• IE interfaces
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• v.23 no.1
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• pp.58-67
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• 2010

The purpose of this paper is to present the development processes of the assembly line tester of power transmission for lift truck. Because power transmission is most important part of lift truck, all assembled powertrain parts must be inspected for operational defects, pressures and RPM. Developed assembly line tester is designed to take about 25 minutes for inspecting each assembled power transmission and located it at the end of assembled line. The assembly line no-load tester consists of three parts: (1) the driving hardware part; for installing and operating the transmission. (2) control PCB part; send data from sensors to a computer and control driving part, (3) operation software of no-load tester; for an automatic inspection or manual inspection, for database management and printing transcripts.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.210-220
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• 2003

This work presents a method of point to surface assignment fur 3D metrology of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect assignment. The shape of bounding box fur solder paste brick is variable according to geometry of measured points. The surface geometry of bounding box is obtained by using five peaks selected in the histogram of normalized gradient vectors. By using the bounding box enclosing the solder pastes, the task of point-to-surface assignment has been successfully conducted, then geometrical features are obtained through the task of surface fitting.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.17-25
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• 2004

During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of .5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging and SMT.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.5
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• pp.513-519
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• 2013

Line scan camera has been widely used in the area of inspection of glass, film, fabric, iron, PCB and etc. due to the high resolution and the high speed. We developed the line scan based vision system to inspect tangled and cut-off status of yarn in the manufacturing process. The original image is binarized with a proper threshold, and the gap distances in the yarn are measured in real time, so finally the status of the process is decided by the maximum value of the gap distance. All procedures are executed in real time by realization of multi-processed threads. By implementation of this system, the error of the yarn in manufacturing process can be precedently monitored and the loss of the yarn is decreased efficiently.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.8
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• pp.710-718
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• 2000

In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.80-86
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• 1999

Since the quality of the coated wires is in various applications dependant on the coating depth, accuracy of hole size of dies used for coating wires must be maintained precisely, in general within one micron. This paper proposes a new vision system which measures automatically the size and shape of small holes having diameters less than 1mm within an error limit of 1 micron. To quickly obtain the focused image, this paper proposes an estimation method of the camera position using only a couple of defocused hole images. It measures the distributions of light intensity around the image boundary and decides the direction and distance of a camera motion. The proposed system measures the size, shape distortion, inclination of the hole against the axis of the dies structure, to decides the acceptability of the dies for use. The proposed algorithm has been implemented using a cheap 640${\times}$480 image system and has shown an average size error of 1micron when measuring the dieses having 0.1mm to 1.0mm diameters. It can be applied to the inspection of the size and position of holes in PCB, too.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2017.11a
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• pp.144-145
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• 2017

최근 전자 기기의 크기가 줄어들고 PCB의 사이즈와 반도체 패키지의 크기가 소형화되어 플립 칩 본딩(Flip chip bonding) 기술을 적용한 반도체 패키지 방식이 점점 늘어나고 있다. 이에 따라 PCB와 반도체 칩 사이를 연결하기 위해 응용되던 BGA(Ball Grid Array)에 핀 배열 대신 사용되는 범프(Bump)를 50um 이내의 초미세 범프로 만들어 일정한 배열을 유지하는 것이 중요하다. 또한 초미세 범프의 모양과 품질이 패키지 수율과 밀접하게 연관되기 때문에 이를 검사할 수 있는 기술이 필수적이다. 이에 본 논문은 초미세 범프측정을 할 수 있는 시스템 개발을 위한 측정 대상의 특징과 사용할 수 있는 광학계를 분석하였고, 획득된 영상을 가지고 딥러닝을 적용하여 정확하게 불량여부를 판별할 수 있는 초미세 범프 측정 시스템을 고안하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.132-137
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• 2018

Although the number of chemical accidents has been declining since the Chemical Control Act of 2015, there have been repeated occurrences of similar types of accidents at printed circuit board (PCB) manufacturing facilities. These accidents were caused by the overflow of hydrochloric acid and hydrogen peroxide, which are toxic chemicals used in the printed circuit board manufacturing process. An analysis of the $Cl^-$ content to identify the cause of the accident showed that in the mixed route of hydrochloric acid and hydrogen peroxide, which are accidental substances, the $Cl^-$ concentration was 66.85 ppm in the hydrogen peroxide sample. Through reaction experiments, it was confirmed that the deformation of a PVC storage tank and generation of chlorine gas, which is a toxic gas, occurred due to reaction heat occurring up to $50.5^{\circ}C$. This paper proposes a facility safety management plan, including overcharge, overflow prevention, leak detection device, and separation tank design for mixing prevention in printed circuit board manufacturing facility etch process. To prevent the recurrence of accidents of the same type, the necessity of a periodic facility safety inspection and strengthening of the safety education of workers was discussed.

• Journal of Digital Convergence
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• v.13 no.10
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• pp.337-342
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• 2015

SMT is an equipment that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. There are 16 different types of routes in this process. This paper presents the fastest algorithm to place (sLa-Camera-pLb) among all these routes. In order to do this, instead of stopping in front of camera the object should move on while going over the vision inspection. Among all possible tracks, this thesis will provide algorithm to find out the fastest tracks to do vision inspection and placing. And as a result, this thesis have demonstrated that this method can save about 16% of time compared to going over inspection while the object is standing still through simulation.

• KIPS Transactions on Software and Data Engineering
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• v.6 no.5
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• pp.223-228
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• 2017

SMT is an device that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. There are 16 different types of routes in this process. This paper compared to the moving time of three methods in the (sLa-Camera-pLa)type. The first method is stopping in front of the camera for vision inspection and placing components onto PCBs(stop-motion). The second method is moving in front of the camera for vision inspection without stopping(fly1-motion). The third method is inspecting the components when the speed of the X axis, the Y axis is the best and is placing components onto PCBs(fly2-motion). This paper shows the moving time of three methods is same. Therefore we proved that the stop-motion method can be placing in the fastest time without changing structure of the device in the (sLa-Camera-pLa)type.