• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.73-79
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• 2013

Crystalline silicon solar cells with $SiN_x/SiN_x$ and $SiN_x/SiO_x$ double layer anti-reflection coatings(ARC) were studied in this paper. Optimizing passivation effect and optical properties of $SiN_x$ and $SiO_x$ layer deposited by PECVD was performed prior to double layer application. When the refractive index (n) of silicon nitride was varied in range of 1.9~2.3, silicon wafer deposited with silicon nitride layer of 80 nm thickness and n= 2.2 showed the effective lifetime of $1,370{\mu}m$. Silicon nitride with n= 1.9 had the smallest extinction coefficient among these conditions. Silicon oxide layer with 110 nm thickness and n= 1.46 showed the extinction coefficient spectrum near to zero in the 300~1,100 nm region, similar to silicon nitride with n= 1.9. Thus silicon nitride with n= 1.9 and silicon oxide with n= 1.46 would be proper as the upper ARC layer with low extinction coefficient, and silicon nitride with n=2.2 as the lower layer with good passivation effect. As a result, the double layer AR coated silicon wafer showed lower surface reflection and so more light absorption, compared with $SiN_x$ single layer. With the completed solar cell with $SiN_x/SiN_x$ of n= 2.2/1.9 and $SiN_x/SiO_x$ of n= 2.2/1.46, the electrical characteristics was improved as ${\Delta}V_{oc}$= 3.7 mV, ${\Delta}_{sc}=0.11mA/cm^2$ and ${\Delta}V_{oc}$=5.2 mV, ${\Delta}J_{sc}=0.23mA/cm^2$, respectively. It led to the efficiency improvement as 0.1% and 0.23%.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.186-186
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• 2012

최근 Flexible organic electronics 분야에 대한 관심과 더불어 소자의 산소 및 수분의 침투를 방지하기 위한 투습방지막 연구가 활발히 진행되고 있다. 이에 본 연구에서는 Closed Drift Linear Source(CDLPS) 플라즈마 공정을 이용하여 저온 고속의 $SiO_xC_yH_z$ barrier flims 형성 연구를 진행하였다. HMDSO(hexamethyldisiloxane), TMS(trimethylsilane)와 산소를 기반으로 HMDSO/HMDSO+산소의 비율에 따라 $Si(-O_x)$ 변화에 따른 특성 평가를 진행하였다. X-ray photoelectrom spectroscopy(XPS) 및 Ft-IR spectrometer 측정 시 3.7% 비율에서 실리콘 원소가 산소 라디칼과 효율적인 반응을 함으로써 단일한 $SiO_2$ 박막이 형성됨을 확인 하였다. 그와 반면에 비율의 증가로 인해 다량의 HMDSO 물질이 주입 되었을 시 산소 라디칼과 충분히 반응 되지 못하여 $SiO_2$에 비해 $Si(CH)_x$ 가 많이 함량 된 Polymer like한 $SiO_x$가 많이 형성되었다. 박막의 증착율의 경우에는 3.7%에서 18%로 증가함에 따라 35 nm/min에서 180 nm/min의 증착율을 가지는 것을 확인 하였다. 3.7% 비율의 단일 $SiO_2$ 공정 조건으로 유기태양전지에 형성 하였을 시 소자의 에너지 변환 효율(PCE)이 변화 없는 것을 확인하였다. 이는 기존 공정에 비해 CDLPS 플라즈마 공정의 경우 유기소자에 플라즈마로 인한 열에너지나 이온 충격 에너지로 인한 영향 없는 것을 확인 할 수 있다. 이런 장점을 통해 CDSPS를 이용한 공정 기술은 다양한 유기 소자의 barrier 형성 연구에 큰 도움이 될 것이다.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.44-47
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• 2004

Fabrication of barrier layer on PES substrate and plastic OLED device by atomic layer deposition are carried out. Simultaneous deposition of 30nm of $AlO_x$ film on both sides of PES gives film MOCON value of 0.0615g/$m^2$.day (@38$^{\circ}C$, 100% R.H). Introduction of conformal $AlO_x$ film by ALD resulted in enhanced barrier properties for inorganic double layered film including PECVO $SiN_x$. Preliminary life time to 91% of initial luminance (1300 cd/$m^2$ ) for 100nm of PECVD $SiN_x$/30nm of ALD $AlO_x$ coated plastic OLED device was 260 hours.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.42-49
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• 2011

