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http://dx.doi.org/10.9725/kstle.2004.20.5.284

Average Flow Model with Elastic Deformation for CMP  

김태완 (부산대학교 기계기술연구소)
구영필 (부경대학교 기계공학부)
조용주 (부산대학교 기계공학부)
Publication Information
Tribology and Lubricants / v.20, no.5, 2004 , pp. 284-291 More about this Journal
Abstract
We present a three-dimensional average flow model considering elastic deformation of pad asperities for chemical mechanical planarization. To consider the contact deformation of pad asperities in the calculation of the flow factor, three-dimensional contact analysis of a semi-infinite solid based on the use of influence functions is conducted from computer generated three dimensional roughness data. The average Reynolds equation and the boundary condition of both force and momentum balance are used to investigate the effect of pad roughness and external pressure conditions on film thickness and wafer position angle.
Keywords
CMP; flow factor; elastic deformation;
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