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http://dx.doi.org/10.4313/JKEM.2007.20.4.352

Fabrication and Reliability Properties of Thin film Resistors with Low Temperature Coefficient of Resistance  

Lee, Boong-Joo (인하대학교 전기공학과 기능성박막연구실)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.20, no.4, 2007 , pp. 352-356 More about this Journal
Abstract
The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.
Keywords
Thin film resistor; Sputtering method; TCR (Temperature coefficient of resistance); Reliability;
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