• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.4 s.107
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• pp.380-386
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• 2006

Electric fuel sender fur the vehicle fuel gauge system was designed and fabricated based on the CPW(Co-Planer Waveguide) transmission line theory. It is applied on this system that characteristic impedance of RF transmission line can be varied by the surrounded material of the line. By the characteristic impedance owing the level of gasoline or diesel fuel in vehicle fuel tank, CPW line has corresponding reflected signal as much as changed impedance. Detected signal is amplified, and delivered to fuel indicator into cluster unit on dash board. Conventional floating mechanical buoy level gauge has several defects as low reliability and high break down rate by mechanical operation, and has not good linearity for the fuel level difference. CPW line with electric circuits are constructed on 1.6 mm thickness epoxy substrate, and measurement shows that this system has more accurate level and better linearity than conventional mechanical system. New electric fuel sender which has good productivity with long lifetime and low-in-cost by the SMT chip assembling could be replaced this system with conventional floating buoy system.

• 대한공업교육학회지
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• v.33 no.1
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• pp.249-264
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• 2008

In this dissertation, shallow $p^+-n$ junctions were formed by ion implantation and dual-step annealing processes and a new simulator is designed to model boron diffusion in silicon. This simulator predicts the boron distribution after ion implantation and annealing. The dopant implantation was performed into the crystalline substrates using $BF_2$ ions. The annealing was performed with a RTA(Rapid Thermal Annealing) and a FA(Furnace Annealing) process. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of sheet resistance and the simulator reproduced experimental data successfully. Therefore, proposed diffusion simulator and FA+RTA annealing method was able to applied to shallow junction formation for thermal budget. process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.594-602
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• 2022

Cast-resin transformers are widely installed in various electrical power systems because of their low operating cost and low influence on external environmental factors. However, when they have an internal defect during the manufacturing process or operation, a partial discharge (PD) occurs, and eventually destroys the insulation. In this paper, a Rogowski-type PD sensor was studied to replace commercial PD sensors used for the insulation diagnosis of power apparatus. The proposed PD sensor was manufactured with four different types of PCB-based winding structures, and it was analyzed in terms of the detection characteristics for standard calibration pulses and the changes of the output voltage according to the distance. The output increased linearly in accordance with the applied discharge amount. It was confirmed that the hexagon structure sensor had the highest sensitivity, because the winding cross-sectional area of the sensor was larger than others. In addition, as the distance from the defect increased, the output voltage of the sensors decreased by 7.32% on average. It was also confirmed that the attenuation rate according to the distance decreased as the input discharge amount increased. For the application of this new type sensor, PD electrode system was designed to simulate the void defect. Waveforms and PRPD patterns measured by the proposed PD sensors at DIV and 120% of DIV were the same as the results measured by MPD 600 based on IEC 60270. The proposed PD sensors can be installed on the inner wall of the transformer tank by coating its surfaces with a non-conductive material; therefore, it is possible to detect internal defects more effectively at a closer distance from the defect than the conventional sensors.