• Title/Summary/Keyword: Package method.

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Application of functional ANOVA and functional MANOVA (단변량 및 다변량 함수 데이터에 대한 분산분석의 활용)

  • Kim, Mijeong
    • The Korean Journal of Applied Statistics
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    • v.35 no.5
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    • pp.579-591
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    • 2022
  • Functional data is collected in various fields. It is often necessary to test whether there are differences among groups of functional data. In this case, it is not appropriate to explain using the point-wise ANOVA method, and we should present not the point-wise result but the integrated result. Various studies on functional data analysis of variance have been proposed, and recently implemented those methods in the package fdANOVA of R. In this paper, I first explain ANOVA and multivariate ANOVA, then I will introduce various methods of analysis of variance for univariate and multivariate functional data recently proposed. I also describe how to use the R package fdANOVA. This package is used to test equality of weekly temperatures in Seoul and Busan through univariate functional data ANOVA, and to test equality of multivariate functional data corresponding to handwritten images using multivariate function data ANOVA.

Effects of Product Attributes of Franchise Lunch Box on Consumer's Perceived Value and Repurchase Intention (프랜차이즈 도시락 제품속성이 지각된 가치와 재구매 의도에 미치는 영향 )

  • Eui-Yeon, LEE;Kil-Suk, AHN
    • The Korean Journal of Franchise Management
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    • v.14 no.1
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    • pp.39-55
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    • 2023
  • Purpose: This study is designed to grasp how consumers' beliefs about the lunch box attributes such as healthiness, diversity, price, hygiene, and package eco-friendliness affect consumers' perceived value and purchasing behavior. Research design, data, and methodology: The data were collected from 615 respondents composed of men and women aged 20 to 59 who purchased lunch box products and were sampled using the quota sampling method. An online survey was conducted. The data were analyzed using the measurement model and structural equation model assessment with SPSS 24 and SmartPLS 4.0. Results: First, healthiness, diversity, hygiene, and the price had a significant positive effect on the perceived functional value of consumers, but package eco-friendliness did not significantly affect functional value. On the other hand, healthiness, diversity, price, and package eco-friendliness were found to have a positive impact on consumers' perceived emotional value, but hygiene was found to have no significant effect on emotional value. It was found that functional and emotional values significantly positively affected repurchase intention. Conclusions: This study confirmed that consumers' belief in the product attributes of franchise lunch boxes influenced consumers' perceived value, which thus formed the attitude of consumers and showed a relationship that affects repurchase intention. At the end of this paper, the managerial implications for the franchise lunch box brand, the limitations of this study, and future research directions were presented.

Measurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensor (유전 센서 및 광섬유 센서를 이용한 EMC 유효 경화 수축 측정)

  • Baek, Jeong-hyeon;Park, Dong-woon;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.4
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    • pp.83-87
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    • 2022
  • Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

A Study on a Measurement Method for 2D Anthropometry using Digital Camera (디지털 카메라를 이용한 2D 인체계측법 연구)

  • 손희정;김효숙;최창석;손희순;김창우
    • The Research Journal of the Costume Culture
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    • v.11 no.1
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    • pp.11-19
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    • 2003
  • This study suggests the new 2D anthropometric method using digital camera. It is used MK2001 program that can convert 2D measurements to 3D measurements. To improve that it is measured 100 college students with direct and indirect anthropometric method. The measurements were processed by the SPSS ver10 Statistical Package. The average, standard deviation, and t-test were calculated for each category. Most measurements by 2D measurements are higher than direct measurements but degree. The difference between direct and indirect measurements is less than 2cm. In the results of t-test, height measurements including other 16 measurements which is easy to measure have no meaningful difference within 1cm. The depth measurements are most high difference. The result of each measurement proves that MK2001 program (2D anthropometry method using digital camera) is available for measuring the human body.

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Optimal control of a tubular reactor using the distributed-parameter method and the numerical method of lines

  • Choe, Young-Soon;Yang, Dae-Ryook;Lee, In-Beum;Chang, Kun-Soo
    • 제어로봇시스템학회:학술대회논문집
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    • 1993.10b
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    • pp.312-315
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    • 1993
  • Optimal control theories based on the maximum principles have been evolved and applied to distributed parameter systems(DPSs) represented by partial differential equations (PDEs) and integral equations (IEs). This paper intends to show that an optimal control of a tubular reactor described by a one-dimensional partial differential equation was obtained using the distributed parameter control method for parabolic PDEs. In develping an algorithm which implements the calculation, the method of lines (MOL) was adopted through using a package called the DSS/2. For the tubular reactor system chosen for this paper, the optimal control method based on PDEs with the numerical MOL showed to be more efficient than the one based on IEs.

