• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.2
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• pp.72-78
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• 2020

Demand for cosmetics with functionality and eco-friendliness has increased dramatically due to recent aging, well-being trends, and increased interest in beauty. Cosmetics production in 2014 was 8,970.4 billion won, an increase of about 50% compared to 6,014.6 billion won in 2010. In the midst of this, similar companies in intense competition are pursuing differentiated strategies and innovation activities to solve quality, price and delivery problems. In particular, cosmetics packaging work is getting more difficult due to the increasing bill of materials (BOM) and difficult assembly methods. Therefore, in this study, the following problems were identified and suggestions for the improvement of the packaging Many research laboratories such as biotechnology, chemistry, and pharmaceuticals, which are undergoing various studies, are equipped with ready-made laboratory safety equipments such as bio-safety workbenches, aseptic bases, and exhaust workbenches. However, most researchers are disadvantaged in using existing safety equipment. This is because existing safety equipment can not take into account all of the unique characteristics of the research. For this reason, researchers are demanding the development of customized safety equipment that is well suited to their research needs. process of Company C, which is facing difficult situation to respond to the customer 's delivery due to the 52 - hour work week. First, we used the stopwatch to find the difficulty process in the packaging process and show ways to improve it. Second, to improve the efficiency of line balancing in the packaging process, we integrate processes, improve work methods, and perform simple automation. As a result, the prepare loss for replacement was reduced by 1 minute from 5 minutes, resulting in a 23% increase in productivity from 112 ea./hour to 137ea./ hour per person. At this time, the LOB of the packaging process was improved from 70% to 82% by operating one more production line through one person per line, total 9 people saving.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.3
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• pp.105-111
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• 2009

In this work, source reduction of poly ethylene terephthalate (PET) packaging are discussed as aspect of sustainability, such as reuse, refill and recycling through the various treatment methods and historical studies for municipal solid waste (MSW) disposal. Since PET has good chemical, physical and mechanical properties, and provides good oxygen and carbon dioxide barrier properties, PET is one of the most widely used thermoplastic polyester in the U.S. and around the world. As the demand for non-renewable PET is increasing, several approaches have been developed to meet economical feasibility and environmental responsibility without degrading material performance. Several companies, such as Coca-Cola Co., Easterform Packaging Co. and Kraft, have tried to develop lightweight PET bottle, and some of lightweight PET bottles are already commercialized. Reuse and refilling for PET container is well developed in Europe, such as Denmark, German and Netherland by supportive legislation and policies. Recycling process is the best way to economically reduce PET waste. In consequence, advanced technique and further development must be provided due to increasing PET packaging waste.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.42-48
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• 2023

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.2
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• pp.65-71
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• 2018

Paper packs, glass bottles, metal cans, and plastic materials are classified according to packaging material recycling groups that are Extended Producer Responsibility (EPR). In the case of waste paper pack, the compressed cartons are dissociated to separate polyethylene films and other foreign substance, and then these are washed, pulverized and dried to produce toilet paper. Glass bottle for recycling is provided to the bottle manufacturers after the process of collecting the waste glass bottle, removing the foreign substance, sorting by color, crushing, raw materializing process. Waste glass recycling technology of Korea is largely manual, except for removal of metal components and low specific gravity materials. Metal can is classified into iron and aluminum cans through an automatic sorting machine, compressed, and reproduced as iron and aluminum through a blast furnace. In the case of composite plastic material, the selected compressed product is crushed and then recycled through melt molding and refined products are produced through solid fuel manufacturing steps through emulsification and compression molding through pyrolysis. In the recycling process of paper packs, glass bottles, metal cans, and plastic materials, the influx of recycled materials and other substances interferes with the recycling process and increases the recycling cost and time. Therefore, the government needs to improve the legal system which is necessary to use materials and structure that are easy to recycle from the design stage of products or packaging materials.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.143-148
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• 2004

The blister packaging is applied to many fields in recent years for its merit that it enable consumer to see the products. The most of battery packaging are blister type. However, the lithium battery is dealt with very carefully in packaging because of its explosion. The existing packaging machines lot lithium battery are mostly adapted alkaline packaging machine and their capacity is very inferior to other process, either. In this paper, the virtual prototype of the automatic blister packaging system for lithium battery which has new mechanism is developed and its performance is evaluated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.149-154
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• 2003

The blister packaging is applied to many fields in recent years for its merit that it enable consumer to see the products. The most of battery packaging are blister type. However, the lithium battery is dealt with very carefully in packaging because of its explosion. The existing packaging machines for lithium battery are mostly adapted alkaline packaging machine and their capacity is very inferior to other process, either. In this paper, the virtual prototype of the automatic blister packaging system for lithium battery which has new mechanism and 240A/min capacity is developed and its performance is evaluated.