• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.434-437
• /
• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• 한국유체기계학회 논문집
• /
• 제6권4호
• /
• pp.21-28
• /
• 2003

CMP (Chemical Mechanical Polishing) is to achieve adequate local and global planarization for future sub-micrometer VLSI requirements. In designing CMP, numerical computation is quite helpful in terms of reducing the amount of experimental works. Stresses on pad, concentration of particles and particle tracking are studied for design. In this research, the optimization of grooved pad shape of CMP is performed through numerical investigation of slurry flow in CMP process. The result indicates that the combination of sinusoidal groove and skewed pad is the most optimal shape among the twenty candidates. Useful information can be obtained in velocity, pressure, stress, concentration of particles and particles trajectories, etc.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.645-649
• /
• 1997

In case of swash plate type axial piston hydraulic motor, hydrostatic bearing used to achieve the lubrication effect on the mechanical sliding contact areas between the following parirs ; sliooer-pad and swash plate,piston and cylinder bore,valve plate and cylinder block, etc. This study discussed the basic charateristic for the hydrostatic slipper-pad bearings with the capillary or orifice restrictor under static load condition. And, we also development of hydrostatic bearing tester for hydrostatic balancing test of pistion & slipper-pad assembly, and some experimental data on supply pressure step responce are reported.

• 국제초고층학회논문집
• /
• 제12권4호
• /
• pp.335-341
• /
• 2023

This study proposes a novel rotary direct evaporative cooler and investigates the potential of a moisture-wicking fabric as a cooling pad for the proposed evaporative cooler. The rotary direct evaporative cooler rotates the cooling pad to reduce the water and energy consumption of the pump compared to those of existing direct evaporative coolers. A moisture-wicking fabric is considered as the material of the cooling pad, because of its high moisture-wicking property, enhancing water evaporation. Experiments are performed under various inlet air conditions while measuring the air temperature, relative humidity, air velocity, and differential pressure. The evaporative cooling efficiency and impacts of the inlet air temperature and air velocity on the cooling performance are also evaluated. The results demonstrate the potential of the moisture-wicking fabric as cooling pad of direct evaporative cooler.

• 한국정밀공학회지
• /
• 제15권9호
• /
• pp.117-126
• /
• 1998

For investigating rubber pad sheet metal forming process, the rubber pad deformation characteristics as well as the contact problem of rubber pad-sheet metal has been analyzed. In this paper, the behavior of the rubber deformation is represented by hyper-elastic constitutive relations based on a generalized Mooney-Rivlin model. Finite element procedures for the two-dimensional responses, employing total Lagrangian formulations are implemented in an implicit form. The volumetric incompressibility condition of the rubber deformation is included in the formulation by using penalty method. The sheet metal is characterized by elasto-plastic material with strain hardening effect and analyzed by a commercial code. The contact procedure and interface program between rubber pad and sheet metal are implemented. Inflation experiment of circular rubber pad identifies the behaviour of the rubber pad deformation during the process. The various form dies and scaled down apparatus of the rubber-pad forming process are fabricated for simulating realistic forming process. The obtaining experimental data and FEM solutions were compared. The numerical solutions illustrate fair agreement with experimental results. The forming pressure distribution according to the dimensions of sheet metal and rubber pads, various rubber models and rubber material are also compared and discussed.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2008년도 추계학술대회논문집
• /
• pp.89-90
• /
• 2008

This paper studies the effect of pad at initial stage and wear during braking on the dynamic contact pressure distribution. Wear is influenced by variable factor (contact pressure, sliding speed, radius, temperature) during dynamic braking and variation in contact pressure distribution. Many researchers have conducted complex eigenvalue analysis considering wear characteristic with Lim and Ashby wear map. The conventional analysis method is assumed the pad has smooth and flat surfaces. The purpose of this paper is to validate that wear rate induced by braking is considered for the precise squeal prediction. After obtaining pad wear from experiment, it is incorporated with FE model of brake system. Finally, the comparisons in fugitive nature of squeal will be carried out between the complex eigenvalue analysis and noise dynamometer experiment.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.1068-1072
• /
• 1997

This work deals with on investigation the influence of various additives to a base stock cutting fluid in order to develop a better deep hold drilling. This investigation has been aiming at developing an oil which gives a maximum cutting efficiency at a minimum wear rate of the tool and the guiding pads. The purpose of study is to analyze how guide pad of tools, workpiece and the change of contained quantity of extreme pressure additive in cutting fluids have effects on the hold over size of cutting hole, surface roughness of workpiece,wear rates of guide pad and roundness during the deep hole machining of SM55C with solid BTA drill by using BTA drilling system through experiment. Conclusion reached is as follows. It has been proved that the contained quantity of surphur more affects machinability than that of extreme pressure additive of chlorine of cutting fluid in BTA drilling during Deep Hole Drilling. Considering its base oil, the the contained quantity of extreme pressure assitive of surphur can be different, but it's judged that the range of 1.5 ~ 2.0% is suitable to machinability for workpiece in BTA drilling. Regarding guide pad, it's judged that the reduction of wear is possible in propotion to the contained quantity of exrreme pressure additive of chlorine against supporting of cutting force and Bumishing operation of machining parts in cutting.

• 한국자동차공학회논문집
• /
• 제24권5호
• /
• pp.520-526
• /
• 2016

Squeal noise is a typical brake noise that is annoying to both passengers and pedestrians. Its frequency range is fairly wide from 1 kHz to 18 kHz, which can be distressful to people. The brake squeal noise occurs due to various mechanisms, such as the mode coupling of the brake system, self-excited vibration, unstable wear, and others. In this study, several parameters involved in the generation of a squeal noise are investigated experimentally by using a brake noise dynamometer. The speed, caliper pressure, torque, and friction coefficient are measured as functions of time on the dynamometer. The contact pressure and temperature distributions of the disc and the pad are also measured by using a thermal imaging camera and a pressure mapping system. As a result of the simultaneous measurement of the friction coefficient and squeal amplitude as functions of the velocity, it is found that the onset of the squeal may be predicted from the ${\mu}-v$ curve. It is also found that a non-uniform contact pressure causes instability and, in turn, a squeal. Based on the analysis results, design modifications of the pad are suggested for improved noise characteristics.

• Transactions on Electrical and Electronic Materials
• /
• 제8권2호
• /
• pp.67-72
• /
• 2007

High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.

• Tribology and Lubricants
• /
• 제20권5호
• /
• pp.284-291
• /
• 2004

We present a three-dimensional average flow model considering elastic deformation of pad asperities for chemical mechanical planarization. To consider the contact deformation of pad asperities in the calculation of the flow factor, three-dimensional contact analysis of a semi-infinite solid based on the use of influence functions is conducted from computer generated three dimensional roughness data. The average Reynolds equation and the boundary condition of both force and momentum balance are used to investigate the effect of pad roughness and external pressure conditions on film thickness and wafer position angle.