Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP |
Lee, Hyo-Sang
(Department of Chemical Engineering, University of Arizona)
DeNardis, Darren (Department of Chemical Engineering, University of Arizona) Philipossian, Ara (Department of Chemical Engineering, University of Arizona) Seike, Yoshiyuki (Asahi Sunac Corporation) Takaoka, Mineo (Asahi Sunac Corporation) Miyachi, Keiji (Asahi Sunac Corporation) Furukawa, Shoichi (Asahi Kasei EMD Corporation) Terada, Akio (Asahi Kasei EMD Corporation) Zhuang, Yun (Araca Incorporated) Borucki, Len (Araca Incorporated) |
1 | A. Philipossian and E. Mitchell, 'Dispersion number studies in CMP of interlayer dielectric films', J. Electrochem. Soc., Vol. 150, p. 0854,2003 DOI ScienceOn |
2 | L. Borucki, Y. Zhuang, and A. Philipossian, 'Physics and Modeling of Fundamental CMP Phenomena', Proc. of 22nd VLSI Multilevel Interconnection Conference, p. 175,2005 |
3 | J. Sorooshian, L. Borucki, D. Stein. R. Timon, D. Hetherington, and A. Philipossian, 'Revisiting the removal rate model for oxide CMP', Trans. ASME J. Tribology, Vol. 127, p. 639, 2005 DOI ScienceOn |
4 | Z. Li, L. Borucki, I. Koshiyama, and A. Philipossian, 'Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP', Journal of The Electrochemical Society, Vol. 151, p. G482, 2004 DOI ScienceOn |
5 | P. B. Zantye, A. Kumar, and A. K. Sikderb, 'Chemical mechanical planarization for microelectronics application', Materials Science and Engineering, Vol. 45, p. 89,2004 DOI ScienceOn |
6 | M. R. Oliver, 'Chemical-Mechanical Planarization of Semiconductor Materials', Springer, New York, p. 167,2003 |
7 | L. Borucki, T. Witelski, C. Please, P. Kramer, and D. Schwendeman, 'A theory of pad conditioning for chemical-mechanical polishing', Journal of Engineering Mathematics, Vol. 50, p. 1,2004 DOI |
8 | D. DeNardis, Y. Seike, M. Takaoka, K. Miyachi, and A. Philipossian, 'Investigation of High-Pressure Micro Jet Technology as an Alternative to Diamond Conditioning in ILD CMP', Wear, In press, 2005 |
9 | Y. Seike, D. DeNardis, M. Takaoka, K. Miyachi, and A. Philipossian, 'Development and analysis of a High-Pressure Micro Jet pad conditioning system for interlayer dielectric chemical mechanical planarization', Jpn. J. Appl. Phys., Vol. 44, p. 1225,2005 DOI |