• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• Food Science and Preservation
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• v.7 no.1
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• pp.33-37
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• 2000

Effects on keeping quality according to the different package environment in cabbage and brccoli were studied. Opened 2 mil LDPE (low density polyethylene) sealed 4 mil LDPE and BA(barrier polyethylene) were used as package films. Weight loss was markedly in opened 2 mil LDPE in cabbage and broccoli as 6 and 28%, respectively. Carbon dioxide was higher in seal-packaging cabbage and broccoli with BA held at 4 $^{\circ}C$ was above 15 and 31% within 15 days, respectively, while oxygen content was depleted to 2% or less after 10 days. The main difference between volatile sulfur-containing compounds produced from cabbage and broccoli were the relative quantities and rates of production of hydrogen sulfide, carbonyl sulfide, methanethiol and dimethyl disulfide in opened 2 mil LDPE , sealed 4 mil LDPE and barrier bags during storage.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.89-103
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.120-136
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.104-119
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Archives of design research
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• v.9
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• pp.1101-1114
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• 1994

As of today-half a century has passed after 1945, the liberation from Japanese imperialism-it's significant to introspect our culture. On the one hand our culture has succeeded due to the peculiar history, but on the other hand it hasn't. So to speak, it has gained in Quantity but lost in Quality. There are keen, international competition and exchange in the modern culture. So the Qualitive success of modern design depends on if it had an original character or not. According to Korean rapid industrialization, technological extence, and economic growth, the export has increased greatly, but package design hasn't been match for them. Korean expoters have been meeting with cutthroat competition in world market. Under these circumstances it's very important that we have a real understand and interest in our culture, we strengthen the competitive power of home products with good package design. This is our age of not home market but world market. We live in an age when design wins, so that we have to develop the good design native to Korea. Many designers have proposed their opinions with the characteristic designs, but it has been only a fragmentary and passive method. We must seek for the new method more positively. The effective and proper method resolves itself into the following four points. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.157-172
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• 2005

기존 단말기에 Fine Pitch (0.3mm) WLCSP를 개발/적용해 봄으로써 SMT 조립 한계로 인식되고 있는 Pitch인 0.4mm이하의 접속 기술을 검증함. Set Maker 입장에서 Fine Pitch를 가진 Customized Package를 적용할 경우, Design 단계에서부터 부품, 기판, 조립공법, Infrastructure등을 동시에 검토해야 함. 이동단말의 소형화/박형화 경쟁이 가속화 되는 가운데 Package Pitch만을 고려해 볼 때, 2006년에는 0.4mm Pitch를 가진 BGA의 적용이 확대 될 것으로 예상되며 일부 제품에서 0.3mm Pitch Package의 적용도 예상됨.

• Proceedings of the Safety Management and Science Conference
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• 2001.05a
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• pp.167-171
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• 2001

In this paper, the QFD(quality function deployment) technique is used to acquire the quality requirements of package software which is sold in a commercial software shop. To select the principal quality characteristics of package software, an user survey was conducted for a quality model developed based on the international standards and the previous research. The software user is divided into three groups：the general user, the expert, and the developer. The method of QFD is applied to choose the software quality attributes which have strong correlation with the selected quality characteristics.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4757-4761
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• 2012

LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

• Design Convergence Study
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• v.18 no.1
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• pp.49-60
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• 2019

While one person household and nuclear family have been increasing, supermarkets began to launch home meal replacement(HMR) promotion. Each brand competes over various types of HMR such as box lunch. In particular, the sales of HMR have been increasing due to one-person households. Experts predicted HMR market will be increased in the future as well. This study presents design evaluation with regards to HMR package design for elders. The methods of this study are: First, research literature review on senior society and analyse the design for both domestic and foreign HMR products. Second, survey on product design for evaluation was conducted. Third, user's evaluation survey was conducted on elders. As a result, containers mostly came in cup or box shaped package designs. The package provided both still and illustration image of food. The HMR design for elders are recommended as follows: first, HMR should be service designed for users. Second, the design should be for elders as well. Third, the design should be empathetic and abundant. For user-interface, the packaging material shall not be slippery and the shape of grip should be considered thoroughly for the elder's design.