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DUAL REGULARIZED TOTAL LEAST SQUARES SOLUTION FROM TWO-PARAMETER TRUST-REGION ALGORITHM

  • Lee, Geunseop
    • Journal of the Korean Mathematical Society
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    • v.54 no.2
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    • pp.613-626
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    • 2017
  • For the overdetermined linear system, when both the data matrix and the observed data are contaminated by noise, Total Least Squares method is an appropriate approach. Since an ill-conditioned data matrix with noise causes a large perturbation in the solution, some kind of regularization technique is required to filter out such noise. In this paper, we consider a Dual regularized Total Least Squares problem. Unlike the Tikhonov regularization which constrains the size of the solution, a Dual regularized Total Least Squares problem considers two constraints; one constrains the size of the error in the data matrix, the other constrains the size of the error in the observed data. Our method derives two nonlinear equations to construct the iterative method. However, since the Jacobian matrix of two nonlinear equations is not guaranteed to be nonsingular, we adopt a trust-region based iteration method to obtain the solution.

FE Model Improvement Using Experimental Data Under the Criterion of Eigen-Property Error Minimization (고유치 오차 최소화 기준에 따른 실험데이터에 의한 유한요소 모델 개선)

  • 지영춘;박윤식
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.2
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    • pp.363-373
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    • 1995
  • In this study, a FE model tuning method using experimental modal data was suggested after examining all the published conventional methods. The idea of this method is introducing scale factors to maintain both the structural connectivity and the consistency in the corrected stiffness matrix which makes it always possible to interpret the stiffness elements with the corresponding physical configuration of the targeting structure. The scale factors are determined to minimize the objective function of eigen-properties. The proposed method was tested to determine the joint stiffness of a T shaped beam. The test results were also compared with the tuned stiffness obtained from a probed commercial package (SYSTUNE) and found that this method is very accurate and compatible.

PRELIMINARY PROJECT OF WATER SUPPLY FOR NDATA FARM, MALAWA

  • Min-Shun Lee;Hung-Kwai Chen;Sheng Liang;Ho-Shong Hou
    • International conference on construction engineering and project management
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    • 2009.05a
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    • pp.1615-1617
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    • 2009
  • The water resources project of 320 Ha second stage reclamation, in which including an University City, out of 800 Ha Ndata Farm, Malawa, had been under studied in this research. The challenge of C value of runoff coefficient was obtained as 0.8, by introducing the attenuation factors method, proposed by second author, an IDF dimensionless method customary used in Taiwan, proposed by the third author, is translated further to solve the project design rainfall; Rational Method, thus, obtains 11.5 CMS as the 5 year recurrence storage. The final job, completed by the third author's on-site performance, includs field alignments and discussions with the trustee, Malawa President H. E. Dr. Bingu Wa Mutharika, when a special concern of anti-theft. In order to provide sufficient supply up to an amount of 44,000 M3 during April to November, the sketch package includes 6 measurements: one water barrage, one sluice gate, one intake, one sediment reservoir, one water reservoir, and 3199 Km long gravity-driving hydraulic pipe.

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An Efficient Processing of Multimedia Message in SIP-Based Instant Messaging Service (SIP 기반 인스턴트 메시징 서비스에서의 효율적인 멀티미디어 메시지 처리)

  • Jo, Hyun-Gyu;Lee, Ki-Soo;Jang, Choon-Seo
    • The Journal of the Korea Contents Association
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    • v.8 no.1
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    • pp.152-159
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    • 2008
  • In this paper, we have studied a new method in which multimedia message can be processed effectively in SIP(Session Initiation Protocol)-based Instant Messaging service. Total system is composed of multimedia message server, presence server and user system. To provide effectively message informations such as number of messages stored in the multimedia message server, waiting status and message types to users, we have proposed a new method which can be a substitute for message waiting indication event package. In our proposed method, when changes of messages status informations occur, these informations are sent to the presence server, and can be transferred as a separate tag within notification message. The presence server processes subscription requests and notifications, and efficiency can be improved as it provides both message status informations and several communication status informations such as on-line status to service users. Partial publication is used in our system to improve data transfer efficiency more between user system and the presence server. The performance of our proposed model is evaluated by experiments measuring multimedia message transfer speed and server processing time.

Study on Design Parameters of Substrate for PoP to Reduce Warpage Using Finite Element Method (PoP용 Substrate의 Warpage 감소를 위해 유한요소법을 이용한 설계 파라메타 연구)

  • Cho, Seunghyun;Lee, Sangsoo
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.61-67
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    • 2020
  • In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.