• Title/Summary/Keyword: PLASMA SURFACE TREATMENT

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Plasma Surface Modification of Graphene and Combination with Bacteria Cellulose (Graphene의 플라즈마 표면 개질과 박테리아 셀룰로오스와의 결합성 검토)

  • Yim, Eun-Chae;Kim, Seong-Jun;Oh, Il-Kwon;Kee, Chang-Doo
    • Korean Chemical Engineering Research
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    • v.51 no.3
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    • pp.388-393
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    • 2013
  • The study was focused to evaluate the possibility for combination membrane of bacterial cellulose (BC) and graphene with high electrical properties. BC with natural polymer matrix was known to have strong physical strength. For the combination of graphene with BC, the surface of graphene was modified with oxygen plasma by changing strength and time of radio waves in room temperature. Water contact angle of modified graphene grew smaller from $130^{\circ}$ to $12^{\circ}$. XPS analysis showed that oxygen content after treatment increased from 2.99 to 10.98%. Damage degree of graphene was examined from $I_D/I_G$ ratio of Raman analysis. $I_D/I_G$ ratio of non-treated graphene (NTG) was 0.11, and 0.36 to 0.43 in plasma treated graphene (PTG), increasing structural defects of PTG. XRD analysis of PTG membrane with BC was $2{\theta}$ same to BC only, indicating chemically combined membrane. In FT-IR analysis, 1,000 to 1,300 $cm^{-1}$ (C=O) peak indicating oxygen radicals in PTG membrane had formed was larger than NTG membrane. The results suggest that BC as an alternation of plastic material for graphene combination has a possibility in some degree on the part like transparent conductive films.

High Speed Direct Bonding of Silicon Wafer Using Atmospheric Pressure Plasma (상압 플라즈마를 이용한 고속 실리콘 웨이퍼 직접접합 공정)

  • Cha, Yong-Won;Park, Sang-Su;Shin, Ho-Jun;Kim, Yong Taek;Lee, Jung Hoon;Suh, Il Woong;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.31-38
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    • 2015
  • In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

Effect of Pretreatment on the Dissolution of Aluminum Alloy during Hydration Process (수화과정에서 전처리가 알루미늄 합금의 용출에 미치는 효과)

  • Lee, Byoung-Gu;Lee, Hoyeon;Tak, Yongsug
    • Corrosion Science and Technology
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    • v.12 no.5
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    • pp.215-219
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    • 2013
  • Aluminum alloy(3003) can be dissolved during hydration process with hot tap water. In order to increase the stability of aluminum alloy, it was pretreated with anodization and phosphoric acid before hydration process. The effect of pretreatment on the surface property changes was analyzed with X-ray Photoelectron Spectroscopy (XPS) and Inductively Coupled Plasma-Optical Emission Spectrometer (ICP-OES) and their results supported that the increase of hydroxyl group (-OH) on the surface formed during anodization and phosphorous acid treatment prevented the dissolution of aluminum alloy during hydration process at high temperature.

Study on Finding Optimum Condition of Plasma Treatment on SiO2 Substrates to Reduce Contact Resistance at Graphene-Metal Interface (그래핀-금속 접촉 저항을 줄이기 위한 SiO2 기판 플라즈마 처리의 최적화 연구)

  • Gang, Sa-Rang;Ra, Chang-Ho;Lee, Dae-Yeong;Yu, Won-Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.96-96
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    • 2013
  • 그래핀과 금속 결합에서 발생하는 접촉 저항을 줄이기 위한 목적으로, 소자 제작에 사용되는 $SiO_2$ 기판의 표면을 플라즈마를 사용하여 에칭하는 최적의 조건에 대해 연구하였다. 기존에 발표된 연구 결과에 따라 $SF_6$$O_2$를 섞어 플라즈마 처리를 하였고, 플라즈마 방전에 사용 된 두 가스의 혼합 비율을 조절함으로써 소자 제작에 적합한 조건을 찾고자 하였다. 플라즈마 처리 전후의 $SiO_2$ 기판의 표면 측정은 AFM (Atomic Force Microscope)을 사용하였고, 단면은 SEM(Scanning Electron Microscope)을 통해 확인하였다.

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The effects of the plasma treatment on the electrical properties and stability of IZO-based TFTs (플라즈마 처리가 IZO기반 TFT의 전기적 특성과 신뢰성에 끼치는 영향)

  • Song, Chang-U;Hong, Chan-Hwa;Sin, Jae-Heon;Kim, Gyeong-Hyeon;Park, Rae-Man;Yang, Ji-Ung;Seo, U-Hyeong;Gwon, Hyeok-In;Jeong, U-Seok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.246-247
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    • 2014
  • 고사양을 요구하는 차세대 디스플레이용 소자 중 하나로 산화물 TFT(thin-film transistor)가 주목받고 있으며, 기존의 a-Si TFT보다 월등한 성능을 보인다. 소자의 특성을 개선시키기 위해 back channel 표면에 플라즈마 처리를 하였다. 플라즈마처리시 산소의 비중이 늘어날수록 산화물 TFT의 특성을 개선하는데 도움을 주는 것을 확인하였다.

