• 소성∙가공
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• 제15권1호
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• 지역사회간호학회지
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• 제19권4호
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• pp.696-703
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• 2008

Purpose: To Perform a randomized comparative study investigating the effects of Pelvic Floor Muscle Exercise(PME) and Magnetic Stimulation Therapy(MST) and to identified the problems in each of PME & MST Method: Forty-nine patients with mild stress incontinence were randomly assigned to either of two treatment groups (24 patients in the PME group and 25 in the MST group). The PME group had a video exercising program for 40 times every day during 6 weeks. The MST group was treated with BioCon-2000TM, 2times/ week for six weeks. Pre-test and post-test were performed by Prineometer, 1-hour pad test. and Jackson's BFLUTS questionnaire of Jackson. Collected data were analysed using SAS 9.1 by frequency, Kolmogorov-Smirnov Z. Chi Square-test, t-test, Fisher Exact probability test, Paired t-test, and Wilcoxon's rank sum test. Results: In comparison between before and after PME and MST, statistically significant difference was observed in maximal vaginal pressure, duration of vaginal contraction, amount of urine, and symptom of urination. In the comparison of the effectiveness between PME & MST, only the maximal of vaginal pressure (Z=2.58, p= .010) was significantly different. Conclusion: The factor more effective in the MST group than in the PME group was high compliance.

• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• 항공우주기술
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• 제12권1호
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• pp.73-80
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• 2013

한국형발사체 시스템설계 형상에 대해 전산유동해석(CFD) 기법을 이용하여 공력 특성 및 하중을 예측하였다. 이전 형상에 비하여 엔진 카울이 없어짐에 따라 축력과 수직력이 감소하였으며, 압력 중심이 전방으로 크게 이동하였다. 그리고 하중 해석을 위해 비행 중 및 발사대 대기 중의 공력 하중을 산출하였다. 공력 계수 및 공력 하중 해석 결과는 다음 설계 단계의 임무 설계 및 구조 해석 분야에 활용된다.

• 대한치과보철학회지
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• 제21권1호
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• pp.59-66
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• 1983

Distal extension partial dentures are supported by both the relatively rigid teeth and the resilient mucosa. So impression techniques of residual alveolar ridge in case of distal extension partial denture have particular importance in order to broad distribution of the masticatory force. McLean recognized the need for recording the tissues supporting distal extension partial denture base in functional form to equalize the resilient and non-resilient support, and this was called functional impression. Many investigators proposed various techniques of the functional impression for a distal extension partial denture, but only a little studies were performed about displacement of soft tissue under distal extension partial denture base. The purpose of this study is to investigate the amount of vertical displacement of the soft tissue under distal extension partial denture base by different functional impression techniques. Impression techniques used were Z.O.P. Impression, Selective Tissue Placement Impression, Functional Relining Impression. Measurement of the vertical displacement of soft tissue were made with Depth Gauge and Measuring Platform. A Anatomic Impression was used as a control. The results were tested statistically using 3 way ANOVA and Scheffe test. The followings were the results obtained from this study. 1. The greatest amount of soft tissue displacement was observed in the center of the retromolar pad. 2. No significant differences were found between the crest of alveolar ridge and the buccal shelf area. 3. The greatest soft tissue displacement was observed in Functional Relining Impression using Iowa wax, and the least displacement was observed in Selective Tissue Placement Impression using murcaptan rubber base. 4. No significant differences were found between finger pressure and biting pressure in Z.O.P. Impression, but greater displacement was observed by biting pressure than finger pressure in Functional Reling Impression.

• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Transactions on Electrical and Electronic Materials
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• 제8권1호
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• pp.5-10
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• 2007

Using a reference slurry, ammonium dodecyl sulfate (ADS), an anionic and environmentally friendly surfactant, was investigated as an alternative to BTA for its inhibition and lubrication characteristics. Results demonstrated that the inhibition efficiency of ADS was superior to that of BTA. Coefficient of friction (COF) was the lowest when the slurry contained ADS. This suggested that adsorbed ADS on the surface provided lubricating action thereby reducing the wear between the contacting surfaces. Temperature results were consistent with the COF and removal rate data. ADS showed the lowest temperature rise again confirming the softening effect of the adsorbed surfactant layer and less energy dissipation due to friction. Spectral analysis of shear force showed that increasing the pad-wafer sliding velocity at constant wafer pressure shifted the high frequency spectral peaks to lower frequencies while increasing the variance of the frictional force. Addition of ADS reduced the fluctuating component of the shear force and the extent of the pre-existing stick-slip phenomena caused by the kinematics of the process and collision event between pad asperities with the wafer. By contrast, in the case of BTA, there were no such observed benefits but instead undesirable effects were seen at some polishing conditions. This work underscored the importance of real-time force spectroscopy in elucidating the adsorption, lubrication and inhibition of additives in slurries in CMP.

• 대한기계학회논문집A
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• 제38권12호
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• pp.1351-1358
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• 2014

본 논문은 차량 제동 시 발생하는 소음의 원인을 해석적으로 예측하고, 본 실험실에서 제작한 브레이크 다이나모 메터를 이용하여 실험적으로 검증하였다. 압력 변화에 따른 브레이크 시스템에 대한 주파수 응답 시험 및 유한 요소 해석(FEM)을 실시하여 캘리퍼 및 디스크의 수직 모드(Out-of-plane)의 시스템 주파수를 추적하였다. 이를 제동 시 발생한 스퀼 소음의 주파수와 비교해본 결과 스퀼 주파수는 캘리퍼 및 패드의 변위를 갖는 시스템 모드임을 확인하였다. 또한 유한 요소 해석을 이용한 복소수 고유치 해석 결과 패드의 회전변위를 발생시키는 캘리퍼 모드가 음의 마찰곡선 기울기와 연동하여 불안정하게 됨을 확인하였다.

• 대한기계학회논문집A
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• 제35권10호
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• pp.1229-1235
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• 2011

신뢰성이 가장 우수한 프레팅 피로손상 파라미터를 찾아내기 위해 알루미늄 합금 A7075-T6 을 대상으로 피로시험을 수행하였다. 시편 표면에 홈을 가공하여 패드 접촉압력에 따라 패드-시편 접촉면에서 프레팅 피로균열이 발생하거나 또는 홈에서 일반 피로균열이 발생할 수 있게 하였다. 광학현미경을 이용하여 균열의 발생위치와 방향을 측정하고, 문헌에서 가장 많이 사용되는 프레팅 피로손상 파라미터들의 신뢰성을 평가하였다. 파라미터 값과 최대손상평면 방향을 산출하는데 필요한 응력과 변형률 자료는 유한요소해석으로 산출하였다. 전단모드 피로파손을 가정하는 Fatemi-Socie 파라 미터와 McDiarmid 파라미터가 가장 신뢰성이 높은 것으로 판명되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.