• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.572-577
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• 2012

Recently porous polymer has widely been applied to packaging, heat isolation, and sound absorption in various fields from the electrics to the automobiles industry. A lot of micro porosities inside foamed polymer provide lower heat conduction and lighter weight than non-porous polymer, because they involve gas or air during foaming process. In this paper experimental approaches of the UV laser micro machining behavior for Expanded Polypropylene (EPP) foamed polymer materials, which have different expansion rates, were investigated. From these results, the ablation phenomena were finally observed that the ablation is depended upon stronger photo-chemical than photo-thermal effect. This study will also help us to understand interaction between UV laser beam and porous polymer.

• Journal of the Korean Society of Food Science and Nutrition
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• v.25 no.6
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• pp.932-936
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• 1996

Scallop, Pectinopecten yessoenis(Jay), cultivated in the cold east coast of Kwangwon region, Korea, is expected be to produced about 50, 000 tons in the year 2000. Scallop, first of all should be exuviated to process for new goods. In this study, vacuum and nitrogen packagings were applied to extend the shelf-life of exuviated scallop boiled with steam for 10 min. Vacuum and nitrogen packagings retarded the decrease in pH, whereas inhibited the production of $NH_2-N, $ VBN, TMA, and TBA of exuviated scallop stored at $5^{\circ}C.$ They also inhibited the microbial growth. But, there was no significant difference in the bacteriostatic effects between both packaging methods. The estimated shelf-lives of boiled and exuviated scallops for control, vacuum, and nitrogen packagings were about 30, 36, and 36 days, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Journal of the Korean Society for Precision Engineering
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• v.30 no.7
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• pp.702-708
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• 2013

The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2217-2220
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• 2007

In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1383-1388
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• 2015

Proportional integral derivative (PID) control is one of the conventional control strategies. Industrial PID control has many options, tools, and parameters for dealing with the wide spectrum of difficulties and opportunities in manufacturing plants. It has a simple control structure that is easy to understand and relatively easy to tune. Injection mold is warming up to the idea of cycling the tool surface temperature during the molding cycle rather than keeping it constant. This “heating and cooling” process has rapidly gained popularity abroad. However, it has discovered that raising the mold wall temperature above the resin’s glass-transition or crystalline melting temperature during the filling stage is followed by rapid cooling and improved product performance in applications from automotive to packaging to optics. In previous studies, optimization methods were mainly selected on the basis of the subjective experience. Appropriate techniques are necessary to optimize the cooling channels for the injection mold. In this study, a digital signal processor (DSP)-based PID control system is applied to injection molding machines. The main aim of this study is to optimize the control of the proposed structure, including a digital PID control method with a DSP chip in the injection molding machine.

• Journal of the Korean Applied Science and Technology
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• v.26 no.3
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• pp.288-296
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• 2009

In this study, the silica-based hybrid material with high barrier property was prepared by incorporating ethylene-vinyl alcohol (EVOH) copolymer, which has been utilized as packaging materials due to its superior gas permeation resistance, during sol-gel process. In preparation of this EVOH/$SiO_2$ hybrid coating materials, the (3-glycidoxy-propyl)-trimethoxysilane (GPTMS) as a silane coupling agent was employed to promote interfacial adhesion between organic and inorganic phases. As confirmed from FT-IR analysis, the physical interaction between two phases was improved due to the increased hydrogen bonding, resulting in homogeneous microstructure with dispersion of nano-sized silica particles. However, depending on the range of content of added silane coupling agent (GPTMS), micro-phase separated microstructure in the hybrid could be observed due to insufficient interfacial attraction or possibility of polymerization reaction of epoxide ring in GPTMS. The oxygen barrier property of the mono-layer coated BOPP (biaxially oriented polypropylene) film was examined for the hybrids containing various GPTMS contents. Consequently, it is revealed that GPTMS should be used in an optimum level of content to produce the high barrier EVOH/$SiO_2$ hybrid material with an improved optical transparency and homogeneous phase morphology.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.6
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• pp.636-641
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• 2014

This paper discusses the fabrication process for a Nipkow disk using micro-lens and pinhole disks. The confocal measuring system that uses the Nipkow disk has the advantage in measuring speed, because the Nipkow disk can simultaneously provide confocal images of all pixels in a CCD camera without requiring a lateral scanning unit. A micro-lens configuration, which focuses illumination on a pinhole, overcomes the low optical efficiency of the Nipkow disk system and allows its use in practical applications. This paper describes how to design the Nipkow disk in terms of numerical aperture, particularly for measuring the height of solder bumps in packaging application and for hybrid processes combining mechanical and semiconductor processes.

• Food Science and Biotechnology
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• v.14 no.5
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• pp.694-697
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• 2005

The objectives of this study were to compare the quality changes of cheese slices individually packed in four kinds of edible pouches in order to select the most suitable variety for individual packaging. The edible Z2 pouch (zein with oleic acid) was selected as maintaining the best cheese qualities based on the physical and microbiological changes undergone by the samples over 4-week storage at $5^{\circ}C$. The cheese sample individually packed in Z2 inner edible pouch and repacked in a plastic (OPP/LLDPE) outer pouch was not significantly different in physical and microbiological changes from that individually packed in a plastic (OPP/LLDPE) inner pouch and repacked in a plastic (OPP/LLDPE) outer pouch. Therefore, it may be concluded on the basis of the physical and microbiological evidence that the Z2 edible pouch can be used as an inner package for cheese slices when it is inside a plastic outer pouch.

• Journal of Sensor Science and Technology
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• v.7 no.3
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• pp.211-217
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• 1998

Si and ITO-coated #7059 glass wafers were electrostatically bonded by employing #7740 interlayer. It was inferred that the thermionic- electrostatic migration of $Na^{+}$ ions in the #7740 interlayer played an important role in the bonding process through SIMS analysis. The temperature and voltage required for reliable electrostatic bonding were in the range of $180{\sim}200^{\circ}C$ and $50{\sim}70V_{dc}$(10min), respectively. The low temperature Si-ITO coated glass bonding can be effectively applied to the packaging of field emission devices.