• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.13-23
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• 2022

Demand and interest in electric vehicles are increasing rapidly due to environmental issues. Improving the performance of electric vehicles requires the development of automotive batteries and battery joining technologies. Aluminum alloys are the most widely used metals in the electric vehicle industry, and aluminum bonding is used in all processes comprising automotive batteries. Therefore, in this paper, based on the characteristics of aluminum and aluminum alloys and knowledge of various aluminum joining technologies, the main and the next generation bonding technologies used in automotive battery are reviewed. It also explains the structure of automotive secondary battery cells and the integration order of 'cell-module-pack' where joining is used in the process, also various environmental conditions that must be considered when joining.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.67-75
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• 2020

In this paper, by applying LCP substrate, the capacitor and inductor are implemented with a variety of value that can be used in 35 GHz circuits. Depending on how to apply it to the circuit, it is required high value by designing the basic structures such as electrode capacitor and spiral inductor. However they are not available in high-frequency domain, because their SRF(Self-Resonant Frequency) is lower than the frequency of 35-GHz. By finding the limit, this paper devised classifying passive devices for the DC and the high-frequency domain. The basic structure is suitable for DC and microstrip λ/8 length stub structure can be used for high-frequency. The open and short stub structure operate as a capacitor and inductor respectively in the frequency of 35 GHz. If their impedance is known, it is possible to extract the value through the impedance-related equation. By producing with the permittivity 2.9 LCP substrate, the basic structure which are available in the DC constituted a library of capacitance of 1.12 to 13.9 pF and inductance of 0.96 to 4.69 nH, measured respectively. The stub structure available in the high-frequency domain were built libraries of capacitance of 0.07 to 2.88 pF and inductance of 0.34 to 1.27 nH, calculated respectively. The measurements have proven how to diversify value, so libraries can be built more variously. It is possible to integrate with the operation circuit of TRM(Transmit-Receive Module) for the frequency 35-GHz, it will be an alternative to the passive devices that can be properly utilized in the circuit.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.75-82
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• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.

• Korean Journal of Optics and Photonics
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• v.5 no.1
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• pp.166-172
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• 1994

The fiber optic receiver, ETRI APD-FET 1.0, is developed for the application of optical communication. This fiber optic receiver includes PD sub-module and pre-amplifier case. A single lens system is introduced for the PD sub-module. The sub-module consists of the avalenche photodiode(APD), GRIN rod lens, and a single mode fiber. The above components are enclosed into the stainless steel 304L housings. By bevelling the fiber end, the single mode fiber provides less than ~ 28 dB of optical return loss. The area of image focus is controlled by adjusting the length of spacer located in-between the fiber and the GRIN rod lens. The laser welding technique is applied to achieve the maximum coupling efficiency for the joining of each housing. In the pre-amplifier case, GaAs FET pre-amplifier workes for photocurrent amplification and the thermister is mounted to control the APD bias. The performance of ETRI APD-FET1.0 shows the sensitivity of - 30.3 dBm at $10^{-10}$ BER(bit error rate) and 2.5 Gbps optical random signal of $2^{23}-1$ word length. The fiber optic receiver is one of the essensial parts of the transmission module for B-ISDN. Also, the above optical packaging technology will be adapted for the developement of 10 Gbps transmission application 2.5 Gbps 5 Gbps

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2333-2337
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• 2007

The practical studies on the method of particle contamination control for yield enhancement in the cleanroom were carried out. The method of the contamination control was considered, which is composed of data collection, data analysis, improvement action, verification, and implement control. The composition analysis for data collection and data analysis was used in the cellular phone module packaging lines. And this method was evaluated by the variation of yield loss between before and after improvement action. In case that the composition analysis was applied, the critical sources were selected and yield loss reduction through improvement actions was also investigated. From these results, it is concluded that the composition analysis is effective solutions for particle contamination control in the cleanroom.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1978.1_1979.1
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• 2009

In this paper, we have proposed and demonstrated a tonometry sensor array for measuring arterial pulse pressure. A sensor module consists of 7 piezoresistive pressure sensor array. Wire-bonded connection was provided between silicon chip and lead frame. PDMS(poly-dimethylsiloxane) was coated on the sensor array to protect fragile sensor while faithfully transmitting the pressure of radial artery to the sensor. Tonometric pulse pressure can be measured by this packaged sensor array that provides the pressure value versus the output voltage.