• 제어로봇시스템학회논문지
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• 제4권3호
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• 한국전자파학회논문지
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• 제17권4호
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• pp.380-386
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• 2006

CPW(Co-Planer Waveguide) 전송선을 이용하여 자동차 연료 게이지 시스템인 전자식 연료 센더를 개발 제작하였다. 전송선 주위의 물질에 따라 전송선의 특성 임피던스가 변화되는 특성을 이용하였다. 자동차 연료통 속의 휘발유 혹은 경유의 높이에 따라 전송선의 특성 임피던스가 변화하면 반사량이 달라지므로 반사된 전압을 증폭함으로써 기존의 기계식 장치를 대체하는 시스템을 제작하였다. 브이(buoy)에 의한 부력과 연동된 저항 변화를 이용한 기존의 floating 방식이 갖는 기계식 작동 고장을 없애고, 유량 높이 오차를 줄이도록 하였다. 두께 1.6 mm의 Epoxy 기판에 CPW 전송 선로 및 제반 전자 장치를 구성하여 실측한 결과 기존 시스템에 비해 높이 오차가 적고 선형성이 우수한 특성을 보였다. 이 시스템은 PCB상 SMT로 제작되어 저가이면서도 양산성이 좋고 수명이 반영구적이어서 기존 시스템과의 경쟁력에서 우위를 보일 것으로 예상된다.

• 대한공업교육학회지
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• 제33권1호
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• pp.249-264
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• 2008

본 연구에서는 저 에너지 이온 주입과 이중 열처리를 통하여 박막 $p^+-n$ 접합을 형성하였고, 보론 확산 모델을 가지고 새로운 시뮬레이터를 설계하여 이온 주입과 열처리 후의 보론 분포를 재현하였다. $BF_2$ 이온을 가지고 실리콘 기판에 저 에너지 이온 주입을 하였고, 이후 RTA(Rapid Thermal Annealing)와 FA(Furnace Annealing)를 통하여 열처리 과정을 수행하였다. 시뮬레이션을 위한 확산 모델은 점결함의 생성과 재결합, BI 쌍의 생성, 보론의 활성화와 침전 현상 등을 고려하였다. FA+RTA 열처리가 RTA+FA 보다 면저항 측면의 접합 특성에서 우수한 결과를 나타내었고, 시뮬레이터에서도 동일한 결과를 나타내었다. 따라서 본 연구를 통하여 박막접합을 형성할 때 열적 효율성을 고려하면 제안된 확산 시뮬레이터와 FA+RTA 공정 방법의 유용성을 기대할 수 있다.

• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.594-602
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• 2022

Cast-resin transformers are widely installed in various electrical power systems because of their low operating cost and low influence on external environmental factors. However, when they have an internal defect during the manufacturing process or operation, a partial discharge (PD) occurs, and eventually destroys the insulation. In this paper, a Rogowski-type PD sensor was studied to replace commercial PD sensors used for the insulation diagnosis of power apparatus. The proposed PD sensor was manufactured with four different types of PCB-based winding structures, and it was analyzed in terms of the detection characteristics for standard calibration pulses and the changes of the output voltage according to the distance. The output increased linearly in accordance with the applied discharge amount. It was confirmed that the hexagon structure sensor had the highest sensitivity, because the winding cross-sectional area of the sensor was larger than others. In addition, as the distance from the defect increased, the output voltage of the sensors decreased by 7.32% on average. It was also confirmed that the attenuation rate according to the distance decreased as the input discharge amount increased. For the application of this new type sensor, PD electrode system was designed to simulate the void defect. Waveforms and PRPD patterns measured by the proposed PD sensors at DIV and 120% of DIV were the same as the results measured by MPD 600 based on IEC 60270. The proposed PD sensors can be installed on the inner wall of the transformer tank by coating its surfaces with a non-conductive material; therefore, it is possible to detect internal defects more effectively at a closer distance from the defect than the conventional sensors.