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Enhanced Electrical & Environmental Properties of AgNWs through Plasma Treatment (플라즈마 처리를 통한 은 나노와이어의 특성 향상 기술)

  • Jeong, Seong-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.95-95
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    • 2016
  • 은나노와이어 투명전극은 높은 투과도와 높은 전도도를 가짐과 동시에 높은 유연성을 가지고 있어 차세대 투명전극으로 주목받고 있다. 많은 연구자들이 이를 이용하여 다양한 전자소자에 대한 적용 연구를 수행하고 있고, 터치스크린에 적용한 제품 등이 실제로 선보이고 있다. 하지만 ITO에 비해 높은 생산 단가와 낮은 열적, 환경적인 안정성은 이를 다양한 품목에서 실용화하는데에 있어 문제가 되고 있다. 은나노와이어에 장시간 열이 가해지거나, 습도에 노출되거나, 국소 부분에 높은 열/전류가 가해지게 되면 Rayleigh Instability 현상을 보이며 각각의 나노와이어가 끊어지는 현상이 발생한다. 또한, 공기 중의 수분에 의한 산화가 발생하는 문제도 존재한다. 이러한 문제를 해결하기 위해 상부에 이종의 물질을 덮어 Passivation을 수행하지만, 이는 생산 단가의 상승으로 이어진다. 본 연구에서는 플라즈마 기술을 활용하여 은나노와이어의 특성을 강화시키는 연구를 수행하였고, 이종의 물질 형성 없이 전기적, 환경적 안정성을 향상시킬 수 있었다. 또한 전기적 특성의 향상으로 인해 더 적은 은나노와이어의 양으로도 같은 전기적 특성을 가질 수 있었고, 이를 통해 높은 투과도/재료소모 절감의 효과를 동시에 얻을 수 있었다.

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Total Photoyields from CVD Diamond Surfaces and Their Electron Affinity

  • T.Ito;H.Yagi;N.Eimori;A.Hatta;A.Hiraki
    • The Korean Journal of Ceramics
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    • v.3 no.1
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    • pp.21-23
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    • 1997
  • Dependences of total photoyields on incident photon energies were measured using synchrotron radiation light for different chemical-vapor-deposited diamond with differently treated surface. Results show that a considerable amount of gap states are presented for as-grown specimens with H-terminated, that negative electron affinity (NEA) is realized for H-plasma-treated specimens, and that sufficient O-treatment to NEA specimens results in positive electron affinity. The observed electron affinity can be explained in terms of differences in strength of the surface dipole layer formed by difference in the electron negativity among C, H and O atoms.

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Duplex Surface Modification with Micro-arc Discharge Oxidation and Magnetron Sputtering for Aluminum Alloys

  • Tong, Honghui;Jin, Fanya;He, Heng
    • Journal of the Korean Vacuum Society
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    • v.12 no.S1
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    • pp.21-27
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    • 2003
  • Micro-arc discharge oxidation (MDO) is a cost-effective plasma electrolytic process which can be used to improve the wear and corrosion resistance of Al-alloy parts by forming a alumina coating on the component surface. However, the MDO coated Al-alloy components often exhibit relatively high friction coefficients and low wear resistance fitted with many counterface materials, additionally, the pitting corrosion for the MDO coated AI-alloy components, especially for a thinner alumina coating, often occurs in atmosphere circumstance due to the porous alumina coats. Therefore, a duplex treatment, combining a MDO coated ahumina thin layer with a TiN coating, prepared by magnetron sputtering (MS), has been investigated. The Vicker's microhardness, pin-on-disc, electrochemical measurement, salt spray, XRD and SEM tests were used to characterize and analyze the treated samples. The work demonstrates that the MDO/MS coated samples have a combination of a very low friction coefficient and good wear resistance as well as corrosion since the micro-holes on alumina coating are partly or fully covered by TiN material.

Controls of Graphene work function by using the chemical and plasma treatment

  • Lee, Seung-Hwan;Choe, Min-Seop;Im, Yeong-Dae;Ra, Chang-Ho;Mun, In-Yong;Yu, Won-Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.215-215
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    • 2012
  • 본 연구에서는 화학적 도핑 방법 및 플라즈마 표면 처리방법을 이용하여 그래핀 내 Electron & Hole carrier 들의 농도를 변화시켜, 전계효과에 따른 Graphene Field Effect Transistors (GFETs) 소자의 전기적 특성 변화를 확인 하였으며, 전기적 특성 결과 중에 Dirac-point (DP) 이동에 따른 그래핀 $E_F$ (Fermi-energy) level 변화를 계산 및 유추 하였으며, Ultraviolet Photoelectron Spectroscpy (UPS)를 이용하여 실제적으로 He 소스 광전자를 그래핀 샘플 표면에 입사하여 나오는 전자들의 Kinetic Energy($E_K$) 결과를 이용하여 Work function (WF) 변화를 확인 및 검증하였다.

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Improving CO2 Adsorption Performance of Activated Carbons Treated by Plasma Reaction with Tetrafluoromethane (사불화탄소 플라즈마 반응에 의해 처리된 활성탄소의 CO2 흡착 성능 향상)

  • Chung Gi Min;Chaehun Lim;Seo Gyeong Jeong;Seongjae Myeong;Young-Seak Lee
    • Applied Chemistry for Engineering
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    • v.34 no.2
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    • pp.170-174
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    • 2023
  • CO2 is known as one of the causes of global warming, and various studies are being conducted to capture it. In this study, a tetrafluoromethane (CF4) plasma reaction was performed to improve the CO2 adsorption of activated carbons (ACs) through changes in surface characteristics, and the adsorption characteristics according to the reaction time were considered. After the reaction, the micropore volume increased up to 1.03 cm3/g. In addition, as the reaction time increased, the fluorine content on the surface increased to 0.88%. It was possible to simultaneously control the pore properties and surface functional groups of the ACs through this experiment. Also, the CO2 uptake of surface-treated ACs improved up to 7.44% compared to untreated ACs, showing the best performance at 3.90 mmol/g when the reaction time was 60 s. This is due to the synergy effect of the fluorine functional groups introduced on the surface of the ACs and the increased micropore volume caused by the etching effect. It was found that the micropore volume had a greater effect on CO2 adsorption in the region where the CO2 uptake was less than 3.67 mmol/g, while the added fluorine content had a greater effect in the region above that.