• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전력기술부문
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• pp.164-166
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• 2006

Wien Automatic System Planning Package (WASP) which is used to draw out generation expansion planning applies Dynamic Programming in Korea power system panning. While this package has an advantage that computes annual capacity, it has a disadvantage that can't consider environmental constraints. With the effectuation of the Kyoto Protocol in February, 2005, it is expected that CO2 emission has a severe effect on Korean power system. Therefore, as the most important issue, the generation expansion planning considering environmental constraints is rising in power system. This paper develops a mathematic model including not only generation expansion planning but transmission planning and considering regional supply-demand and environmental constraints, especially CO2 emission, and verifies propriety through the case study.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.27-34
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• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 1998년도 추계학술대회논문집:21세기에 대비한 지능형 통합항만관리
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• pp.223-238
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• 1998

In this study, to investigate the effect of process variables such as reduction in area, semi-die angle and the rectangular ratio to the corner filling which influences the dimensional accuracy of the final product in the drawing of the cluadrangle rod from a round bar, it has been simulated by three dimensional rigid-plastic finite element method. In order to reduce the number of simulation artificial neural network has been introduced. Also, through the experimental investigation, the present results have been implemented on the industrial product. In results, the main process variable is the combination of the semi-die angle in case of the irregular shaped drawing process and reduction in area in the event of regular shaped drawing process, respectively.

• 한국자동차공학회논문집
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• 제9권6호
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• pp.178-185
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• 2001

This paper describes the correlation between the interior noise and the trunk wall vibration. Using the vibro-acoustic reciprocity, effect of the trunk wall vibration on the compartment noise is investigated on a medium size car. In the low frequency range, vehicle interior noise is dominated by several acoustic modes of the passenger compartment and the vibration modes of the surrounding shell parts. Especially, vibration of the trunk wall radiates sound and it is transferred through holes on the package tray into the passenger compartment. This paper experimentally reveals that sound can be well produced at some particular vibration modes of the trunk lid and it strongly influences the compartment noise through package tray holes. Contributions of the trunk walls to the interior noise are estimated by measuring the acoustic-structural transfer function, based on the vibro-acoustical reciprocity theorem.

• 한국세라믹학회지
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• 제34권6호
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1997년도 추계학술발표회논문집(1)
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• pp.351-356
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• 1997

In the des19n of KNGR (Korea Next Generation Reactor), we believe that economy is one of the most important factors to be considered Thus, we reviewed and evaluated the consequences of designing the head area into an integrated package from an economical point of view. The refueling outage durations of the nuclear power plants currently in operation In Korea, some having and others not having integrated head package, are compared. This paper discusses the characteristics of head area design and the critical design issues of KNGR head area to evaluate the effect of the head area characteristics on the outage duration.

• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.805-811
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• 2000

Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

• 수산경영론집
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• 제40권2호
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• pp.1-25
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• 2009

The major part of non-commercial food service is food service for school which has no any objective quality standards. Each school has different standard when they buy seafood for SFS(School Food Service). The research purpose is whether or not the extrinsic cues of the seafood such as price, the source origin, company image, safety standards, etc or the intrinsic cues such as fishy smell, the hardiness of fish meat, others have any effect on the seafood evaluation when school nutritionist purchase it, for more objective basis. The research method is distributing questionnaire survey through e-mail or directly visiting the schools from October 30 to November 9, 2007. The questionnaire was distributed to 70 nutritionists of food service for elementary school in Busan. Total 50 questionnaires are used as data in the statistical analysis using SPSS package software. The research results are; First, there is interaction effect between the extrinsic and intrinsic cues of seafood for SFS. That is when the school nutritionist valued on intrinsic cues of seafood such as a fishy smell, the hardiness of fish meat and etc influence on the extrinsic cues such as price, source origin, reliable circulation process, HACCP application, etc. Second, the extrinsic cues of the seafood give no effect on perceived quality. Since seafood for SFS are heavy buying, prearrangement contract and most of them using pre-treated frozen aquatics. Third, the intrinsic cues of the seafood give no effect on perceived quality. The extrinsic cues consist of 5 parts namely "opening about quality", "source origin", "company image", "safety/standards" and "price/package". However, "safety/standard" was the only affecting factor to perceive quality. The reason is that in fact they have no standards or any document proving the quality of the seafood unless safety standards factor. Last, the perceived quality is an important factor for perceived value and purchase intention. It is showed that there is a path to form a willing to buy through the perceived value after school nutritionist recognizes the perceived quality.

• 한국정보시스템학회지:정보시스템연구
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• 제28권3호
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• pp.123-139
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• 2019

Purpose With the development of information and communication technologies. fintech industry is rapidly growing as a major financial service. Previous research literatures mainly focused on overall characteristics and technical aspects of fintech including security issues. Therefore, this study investigated the effect of individual features influencing the resistance of adopting a fintech service. Moreover, this paper included the guidelines in practical development of fintech mechanism. Design/methodology/approach For research purposes, this study developed research hypotheses in order to empirically examine the effect of the factors that might have a significant effect on the resistance of the wearable device. The empirical research was based on a survey which carried through 359 participants. Research hypotheses were evaluated via SPSS Statistics 21.0 and AMOS 19 statistical package program. Findings Results showed that self-efficacy and individual innovation had a significant effect on the technostress and switching cost. In addition, technostress, security and switching cost had a significant effect on the resistance of adopting a fintech service. However, more factors are needed to including in research model to generalize these results.