• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.51-69
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• 2001

Japan Jisso Technology Roadmap 2001 (JJTR2001) was published by JEITA in April 2001. Future electronic products request further higher assembly technology (ex. Finer pitch packages & components, 3D assembly, etc.) to reduce size and improve performance of the electric products. For LSI Packages, finer ball pitch technology and finer chip connection technology will be developed. For electric components, further size reduction will be developed. For Jisso (assembly) machine, finer pitch assembly and short tact time technology will be developed. Mr. Utsunomiya will present PCB roadmap next.

• Food Science of Animal Resources
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• v.33 no.4
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• pp.448-455
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• 2013

Proper storage of left-over meat in a household refrigerator is important for extending its shelf-life and assuring its safety until it is next used. Various fresh meat packaging methods were examined to determine their effects on the quality characteristics of pork loins during household storage at $5^{\circ}C$. The packaging methods include 1) wrapping in a polyethylene pouch (WP), 2) keeping in an air-tight plastic container (CP), and 3) using a household vacuum packaging machine (VP). The fastest increase in total aerobic bacteria during storage occurred in the WP samples, followed by the CP and VP samples. The count of Pseudomonas spp. was found to be lowest in the VP, and then the CP and WP samples. Enterobacteriaceae grew fastest in the WP samples, followed by the CP and VP samples. The WP samples also incurred the most significant increase in thiobarbituric acids and volatile basic nitrogen values over the storage period, as compared to the CP and VP samples. Off-odour at 30 min after opening the package, was first notable at day 11 in WP samples, but only at day 15 in the CP and VP samples. The colour also deteriorated earlier in the WP samples than in the CP and VP samples.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.63-68
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• 2020

In this study, we analyzed a cold draw (CD) bar packaging automation facility to examine its structural safety. The structural analysis focused on the frame part of the automatic packing machine for the CD round rod widely used in the industrial field, as well as the package supply device, banding suit, and crane part. As a result, we concluded that the structural safety for the banding suit, crane, and package supply device have been secured (safety factors of 9.8, 7.5, and 14.5, respectively). In addition, the safety factor of the transfer was 4.0.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.9-25
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• 2001

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.653-658
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• 2011

In general, the purpose of packaging fasteners is a series of management activities to maintain the condition at the time of production until they get delivered to the end user. An automatic packing system for fasteners is consisted of bucket conveyor, slide feeder, vision inspection system, box-magazine conveyor system and automatic packing machine. Also, the automatic packing machine is consisted of six modules including charging device, clamping/opening device, sealing/cutting device, feeding/air-shower device, supplying/adjusting device and device frame, etc. In this paper, we proposed an automatic packing mechanism of the one station concept for packing work of fastener objects where the continuous batch work is performed in a finite space. The proposed one-station packing mechanism has been optimized through mechanical, dynamical, structural and fluid analyses. And it had been manufactured as the prototype of automatic packing machine. The field test for validation of performance was performed directly at the production line of bolt and screw. In the field test, this packing machine showed an efficiency of about 4.5 times the manual operation. It also showed 30% reduction in the consumption of packing materials compared to the manual operation. This automatic packing machine for fastener objects will be commercialized soon.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.15-22
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• 2002

We received 2 types flexible packaging films from two companies that laminated PET $16{\mu}m/dry$ lamination/aluminium foil $7{\mu}m/dry$ lamination/CPP $80{\mu}m$ films. For the reason of hot sealing's trouble through filling process, We separated each layer and compared thicks, film types and tested IR, DSC and sensory test. At the result, one sample's thick is different but film types is same between samples. Optimum hot-sealing conditions between two samples is $195^{\circ}C\;and\;210^{\circ}C$. The difference is $15^{\circ}C$. According to test of direct filling packaging process by four face fluid filling machine, two sample's sealing strength of hot-sealing is $4.76kg/cm2/15mm$(sample of optimum hot-sealing condition is $195^{\circ}C$) and $3.84kg/cm2/15mm(210^{\circ}C)$.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.2
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• pp.33-38
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• 1998

In point of flexographic printing on generally corrugated fiberboard cartons, the precision of film master and the adequate compression rate are very important factor in bar-code printing. Also, the complete system including scanner is essential for the purpose of enhancing the reading rate. The film master had good precision when the film was prepared by means of printing/developing machine after transformation of input bar-code number through transceiver, and the BWR 100 showed better compression rate than BWR 200. Also considering the bar-code reading, the complete system targeting the reading rate above 99.8% could be configured by Omni-Directional Scanner type accomplishing the reading rate above 99.5%.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.45-53
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• 2024

The maintenance of semiconductor equipment is crucial for the continuous growth of the semiconductor market. System management is imperative given the anticipated increase in the capacity and complexity of industrial equipment. Ensuring optimal operation of manufacturing processes is essential to maintaining a steady supply of numerous parts. Particularly, monitoring the status of substrate transfer robots, which play a central role in these processes, is crucial. Diagnosing failures of their major components is vital for preventive maintenance. Fault diagnosis methods can be broadly categorized into physics-based and data-driven approaches. This study focuses on data-driven fault diagnosis methods due to the limitations of physics-based approaches. We propose a methodology for data acquisition and preprocessing for robot fault diagnosis. Data is gathered from vibration sensors, and the data preprocessing method is applied to the vibration signals. Subsequently, the dataset is trained using Gradient Tree-based XGBoost machine learning classification algorithms. The effectiveness of the proposed model is validated through performance evaluation metrics, including accuracy, F1 score, and confusion matrix. The XGBoost classifiers achieve an accuracy of approximately 92.76% and an equivalent F1 score. ROC curves indicate exceptional performance in class discrimination, with 100% discrimination for the normal class and 98% discrimination for abnormal classes.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Journal of Institute of Control, Robotics and Systems
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• v.11 no.9
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• pp.810-815
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• 2005

As the pharmaceutical industry grows and becomes more competitive, the need of automation increases to establish effective mass production and to maintain consistent quality control. Accurate counting and packing of medicinal pills is one of the most essential processes that the automation can benefit. In conventional automated counting and packing processes, the performance of counting process varies with the size, the shape and the dispersion degree of pills. In this research, the authors developed a new pill-counting algorithm based on carefully analyzed characteristics of the pill-drop behavior. Also a new scheme for the packing of an exact number of pills has been implemented. A pill counting and packing machine with the new pill-counting algorithm and the new packing scheme has been constructed and put in an actual production line. To achieve precise and quick sensing of pills dropping at a high speed from the preceding processors, the machine uses non-contact photo sensors. Experimental results from the actual process using the machine are included to verify the effectiveness of the proposed algorithm and the machine.