• 한국신뢰성학회:학술대회논문집
• /
• 한국신뢰성학회 2001년도 정기학술대회
• /
• pp.239-244
• /
• 2001

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.

• 한국공작기계학회논문집
• /
• 제17권3호
• /
• pp.14-19
• /
• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Nuclear Engineering and Technology
• /
• 제53권7호
• /
• pp.2151-2161
• /
• 2021

Nuclear data (ND) sensitivity and uncertainty (S/U) quantification in shielding applications is performed using deterministic and probabilistic approaches. In this paper the validation of the newly developed deterministic program package ASUSD (ADVANTG + SUSD3D) is presented. ASUSD was developed with the aim of automating the process of ND S/U while retaining the computational efficiency of the deterministic approach to ND S/U analysis. The paper includes a detailed description of each of the programs contained within ASUSD, the computational workflow and validation results. ASUSD was validated on two shielding benchmark experiments from the Shielding Integral Benchmark Archive and Database (SINBAD) - the fission relevant ASPIS Iron 88 experiment and the fusion relevant Frascati Neutron Generator (FNG) Helium Cooled Pebble Bed (HCPB) Test Blanket Module (TBM) mock-up experiment. The validation process was performed in two stages. Firstly, the Denovo discrete ordinates transport solver was validated as a standalone solver. Secondly, the ASUSD program package as a whole was validated as a ND S/U analysis tool. Both stages of the validation process yielded excellent results, with a maximum difference of 17% in final uncertainties due to ND between ASUSD and the stochastic ND S/U approach. Based on these results, ASUSD has proven to be a user friendly and computationally efficient tool for deterministic ND S/U analysis of shielding geometries.

• 한국전자통신학회논문지
• /
• 제9권8호
• /
• pp.883-888
• /
• 2014

시뮬레이션은 현대의 복잡한 환경에서 효율적인 의사 결정을 위한 도구로서 폭넓게 사용되고 있다. 하지만, 대부분은 결과의 분석 보다는 시뮬레이션 모델의 개발 및 수행에 중점을 두고 있다. 본 논문에서는 시뮬레이션 모델링은 물론 결과의 분석도 중요하고 체계적으로 진행되어야 한다는 점을 강조하고, 이를 위하여 통계분석과 다양한 데이터 조작 및 그래픽 기능을 가진 R을 사용하여 이윤 최적화 시뮬레이션에 대한 모델링과 결과 데이터의 조작 및 다양한 그래픽을 사용한 분석 작업을 수행하여 유용성을 입증하였다.

• 기술사
• /
• 제38권4호
• /
• pp.7-9
• /
• 2005

The recent speculation fever in Kangnam and its southern vicnity of Seoul resulted in surging apartment prices. The government is determined to employ more effective anti-speculation policy measures to control the property speculative demand. The Government plans to implement support measures to discourage people from owning multiple homes by reinforcing tax measures. To meet the increasing demand for more large-sized apartments in Seoul, the Government may allow to build more large sized units. By the end of August, 'a comprehensive package tool of real estate policy measures' ,as a real estate controlling guidelines, is scheduled to be presented by the Government. We hope that the package tool will stabilize housing market more effectively and enhance the national economy.

• 한국정밀공학회지
• /
• 제9권4호
• /
• pp.13-21
• /
• 1992

Standards concerning the determination of positioning accuracy and repeatability of numerically controlled(NC) machine tools have been published relentlessly over the last 20 years. Since the publication in 1988 of the International Standard 230-2 there has been a pronounced move, both at national and international standards level, to embrace further test procedures for a complete machine tool performance assessment. For example, measurements of angular (pitch, roll, and yaw) and straightness errors along linear axes are now commonplace and complement the existing positioning accuracy and repeatablity tests. More recently the subject of circularity evalutaion has also gained considerable interest. Here dynamic tests, using a kinematic ballbar or circular masterpiece, give an instant overview of the contouring ability of the machine in two axes at specific feedrates. This information is extremely important in optimising machining accuracy. This paper describes moves to complete the machine calibration package in national and international standardis- ation for the assessment of machine tool performance.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.124-128
• /
• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1986년도 한국자동제어학술회의논문집; 한국과학기술대학, 충남; 17-18 Oct. 1986
• /
• pp.337-340
• /
• 1986

A software package CARDS for general purpose robot design, control, and simulation has been developed and is presented here. CARDS (Computer Aided Robot Design and Simulation) consists of a collection of standardized subroutine modules that carry out typical kineamatic, dynamic, and control computations so that the user only needs to write a main program that further defines a particular robot configuration and the task to be performed. It provides users a complete simulation environment, so that it will be a valuable engineering tool for mechanical designers as well as electric control designers.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1996년도 추계학술대회 논문집
• /
• pp.588-592
• /
• 1996

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1993년도 하계학술대회 논문집 A
• /
• pp.124-127
• /
• 1993

This paper presents the new algorithm for fault analysis and the fault analysis package for executing this algorithm. This algorithm obtains requisite term for fault analysis by the two-port network technique. Therefore, the fault calculation time is minimized because ${Y_{BUS}}^{-1}$ calculation time is removed. And, the graphic user environment for fault analysis is implemented in mouse-oriented user interface with window and pull-down menu. Therefore, this package can be a useful tool for fault analysis.