• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• 대한전자공학회논문지SD
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• 제45권4호
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• pp.72-77
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• 2008

본 논문에서는 Embedded resistor 적용을 위한 오개닉 기판 위에 캐버티(Cavity) 공정에 의해서 형성된 균일한 두께를 갖는 저항체의 제조 방법과 저항편차에 대해서 조사했다. 기존의 스크린 프린팅에 의해서 발생하는 PCB의 위치에 따른 저항값의 편차를 개선하기 위하여 캐버티 공정을 소개했다. 원하는 모양과 부피를 갖는 저항은 스크린 프린팅과 페이스트를 이용하여 cavity 공정에 의해 정확하게 형성되어 졌다. 이 방법은 PCB의 생산 공정시간을 줄일 수 있고, 스크린 프린팅의 정밀도에 의한 큰 영향 없이 빠르게 공정 조건을 배치할 수 있으므로써 생산량을 개선시킬 수 있다.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• 한국산학기술학회논문지
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• 제15권8호
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• pp.4736-4741
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• 2014

본 연구는 PCB기판 세척에 관한 것으로 기존 세척 방법인 침전식 세척의 단점인 PCB기판 표면실링제와 접착제 공정에서 형성된 이물질이 달라붙거나 끼워 있는 경우, 쉽게 제거되지 못하는 문제점이 있었다. PCB기판이 안착되어 고속회전을 통해 원심력으로 기판의 미세한 부분까지 이물질이 제거되도록 하는 PCB기판 세청용 회전 지그를 개발 하였다. 결과는 다음과 같다. 개발 목표는 PCB기판 세척시 불량률을 줄이는 것으로 기존 침전식에서, 원심력을 이용한 회전형으로 개발, 세척액에 따른 기판손상을 80%이상 줄이는 결과를 얻었다. 회전식에 따른 세척할 수 있는 수량이 제한된 단점을 베이스플레이트에서 PCB기판의 용이한 탈부착이 가능하도록 설계 기존 방법의 세척 후 공정을 포함한 시간과 비교하여 큰 차이를 보이지 않았으며. 기존 시간과 비교하여 세척시간을 90%까지 높였다. 세척용 회전 지그에 고정된 PCB기판이 원심력에 의해 이탈현상 없이 고정력을 효과적으로 유지 할 수 있도록 설계함으로써, 세척공정의 안정성 및 신뢰성을 확보하여 불량률을 1% 미만으로 개선 할 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.149-154
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• 2018

가로등 및 방폭등용 고출력 LED 조명 시스템의 광원으로서, 다수의 LED 칩이 실장된 50와트급 LED 어레이 모듈을 chip-on-board형 고방열 세라믹-메탈 하이브리드 기판을 사용하여 제작하였다. 고방열 세라믹-메탈 하이브리드 기판은 고열전도 알루미늄 금속 열확산 기판에 저온소결용 글라스-세라믹 절연 페이스트와 은 전극 페이스트를 후막 스크린 공정에 의해 도포한 다음, 건조 후 $515^{\circ}C$에서 동시소성하여 LED 칩을 실장할 세라믹 절연층과 은전극 회로층을 형성하여 제조하였다. 이 하이브리드 기판의 방열특성 평가를 위한 비교 샘플로서 기존의 에폭시 기반 FR-4 복합수지로 만든 써멀비아형 PCB 기판에도 동일한 디자인의 LED 어레이 모듈을 제작한 다음, 다중채널 온도측정장치와 열저항 측정기로 방열특성을 비교 분석하였다. 그 결과, $4{\times}9$ type LED 어레이 모듈에서 세라믹-메탈 하이브리드 기판의 열저항은 써멀비아형 FR-4 기판에 비하여 약 1/3로 나타났으며, 이것은 곧 방열성능이 적어도 3배 이상 높은 것으로 볼 수 있다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.33-36
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• 2014

In this paper, a carbon strain gauge for large strain was developed. The carbon strain gauge was fabricated by forming PCB and antenna pattern using Cu/Ni/Au film and carbon resistor pattern using screen printing process on plastic film substrate. It was possible to develop low-cost disposable strain gauge since the carbon paste was cheap and the fabrication process was simple. The wireless communication type carbon strain gauge was fabricated by integrating signal processing circuit, antenna and power all together on the same substrate as a strain gauge. The wireless communication type carbon strain gauge has a merit of being available immediately at the spot without any particular system.