• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.49-55
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• 2022

The design of a battery package and a BMS module for applications using seawater rechargeable batteries, which are known as next-generation energy storage devices, is proposed herein. Seawater rechargeable batteries, which are currently in the initial stage of research, comprise primarily components such as anode and cathode materials. Their application is challenging owing to their low charge capacity and limited charge/discharge voltage and current. Therefore, we design a method for packaging multiple cells and a BMS module for the safe charging and discharging of seawater rechargeable batteries. In addition, a prototype seawater rechargeable battery package and BMS module are manufactured, and their performances are verified by evaluating the prevention of overcharge, overdischarge, overcurrent, and short circuit during charging and discharging.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.111-119
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• 2005

Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.63-66
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• 2003

Forged gears have the obvious advantages with the greater utilisation of raw material and high productivity over the machined gears. The forged bevel gear has been used in differential gear for automotive with a high reliance. On the other hand, the studies have been continued to improve the accuracy and expand the applying areas. In this paper, a whole manufacturing process for forged gear from die design and cold forging to heat-treatment was introduced. The stress and elastic deformation for forging die have been analysed by the 3D-FEM-package. The real elastic deformation of die was measured by the strain-gages. The elastic deformation of die was reached to 1mm, in terms of the present study. The analysed quantitative dimension of die was taken into consideration into the CAD/CAM data for forging die.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.1155-1160
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• 2009

The trend in construction industry, now, lies in improving efficiency and competitive power in construction management and on-the-spot instruction by combining with new IT technology. Above all, it is safe to say that the application of RFID technology can play a pivotal role at this point, but it is not that easy to apply RFID due to the physical, chemical and environmental peculiarities of construction materials. Thus, a study on the standardization of the usable frequency, specifications, protocol, and package administration is required. This study, as part of the study on the standardization, figured out the restrictions by attaching the existing RFID Tag to the construction materials, turned out the prototype of RFID Tag to perform a field test. In result the effective recognition range varies according to the physical and environmental peculiarities of construction materials; and the management efficiency varies as the attaching method and/or applying method. To analyze the management method (media, process etc.) systematically for the existing construction materials; to prepare more various restrictions and its solutions for practical construction spots will be the key for successful RFID implementation.

• Korean Journal of Food Science and Technology
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• v.26 no.6
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• pp.713-717
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• 1994

Effects of packing materials on the gas compositions in package of fresh peeled garlic (Allium sativum L.) were investigated. The fresh peeled garlics packed in $20,\;40,\;60\;{\mu}m$ LDPE and $30\;{\mu}m$ HDPE pouches were stored at $20^{\circ}C$, 76% RH. The variables including respiration characteristics, gas compositions, general appearance, and film permeabilities to $O_2$, $CO_2$ and $H_2O$ vapor were measured. A model was evaluated for the prediction of $O_2$ and $CO_2$ equilibrium concentrations inside packages and for the optimization of packaging parameters. Experimental and simulated gas composition results were found to be in good agreement. The $30\;{\mu}m$ HDPE pouch with 4% $O_2$ and 7.5%$CO_2$ equilibrium concentrations conferred the best appearance of peeled garlic, giving 6 days of storage life. As a result, MA seemed to have a beneficial effect on appearance of fresh peeled garlic, possibly due to reduced microbial activity.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.2
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• pp.101-107
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• 2005

The term 'antimicrobial' packaging encompasses any packaging technique(s) used to control microbial growth in the food product. These include packaging materials and edible films and coatings that contain antimicrobial agents, and also techniques that modify the atmosphere within the package. In recent years, antimicrobial packaging has attracted much attention from the food industry because of the increase in consumer demand for minimally processed, preservative-free products. Reflecting this demand, the preservative agents must be applied to packaging in such a way that only low levels of preservatives come into contact with the food. The film or coating technique is considered to be more effective, although more complicated to apply. New antimicrobial packaging materials are being developed continually. Many of them exploit natural agents, to control common food-borne microorganisms. Current trends suggest that in due course, packaging will generally incorporate antimicrobial agents and the sealing systems will continue to improve. The focus of packaging in the past has been on the appearance, size and integrity of the package. A greater emphasis on safety features associated with the addition of antimicrobial agents is perhaps the next area for development in packaging technology.

• Journal of Surface Science and Engineering
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• v.49 no.5
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• pp.439-446
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• 2016

In 2015, a fin tube (Cu-Ni 70/30 alloy) of package type heat exchanger for navy vessel was perforated through the wall which led to refrigerant leakage. This failure occurred after only one year since its installation. In this study, cause of the failure was determined based on available documents, metallographic studies and computational fluid dynamics simulation conducted on this fin tube. The results showed that dimensional gap between inserted plastic tube and inside wall of fin tube is the cause of the swirling turbulent stream of sea water. As a result of combination of swirling turbulence and continuing collision of hard solid particles in sea water, erosion corrosion has begun at the end of inserted plastic tube area. Crevice corrosion followed later in the crevice between the outer wall of plastic tube and inner wall of fin tube. It was found that other remaining tubes also showed the same corrosion phenomena. Thorough inspection and prompt replacement will have to be accomplished for the fin tubes of the same model heat exchanger.