• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.9-43
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• 1999

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

• 소성∙가공
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• 제13권3호
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• pp.211-215
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• 2004

Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

• 한국정보통신학회논문지
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• 제16권5호
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• pp.1029-1034
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• 2012

본 논문에서는 US-PCS(US-personal communications services)를 위해 사용이 가능한 저가격 고성능 FBAR (film bulk acoustic resonator) 듀플렉서(duplexer) 모듈(module)을 제시하였다. FBAR 소자는 일반적인 실리콘(Si) 기반의 공정보다 가격경쟁력이 우수한 유리(glass) 웨이퍼 기반의 패키지를 개발하여 적용하였다. FBAR 듀플렉서 모듈의 전송단(Tx)과 수신단(Rx)에서 얻어진 최대 삽입손실 특성은 각각 1.9 dB와 2.4 dB이다. 전송단 및 수신단 FBAR 소자와 본딩(bonding)된 유리 기반의 웨이퍼 및 PCB 기판과 몰딩(molding) 물질을 모두 포함하는 FBAR 듀플렉서 모듈의 전체 두께는 1.2 mm이다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• 한국전자파학회논문지
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• 제23권8호
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• pp.958-966
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• 2012

본 논문에서는 저온 동시 소성 세라믹(Low Temperature Co-fired Ceramic: LTCC) 기술을 사용하여 블루투스와 WiFi에서 동작하는 무선 전단부 모듈(RF Front-end Module)을 설계, 구현하였다. 무선 전단부 모듈은 2.4/5 GHz 대역 다이플렉서와 2 GHz 대역 발룬, 5 GHz 대역 발룬, 그리고 송 수신용 SPDT 스위치와 SP3T 스위치로 구성되어 있다. LTCC의 설계에 있어, 적층 구조의 특성으로 인해 발생되는 예상 기생 성분은 시뮬레이션을 활용하여 설계하였다. 제작한 무선 전단부 모듈은 내부 접지(inner ground) 3개 층을 포함하여 총 13개 패턴으로 구성되었으며, 무선 전단부 모듈의 크기는 $3.0mm{\times}3.7mm{\times}0.66mm$이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1108-1109
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• 2008

To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. Recently, the thickness of solar cell gets thinner to reduce the quantity of silicon. And the reduced thickness make it easy to be broken while PV module fabrication process. Solar cell's micro cracks are increasing the breakage risk over the whole value chain from the wafer to the finished module, because the wafer or cell is exposed to tensile stress during handling and processing. This phenomenon might make PV module's maximum power and durability down. So, when using thin solar cell for PV module fabrication, it is needed to optimize the material and fabrication condition which is quite different from normal thick solar cell process. Normally, gel-content of EVA sheet should be higher than 80% so PV module has long term durability. But high gel-content characteristic might cause micro-crack on solar cell. In this experiment, we fabricated several specimen by varying curing temperature and time condition. And from the gel-content measurement, we figure the best fabrication condition. Also we examine the crack generation phenomenon during experiment.

• Journal of international Conference on Electrical Machines and Systems
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• 제2권4호
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 춘계학술발표대회 논문집
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• pp.92-97
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• 2008

To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. The properties of Ethylene Vinyl Acetate(EVA) sheet in photovoltaic encapsulant materials have to meet conditions that are high optical transmittance, good adhesion and high cross-linking rate. The objective of this paper is to understand the property evaluation methods of EVA sheet. Through this research, we could confirm that properties of EVA sheet have an effect on durability and operating efficiency of photovoltaic module.

• 마이크로전자및패키징학회지
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• 제11권2호
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• pp.49-52
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• 2004

세라믹 모듈 내부에 내장되는 인덕터와 캐패시터와 같은 수동소자들은 주변 소자 및 패턴의 영향으로 모듈 내부에서는 변형된 특성을 갖게 된다. 이 때문에 수동소자들의 특성을 모듈내부에 내장된 상태로 추출하는 것이 가장 정확하다. 본 연구에서는 세라믹 VCO를 개발함에 있어서 전체 회로를 공진부와 발진부로 나누어서 각 block의 특성을 측정하였고 이를 통해 VCO의 고주파수 거동을 예측하여 개발에 활용할 수 있도록 하였다.