Browse > Article
http://dx.doi.org/10.6117/kmeps.2020.27.4.067

Implementation of Capacitor and Inductor Applied LCP Substrate for 35-GHz frequency band  

Lee, Jiyeon (ICT.Device Packaging Research Center, Korea Electronics Technology Institute (KETI))
Ryu, Jongin (ICT.Device Packaging Research Center, Korea Electronics Technology Institute (KETI))
Choi, Sehwan (ICT.Device Packaging Research Center, Korea Electronics Technology Institute (KETI))
Lee, Jaeyoung (ICT.Device Packaging Research Center, Korea Electronics Technology Institute (KETI))
Publication Information
Journal of the Microelectronics and Packaging Society / v.27, no.4, 2020 , pp. 67-75 More about this Journal
Abstract
In this paper, by applying LCP substrate, the capacitor and inductor are implemented with a variety of value that can be used in 35 GHz circuits. Depending on how to apply it to the circuit, it is required high value by designing the basic structures such as electrode capacitor and spiral inductor. However they are not available in high-frequency domain, because their SRF(Self-Resonant Frequency) is lower than the frequency of 35-GHz. By finding the limit, this paper devised classifying passive devices for the DC and the high-frequency domain. The basic structure is suitable for DC and microstrip λ/8 length stub structure can be used for high-frequency. The open and short stub structure operate as a capacitor and inductor respectively in the frequency of 35 GHz. If their impedance is known, it is possible to extract the value through the impedance-related equation. By producing with the permittivity 2.9 LCP substrate, the basic structure which are available in the DC constituted a library of capacitance of 1.12 to 13.9 pF and inductance of 0.96 to 4.69 nH, measured respectively. The stub structure available in the high-frequency domain were built libraries of capacitance of 0.07 to 2.88 pF and inductance of 0.34 to 1.27 nH, calculated respectively. The measurements have proven how to diversify value, so libraries can be built more variously. It is possible to integrate with the operation circuit of TRM(Transmit-Receive Module) for the frequency 35-GHz, it will be an alternative to the passive devices that can be properly utilized in the circuit.
Keywords
LCP; capacitor; inductor; passive device; stub;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
연도 인용수 순위
1 D. C. Thompson, M. M. Tentzeris, and J. Papapolymerou, "Packaging of MMICs in Multilayer LCP Substrates", IEEE Microwave and Wireless Components Letters, 16(7), (2006).
2 K. Brownlee, S. Bhattacharya, K. Shinotani, C. Wong, and R. Tummala, "Liquid Crystal Polymers (LCP) for High Performance SOP Applications", Proc. 8th International Symposium on Advanced Packaging Materials, Stone Mountain, GA, USA, 249, IEEE (2002).
3 A. Tsuchiya, H. Sugama, T. Sunamoto, N. Hidaka, and O. Hashimoto, "Low-loss and high-speed transmission flexible printed circuits based on liquid crystal polymer films", Electronics Letters 13th, 48(19), 1216 (2012).   DOI
4 J. Jeong, S. Shin, G. J. Lee, T. M. Gwon, and J. H. Park, "Advancements in Fabrication Process of Microelectrode Array for Retinal Prosthesis using Liquid Crystal Polyemr (LCP)", 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Osaka, Japan, 5295, IEEE (2013).
5 D. C. Thompson, O. Tantot, H. Jallageas, G. E. Ponchak, M. M. Tentzeris, and J. Papapolymerou, "Characterization of Liquid Crystal Polymer (LCP) Material and Transmission Lines on LCP Substrates From 30 to 100GHz", IEEE Transactions on Microwave Theory and Techniques, 52(4), 1343 (2004).   DOI
6 J. H. Baeg, H. Park, S. I. Lee, Y. Ha, and Y. R. Cho, "Study on Influencing Factors of Adhesive Strength for Polymer Coating on Metal Adherend by Dolly Test", J. Microelectron. Packag. Soc., 26(2), 1 (2019).   DOI
7 A. Kaiser, C. M. Bee, F. Dupuis, R. V. Metzen, and K. Fritz, "Thin Film Based LCP Multi-Layer Circuits: Manufacturing Technology and Characterization", Proc. European Microelectronics Packaging Conference (EMPC), Friedrichshafen, Germany, 1, IEEE (2015).
8 S. J. Hwang, H. J. Kang, J. O. Kim, and J. P. Jung, "Laser Micro-Joining and Soldering", J. Microelectron. Packag. Soc., 26(3), 7 (2019).
9 M. V. Schneider, "Microstrip Lines for Microwave Integrated Circuits", Bell System Technical Journal, 48(5), 1421(1969).   DOI