• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.105-105
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• 2006

IT 산업 및 반도체 산업이 발전함에 따라 초소형, 고집적화 시스템의 요구에 대응하기 위해서 고해상도 및 고정밀의 패턴 구현에 관한 많은 연구가 진행되고 있다. 이러한 연구는 각종 산업제품의 PCB(Printed Circuit Board) 및 디스플레이 장치인 PDP(Plasma Display Panel), LCD(Liquid Crystal Display) 등에 적용되어 널리 응용되고 있다. 현재 널리 사용되는 인쇄 회로 기판은 마스킹 후 선택적 에칭 방식을 적용하여 금속 배선을 형성하는 방식을 적용하고 있다. 이러한 방식은 설계가 변경될 경우 마스크를 다시 제작해야 하는 번거로움이 있어 설계 변경이 용이하지 않고 더욱 길어진 생산시간의 증가로 인하여 생산성 및 집적도가 떨어지게 된다. 따라서 최근에는 이러한 한계를 극복하기 위한 방안이 여러 가지 측면에서 시도되고 있으며, 그 중에서도 Inkjet Printing 기술에 대한 관심이 증가하고 있다. 본 연구에서는 Inkjet Printing 방식을 적용하여 금속 배선을 형성하고 선폭과 두께의 오차를 줄여 배선의 Tolerance 를 개선할 수 있는 방안을 제안하였다. Inkjet Printing 방식을 이용한 기존의 금속 배선 형성은 고해상도의 DPI(Dot Per Inch)에서 잉크 액적이 뭉치는 Bulge 현상이 발생되어 원하는 형상 및 배선의 폭을 구현하는데 어려움이 있었다. Bulge 현상은 배선의 불균일성을 야기할 뿐만 아니라 근접한 배선의 간섭에도 영향을 미처 금속 배선의 기능을 할 수 없는 단점을 발생시킨다. 따라서 본 연구에서는 이러한 Bulge 현상을 줄이고 배선간의 간섭을 방지하여 원하는 배선을 용이하게 형성할 수 있는 순차적 인쇄 방식을 적용하였다. 본 연구에서는 노즐직경 35um 의 Inkjet Head 와 나노 Ag 입자 잉크를 사용하여 Glass 표면 위에 배선을 형성하고 배선의 폭과 두께를 측정하였다. 또한 순차적 인쇄 방식을 적용하여 700DPI 이상의 고해상도에서 나타날 수 있는 Bulge 현상이 감소하였음을 관찰하였으며 금속 배선의 Tolerance를 10%내외로 유지할 수 있음을 확인하였다.

• Journal of Engineering Education Research
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• v.24 no.5
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• pp.38-45
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• 2021

The CanSat was designed as an educational satellite simulation program that implements the overall system of the satellite such as the command processing unit, the communication unit, and the power unit in a structure of the size of a can. In particular, the training effect is very excellent because the trainee can learn a process similar to the actual satellite development process by designing, manufacturing, testing, and launching. Republic of Korea Air Force Academy has been using the CanSat production kit used by the domestic can satellite contest experience department for education, but since it was produced based on PCB, it was impossible to show creativity and operation was restricted even with small mistakes. In this paper, we analyze the existing CanSat kit and propose a new educational CanSat kit that can be used in creative engineering design and practice subjects that will be reorganized into a regular course from 2021, and a lesson plan. In conclusion, by using the proposed CanSat kit for lectures, it is possible to achieve educational purposes and effects, improve lecture satisfaction, and provide stable instruction.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.594-602
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• 2022

Cast-resin transformers are widely installed in various electrical power systems because of their low operating cost and low influence on external environmental factors. However, when they have an internal defect during the manufacturing process or operation, a partial discharge (PD) occurs, and eventually destroys the insulation. In this paper, a Rogowski-type PD sensor was studied to replace commercial PD sensors used for the insulation diagnosis of power apparatus. The proposed PD sensor was manufactured with four different types of PCB-based winding structures, and it was analyzed in terms of the detection characteristics for standard calibration pulses and the changes of the output voltage according to the distance. The output increased linearly in accordance with the applied discharge amount. It was confirmed that the hexagon structure sensor had the highest sensitivity, because the winding cross-sectional area of the sensor was larger than others. In addition, as the distance from the defect increased, the output voltage of the sensors decreased by 7.32% on average. It was also confirmed that the attenuation rate according to the distance decreased as the input discharge amount increased. For the application of this new type sensor, PD electrode system was designed to simulate the void defect. Waveforms and PRPD patterns measured by the proposed PD sensors at DIV and 120% of DIV were the same as the results measured by MPD 600 based on IEC 60270. The proposed PD sensors can be installed on the inner wall of the transformer tank by coating its surfaces with a non-conductive material; therefore, it is possible to detect internal defects more effectively at a closer distance from the defect than the conventional sensors.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.6
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• pp.13-19
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• 1995

A dual purpose robot automation system is developed for both arc welding and spot welding by one robot within a cell. The need for automation of both arc welding and spot welding processes is urgent while the production volume is not so big as to accommodate separate stations for the two processes. Also, space is too narrow for separate stations to be settled down in the factory. A spot welding robot is chosen and the functions for arc welding are implemented in-house at cost of advanced functions. For the spot welding, a single pole type gun is used and the robot has to push down the plate to be wolded, which causes the robot positioning error. Therefore, position error compensation algorithm is developed. The basic functions for the arc welding processes are implemented using the digital I/O board of robot controller, PLC, and A/D conversion PCB. The weaving pattern is taught in meticulously by manual teach. A fixture unit is also developed for dual purpose. The main aspects of the system is presented in this paper especially in the design and implementation procedure. The signal diagrams and sequence logic diagrams are also included. The outcome of the dual purpose welding cell is the increased productivity and good production stability which is indispensable for production volume prediction. Also, it leads to reduction of manufacturing lead time.

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.2
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• pp.213-218
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• 2022

In this paper, a technology for a high-efficiency wireless power transmission transmitting and receiving coil that can wirelessly charge a drone is introduced. The drone station implements the ability to charge the battery wirelessly without the need to remove the battery to charge the drone's battery. In order to charge the drone's battery in the shortest time, wireless charging efficiency must be high. In order to increase the wireless charging efficiency of the drone station, a method for manufacturing high-efficiency transmitting and receiving coils and a performance measurement method are presented. Transmitting and receiving coils were manufactured considering the size and weight of the drone so as not to interfere with the flight of the drone. Efficiency of 88% or more was realized at a distance of 40mm or more between the transmitting and receiving coils.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.239-245
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• 2016

In this study, a 12 V PWM boost converter was designed with the optimal values of the external components of the power stage was well as the compensation stage for smart electronic applications powered by a battery device. The 12 V boost PWM converter consisted of several passive elements, such as a resistor, inductor and capacitor with a diode, power MOS switch and control IC chip for the control PWM signal. The devices of the power stage and compensation stage were designed to maintain stable operation under a range of load conditions as well as achieving the highest power efficiency. The results of this study were first verified by a simulation in SPICE from calculations of the values of major external elements comprising the converter. The design was also implemented on the prototype PCBboard using commercial IC LM3481 from Texas Instruments, which has a nominal output voltage of 12 V. The output voltage, ripple voltage, and load regulation with the line regulation were measured using a digital oscilloscope, DMM tester, and DC power supply. By configuring the converter under the same conditions as in the circuit simulation, the experimental results matched the simulation results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.