Browse > Article
http://dx.doi.org/10.14773/cst.2013.12.5.215

Effect of Pretreatment on the Dissolution of Aluminum Alloy during Hydration Process  

Lee, Byoung-Gu (Department of Chemical Engineering, Inha University)
Lee, Hoyeon (Department of Chemical Engineering, Inha University)
Tak, Yongsug (Department of Chemical Engineering, Inha University)
Publication Information
Corrosion Science and Technology / v.12, no.5, 2013 , pp. 215-219 More about this Journal
Abstract
Aluminum alloy(3003) can be dissolved during hydration process with hot tap water. In order to increase the stability of aluminum alloy, it was pretreated with anodization and phosphoric acid before hydration process. The effect of pretreatment on the surface property changes was analyzed with X-ray Photoelectron Spectroscopy (XPS) and Inductively Coupled Plasma-Optical Emission Spectrometer (ICP-OES) and their results supported that the increase of hydroxyl group (-OH) on the surface formed during anodization and phosphorous acid treatment prevented the dissolution of aluminum alloy during hydration process at high temperature.
Keywords
aluminum alloy 3003; hydration; anodization; phosphoric acid; XPS; ICP-OES;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 K. Shimizu, G. M. Brown, H. Habazaki, K. Kobayashi, P. Skeldon, G. E. Thompson and G. C. Wood, Electrochimica Acta, 44, 2297 (1999).   DOI   ScienceOn
2 W. C. Mosheir, G. D. Davis and K. Ahera, Corros. Sci., 27, 785 (1987).   DOI   ScienceOn
3 S. Y. Lee, D. H. Park, J. P. Won, Y. H. Kim, M. H. Lee, K. M. Moon and J. H. Jeong, Corro. Sci. Tech., 11, 280 (2012)   DOI
4 J. W. Diggle, T. C. Downie and C. W. Goulding, Chem. Rev., 69, 365 (1969).   DOI
5 R. L. Chiu, P. H. Chang and C. H. Tung, Thin Solid Films, 260, 47 (1995).   DOI   ScienceOn
6 R. L. Chiu and P. H. Chang, J. Electrochem. Soc., 142, 525 (1995).   DOI
7 J. R. Davis, Corrosion of Aluminum and Aluminum Alloys, 1st ed., ASM international, United States of America (1999).
8 Y. S. Tak, J. W. Kang and J. S. Choi, J. Korean. Ind. Eng. Chem., 17,335 (2006).
9 N. F. Jackson and D. S. Campbell, Thin Solid Films, 36, 331 (1976).   DOI   ScienceOn
10 L. Bazzi. R. Salghi, Z. Ei Alami, E. Ait Addi, S. EI Issami, S. Kertit and B. Hammouti, Prog. Org. Coat., 51, 113 (2004).   DOI   ScienceOn
11 W. T. Tsai, Y. H. Hon and J. T. Lee, Surf. Coat. Technol., 31, 365 (1987).   DOI   ScienceOn
12 P. R. Underhill and A. N. Rider, Surf. Coatings Tech., 192, 199 (2005).   DOI   ScienceOn
13 R. S. Alwitt, J. Electrochem. Soc., 121, 1322 (1974).   DOI
14 Izaya Nagata, Aluminum Electrolytic Capacitor, Japan Capacitor Company, p.278, Japan (1983).
15 B. Cheng, S. Ramamurthy and N. S. Mclntyre, J. Mater. Eng. Perform., 6, 405 (1997).   DOI   ScienceOn
16 J. K. Chang, C. M. Liao, C. H. Chen and W. T. Tsai, J. Power Sources, 138, 301 (2004).   DOI   ScienceOn
17 Japanese Society of Light Metal, Texture and Properties of Aluminum, p.137, Japan (1991).
18 H. Konno, S. Kobayashi, H. Takahashi and M. Nagayama, Corros. Sci., 22, 913 (1982).   DOI   ScienceOn
19 J. Zahr, S. Oswald, M. Turpe, H. J. Ullrich and U. Fussel, Vacuum, 86, 1216 (2012).   DOI   ScienceOn
20 S. Yamamoto, H. Bluhm, K. Andersson, G. Ketteler, H. Ogasawara, M. Salmeron and A. Nilsson, J. Phys.: Condens. Matter, 20, 184025 (2008).   DOI   ScienceOn
21 S. Geng, S. Zhang and H. Onishi, Mater. Tech. (2002).
22 Y. I. Seo, Y. J. Lee, D. G. Kim, K. H. Lee and Y. D. Kim, Appl. Surf. Sci., 256, 4434 (2010).   DOI   ScienceOn
23 B. C. Bunker, G. C. Nelson, K. R. Zavadil, J. C. Barbour, F. D. Wall and J. P. Sullivan, J. Phys. Chem. B, 106, 4705 (2002).   DOI   ScienceOn
24 W. J. Bernard and J. J. Randall Jr., J. Electrochem. Soc., 108, 822 (1961).   DOI
25 X. Yang, Z. Sun, D. Wang and W. Forsling, J. Colloid Interface Sci., 308, 395 (2007).   DOI   ScienceOn
26 K. Wefers and C. Misra, Proceedings of the 1st Oxides and Hydroxides of Aluminum, Alcoa Laboratories (1987).
27 J. F. Moulder, W. F. Stickle, P. E. Sobol and K. D. Bomben, Handbook of X-ray Photoelectron Spectroscopy, 1st ed., Physical Electronics, USA (1995).
28 M. S. Hunter and P. Fowle, J. Electrochem. Soc., 103, 482 (1956).   DOI