We deposited $SiN_x$ thin films by using PECVD technique at $200^{\circ}C$ with various flow ratios of the $SiH_4/N_2$ gases. The photoluminescence measurements revealed that the maximum emission wavelength shifted to long wavelength as the ratio increased, however, positions of the several peak wavelengths, such as 1.9, 2.2, 2.4, and 3.1 eV, were independent on the ratio. Changes of the photoluminescence spectra were measured in the $N_{2}-$, $H_{2}-$, and $O_2$-annealed films. The luminescence intensities increased after the annealing process. In particular, the maximum emission wavelength shifted to short wavelength after $H_{2}-$ or $O_2$-annealing. But there were still several peaks on the spectra of all annealed films, several peak positions remained to be unchanged after the annealing. As for the light emission mechanism, we have considered the defect states of the Si- and N- dangling bonds in the $SiN_x$ energy gap, so that the energy transitions from/to the conduction/valence bands and the defect states in the gap were attributed to the light emission in the $SiN_x$ films. The experimental results point to the possibility of a Si-based light emission materials for flexible Si-based electro-optic devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.157-158
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• 2007

Effects of post-metallization anneal (PMA) on interface trap characteristics of Si-$SiO_2$ are studied. The conventional PMA method utilizes forming gas anneal, where 10% hydrogen in nitrogen atmosphere is used. A new PMA method utilizes hydrogen rich PECVD- silicon nitride $(SiN_x)$ film as a hydrogen diffusion source and a out-diffusion blocking layer. It can be shown through charge pumping current measurement that the new PMA is indeed effective to decrease Si-$SiO_2$ interface trap density.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.62.2-62.2
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• 2011

산업화 이후, 석탄 석유를 중심으로 한 화석연료가 이산화탄소를 대량으로 배출하며 지구 온난화를 야기함에 따라, 기존의 화석연료를 대체할 청정하고 무한 재생 가능한 대체에너지로 가장 큰 기대를 받고 있는 것은 태양에너지이며, 이에 보조를 맞춰 태양광발전에 대한 연구개발이 국내외적으로 활발히 진행되고 있는 실정이다. 태양 전지는 빛 에너지를 직접 전기 에너지로 바꿔주는 소자로, 셀의 효율을 높이기 위해서는 최대한 많은 빛을 흡수시킬 수 있는 것이 중요하다. 빛의 반사를 줄이는 방법에는 texturing과 antireflecting coating이 있다. Antireflecting coating은 반도체와 공기의 중간 굴절율을 갖는 박막을 증착하여 측면 반사를 감소시킴으로서 빛의 손실을 감소시키는 역할을 한다. 과거에 반사방지막으로 가장 많이 사용되었던 물질은 SiO로써 굴절률은 1.8~1.9로서 최소의 반사율은 1% 미만이지만, 가시광선영역에서의 흡수에 의한 손실이 생기므로, SiNx가 대체 물질로 제안되었다. SiNx의 경우 굴절률이 약 1.5로서 Si에 쉽게 형성시킬 수 있고, texturing된 Si 표면에 적합하며 반사율을 10%에서 2%로 줄일 수 있는 장점을 가지고 있다. 따라서 본 연구에서는 high power, high frequency PECVD 방법으로 $SiH_4$와 $NH_3$ gas의 비율, $N_2$ carrier gas 등 공정 변수를 변화시켜 증착한 SiNx 박막의 결정학적 특성을 X-ray diffraction 분석과 XPS (X-ray photoelectron spectroscopy)를 통해 화학적 결합을 확인하였고, 이를 FT-IR (Fourier Transform-Infrared spectroscopy)를 통해 관찰한 결과와 연관시켜 분석하였다. 굴절율의 경우 ellipsometer를 이용하여 측정하였으며 위의 측정을 통하여 SiNx박막의 반사 방지막으로써의 가능성을 확인 하였다.

