• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.283-287
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• 2002

To remedy both the degradation and saturation of the output voltages in the modified Dickson pump. a new multi-stage charge pump circuit is presented in this paper. Here using PMOS charge-transfer switches instead of NMOS ones eliminates the necessity of diode-configured output stage in the modified-Dickson pump, achieving the improved voltage pumping gain and its output voltages proportional to the stage numbers. Measurement indicates that VOUT/3VDD of this new pump circuit with two stages reaches to a value as high as 0.94 even with low VDD=1.0 V, strongly addressing that this scheme is very favorable at low-voltage memory applications.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.483-484
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• 2007

In this paper, we describe a chip design technique for instrumentation amplifier using a nested-chopping technique. Conventional chopping technique uses a pair of chopper, but nested chopping technique uses two pairs of chopper to reduce residual offset and 1/f noise. The inner chopper pair removes the 1/f noise, while the outer chopper pair reduces the residual offset. Our instrumentation amplifier using a nested chopping technique has residual offset under 100 nV. We also implement very low frequency filter. Since this filter needs very large RC time constant, we use a technique named 'diode connected PMOS' to increase R with small die area. The total power consumption is 3.1 mW at the supply voltage of 3.3V with the 0.35um general CMOS technology. The die area of implemented chip was $530um{\times}300um$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.2
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• pp.128-133
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• 2008

Phase-change random access memory (PRAM) chip cell phase of amorphous state is rapidly changed to crystal state above 160 Celsius degree within several seconds during Infrared (IR) reflow. Thus, on-board programming method is considered for PRAM chip programming. We demonstrated the functional 512Mb PRAM with 90nm technology using several novel core circuits, such as metal-2 line based global row decoding scheme, PN-diode cells based BL discharge (BLDIS) scheme, and PMOS switch based column decoding scheme. The reverse-state standby current of each PRAM cell is near 10 pA range. The total leak current of 512Mb PRAM chip in standby mode on discharging state can be more than 5 mA. Thus in the proposed BLDIS control, all bitlines (BLs) are in floating state in standby mode, then in active mode, the activated BLs are discharged to low level in the early timing of the active period by the short pulse BLDIS control timing operation. In the conventional sense amplifier, the simultaneous switching activation timing operation invokes the large coupling noise between the VSAREF node and the inner amplification nodes of the sense amplifiers. The coupling noise at VSAREF degrades the sensing voltage margin of the conventional sense amplifier. The merit of the proposed sense amplifier is almost removing the coupling noise at VSAREF from sharing with other sense amplifiers.

• ETRI Journal
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• v.38 no.4
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• pp.654-664
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• 2016

This paper presents a transformer-based reconfigurable synchronous boost converter. The lowest maximum power point tracking (MPPT)-input voltage and peak efficiency of the proposed boost converter, 20 mV and 88%, respectively, were achieved using a reconfigurable synchronous structure, static power loss minimization design, and efficiency boost mode change (EBMC) method. The proposed reconfigurable synchronous structure for high efficiency enables both a transformer-based self-startup mode (TSM) and an inductor-based MPPT mode (IMM) with a power PMOS switch instead of a diode. In addition, a static power loss minimization design, which was developed to reduce the leakage current of the native switch and quiescent current of the control blocks, enables a low input operation voltage. Furthermore, the proposed EBMC method is able to change the TSM into IMM with no additional time or energy loss. A prototype chip was implemented using a $0.18-{\mu}m$ CMOS process, and operates within an input voltage range of 9 mV to 1 V, and an output voltage range of 1 V to 3.3 V, and provides a maximum output power of 37 mW.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.369-372
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• 2002

To remedy both the degradation and saturation of the output voltages in the modified Dickson pump, a new multistage charge pump circuit is presented in this paper. Here using PMOS charge-transfer switches instead of NMOS ones eliminates the necessity of diode-configured output stage in the modified-Dickson pump, achieving the improved voltage pumping gain and its output voltages proportional to the stage numbers. Measurement indicates that VOUT/3VDD of this new pump circuit with two stages reaches to a value as high as 0.94V even with low VDD=1.0 V, strongly addressing that this scheme is very favorable at low-voltage memory applications.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.4
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• pp.42-48
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• 2014

In this paper, we propose a new small swing domino logic that reduces the swing amplitude by using twist-connected PMOS and NMOS transistors. The output swing range of the proposed circuit is adjusted by the size of the twist-connected transistors and the load capacitance. The designed RCA with the proposed circuit technique shows reduction of the power consumption by 37% and PDP performance by 43% compared with the domino CMOS logic.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.10
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• pp.1899-1909
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• 2007

A cross-coupled charge pump with internal pumping capacitor, witch is advantages from a point of minimizing TFT-LCD driver IC module, is newly proposed in this paper. By using a NMOS and a PMOS diode connected to boosting node from VIN node, the pumping node is precharged to the same value each pumping node at start pumping operation. Since the lust-stage charge pump is designed differently from the other stage pumps, a back current of pumped charge from charge pumping node to input stage is prevented. As a pumping clock driver is located the font side of pumping capacitor, the driving capacity is improved by reducing a voltage drop of the pumping clock line from parasitic resistor. Finally, a layout area is decreased more compared with conventional cross-coupled charge pump by using a stack-MIM capacitors. A proposed charge pump for TFT-LCD driver IC is designed with $0.13{\mu}m$ triple-well DDI process, fabricated, and tested.