• Industrial Engineering and Management Systems
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• v.3 no.1
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• pp.71-77
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• 2004

In this paper, the difficulties involved in analyzing and designing a management system for product development are discussed with reference to reducing the impact of products on the environment. We propose some models and methods to analyze information behavior in the process of product development based on a fusion model which integrates the assessments of users’ needs, the environment, and available technology. These models and methods are subsequently applied to the development of a new packaging material. The results of this case study allow us to identify effective information for the design of a management system for product development to reduce the impact of products on the environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.76-79
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• 2003

The characteristic of single wall carbon nanotube (SW-CNT) and herringbone nano fiber (HB-CNF) emitters was described. SW-CNT synthesized by arc discharge and HB-CNF prepared by thermal CVD were mixed with binders and conductive materials, and then were formed by screen-printing process. In order to obtain efficient field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNT and CNF emitters. The basic structure of FED was of a diode type through fully vacuum packaging. Also, we proposed a new triode type of field emitter using a mesh gate plate having tapered holes and could achieve the ideal triode properties with no gate leakage currents.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• Journal of Korean Society for Quality Management
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• v.25 no.2
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• pp.83-101
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• 1997

We have developed three evaluation checklists of educational softwares for users such as, learners, teachers and parents, not for the software develops or designers. This study has especially focused on CD-ROM titles and softwares on the internet. The followings were selected as the essential attributes that the educational softwares of high quality should possess : ease of use, technical support and interest of learning for learners, educational value and smartness for teachers, packaging integrity, investment value and childproof for parents. The evaluation checklists were developed on the basis of evaluation criteria which were concretion of the essential attributes. The validity of the evaluation checklists was supported by a theoretical study for the development of ckecklists and the actual development process. The interrater reliability and the retest reliability were confirmed by statistical methods. Thus, the developed checklists can be a useful tool to evaluate educational softwares. This study will contribute to improvement of the software quality and help users in selecting educational softwares.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.137-137
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• 2010

Copper electroplating is a very popular and important technology for depositing high-quality conductor interconnections, especially in through silicon via (TSV). As this advanced packaging technique developing, a mass of copper and chemical solution are used, so attention to these chemical materials into the utilization and costs can not be ignored. An economical and practical real-time chemical solution monitoring has not been achieved yet. Either Red-green-blue (RGB) or optical emission spectroscopy (OES) color sensor can successfully monitor the color condition of solution during the process. The reaction rate, uniformity and quality can map onto the color changing. Hidden Semi Markov model (HSMM) can establish mapping from the color change to upper indicators, and artificial neural network (ANN) can be integrated to comprehensively determine its targets, whether the solution inside the container can continue to use.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.62-65
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• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• Journal of Information Technology Applications and Management
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• v.28 no.3
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• pp.127-135
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• 2021

This study aims to find the main factors to influence consumers' purchase of dairy products. To do so, we examined experts' opinions to verify the priorities of the factors. The four main factors were derived from the previous studies, product factor, marketing factor, quality factor, and social factor. Using analytic hierarchy process (AHP), we empirically analyzed and tested the results from survey. Based on the AHP analysis, the expert group recommended to improve the packaging, brand, and shelf lie of dairy products for the marketing factor, for instance. The results of this study can contribute to the development of the dairy products for the future to reveal the importance of the selecting factors.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.1155-1160
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• 2009

The trend in construction industry, now, lies in improving efficiency and competitive power in construction management and on-the-spot instruction by combining with new IT technology. Above all, it is safe to say that the application of RFID technology can play a pivotal role at this point, but it is not that easy to apply RFID due to the physical, chemical and environmental peculiarities of construction materials. Thus, a study on the standardization of the usable frequency, specifications, protocol, and package administration is required. This study, as part of the study on the standardization, figured out the restrictions by attaching the existing RFID Tag to the construction materials, turned out the prototype of RFID Tag to perform a field test. In result the effective recognition range varies according to the physical and environmental peculiarities of construction materials; and the management efficiency varies as the attaching method and/or applying method. To analyze the management method (media, process etc.) systematically for the existing construction materials; to prepare more various restrictions and its solutions for practical construction spots will be the key for successful RFID implementation.