad swelling in a dose dependent manner. Pretreatment of 10 mg/kg/day L-NIL significantly suppressed the foot pad swelling by MSU. Plasma level of nitric oxide (NO) metabolites and gene expression and protein level of iNOS in feet were increased by MSU, which was suppressed by L-NIL pretreatment. Similar pattern of change was observed in nitrotyrosine level. MSU increased the gene expression of tumor necrosis factor (TNF)-${\alpha}$ and interleukin (IL)-$1{\beta}$ and L-NIL pretreatment suppressed MSU-induced cytokines expression. The mRNA levels of superoxide dismutase and glutathione peroxidase1 were increased by MSU and L-NIL pretreatment normalized the gene expression. Phosphorylation of extracellular signal-regulated kinase 1/2 and p38 was increased by MSU, which was suppressed by L-NIL pretreatment. The mRNA levels of iNOS, TNF-${\alpha}$, and IL-$1{\beta}$ were increased by MSU in human dermal fibroblasts, C2C12 myoblasts, and human fetal osteoblasts in vitro, which was attenuated by L-NIL in a dose dependent manner. This study shows that L-NIL inhibits MSU-induced inflammation and edema in mice feet suggesting that iNOS might be involved in MSU-induced inflammation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.136-139
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• 2004

The requirement of planarity, such as with-in-wafer nonuniformity, post thickness range, have become increasingly stringent as critical dimensions of devices are decreased and a better control of a planarity become important. The key factors influencing the planarity capability of the CMP process have been well understood through numerous related experiments. These usually include parameters such as process pressures, relative velocities, slurry temperature, polishing pad materials and polishing head structure. Many study have been done about polishing pad and its groove structure because it's considered as one of the key factors which can decide wafer uniformity directly. But, not many study have been done about polisher head structure, especially about polisher head plate design. The purpose of this paper is to know how the plate structure can affect wafer uniformity and how to deteriorate wafer yield. Furthermore, we studied several new designed plate to improve wafer uniformity and also improve wafer yield.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• 한국철도학회논문집
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• 제19권4호
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• pp.498-505
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• 2016

간선철도 고속화에 대비하여 유지보수를 고려한 최적 자갈도상 궤도구조 정립을 위한 기초연구로 국내 자갈도상 궤도 구성품들을 조합한 실대형 시험을 실시하여 궤도 침하 특성을 분석하였다. 실대형 시험 결과 유지보수 저감을 위해서는 패드만을 고탄성화 하였을 경우의 효과는 미비하였으며, 패드의 고탄성화와 더불어 침목 중량화 또는 침목 중량화 및 도상두께를 증가 하였을 경우에 그 효과가 크게 나타났다. 간선철도 고속화에 따른 최적의 자갈도상 궤도구조는 초기 건설비와 본 논문에서 제시한 궤도 침하 특성에 따른 유지보수비를 고려한 경제성 분석을 통해 최종 정립되어야 할 것이다.