• Transactions on Electrical and Electronic Materials
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• v.7 no.6
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• pp.293-296
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• 2006

We studied homeotropic alignment effect for a nematic liquid crystal (NLC) on the $SiO_{x}$ thin film irradiated by the new ion beam method. $SiO_{x}$ thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) and were treated by the DuoPIGatron ion source. A uniform liquid crystal alignment effect was achieved over 2100 eV ion beam energy. Tilt angle were about $90^{\circ}$ and were not affected by various ion beam energy.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.600-605
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• 2010

In order to meet the requirements of faster speed and higher packing density for devices in the field of semiconductor manufacturing, the development of Cu/Low k device material is explored for use in multi-layer interconnection. SiOC(-H) thin films containing alkylgroup are considered the most promising among all the other low k candidate materials for Cu interconnection, which materials are intended to replace conventional Al wiring. Their promising character is due to their thermal and mechanical properties, which are superior to those of organic materials such as porous $SiO_2$, SiOF, polyimides, and poly (arylene ether). SiOC(-H) thin films containing alkylgroup are generally prepared by PECVD method using trimethoxysilane as precursor. Nano voids in the film originating from the sterichindrance of alkylgroup lower the dielectric constant of the film. In this study, methyltriphenylsilane containing bulky substitute was prepared and characterized by using NMR, single-crystal X-ray, GC-MS, GPC, FT-IR and TGA analyses. Solid-state NMR is utilized to investigate the insoluble samples and the chemical shift of $^{29}Si$. X-ray single crystal results confirm that methyltriphenylsilane is composed of one Si molecule, three phenyl rings and one methyl molecule. When methyltriphenylsilane decomposes, it produces radicals such as phenyl, diphenyl, phenylsilane, diphenylsilane, triphenylsilane, etc. From the analytical data, methyltriphenylsilane was found to be very efficient as a CVD or PECVD precursor.

• Korean Journal of Materials Research
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• v.19 no.2
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• pp.90-94
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• 2009

The development of low-k materials is essential for modern semiconductor processes to reduce the cross-talk, signal delay and capacitance between multiple layers. The effect of the $CH_4$ concentration on the formation of SiOC(-H) films and their dielectric characteristics were investigated. SiOC(-H) thin films were deposited on Si(100)/$SiO_2$/Ti/Pt substrates by plasma-enhanced chemical vapor deposition (PECVD) with $SiH_4$, $CO_2$ and $CH_4$ gas mixtures. After the deposition, the SiOC(-H) thin films were annealed in an Ar atmosphere using rapid thermal annealing (RTA) for 30min. The electrical properties of the SiOC(-H) films were then measured using an impedance analyzer. The dielectric constant decreased as the $CH_4$ concentration of low-k SiOC(-H) thin film increased. The decrease in the dielectric constant was explained in terms of the decrease of the ionic polarization due to the increase of the relative carbon content. The spectrum via Fourier transform infrared (FT-IR) spectroscopy showed a variety of bonding configurations, including Si-O-Si, H-Si-O, Si-$(CH_3)_2$, Si-$CH_3$ and $CH_x$ in the absorbance mode over the range from 650 to $4000\;cm^{-1}$. The results showed that dielectric properties with different $CH_4$ concentrations are closely related to the (Si-$CH_3$)/[(Si-$CH_3$)+(Si-O)] ratio.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.650-656
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• 1995

High frequency SAW filters for cellular communications were fabricated by metallizing 36$^{\circ}$Y-X LiTaO$_3$piezoelectric substrate with IIDT type electrodes. It was found that the center frequency of the filter was lowered than as designed. In order to overcome such a drawback and enable a fine tuning of its center frequency, dielectric SiN$_{x}$ thin films were deposited on LiTaO$_3$substrate by PECVD as passivation layer and then frequency responses were also characterized. As a result, the center frequency of the filter could be shifted to a higher frequency with increasing the thickness of SiN$_{x}$ film, because SAW velocity increased with increasing the ratio of the thickness of dielectric thin film to wavelength. The insertion loss of the filter, however, became larger with increasing the thickness of SiN$_{x}$ film.