A New Approach of Intensity Predictio in Copper Electroplating Monitoring Using Hybrid HSMM and ANN

Copper electroplating is a very popular and important technology for depositing high-quality conductor interconnections, especially in through silicon via (TSV). As this advanced packaging technique developing, a mass of copper and chemical solution are used, so attention to these chemical materials into the utilization and costs can not be ignored. An economical and practical real-time chemical solution monitoring has not been achieved yet. Either Red-green-blue (RGB) or optical emission spectroscopy (OES) color sensor can successfully monitor the color condition of solution during the process. The reaction rate, uniformity and quality can map onto the color changing. Hidden Semi Markov model (HSMM) can establish mapping from the color change to upper indicators, and artificial neural network (ANN) can be integrated to comprehensively determine its targets, whether the solution inside the container can continue to use.