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3-D Analysis and Inspection of Surface Mounted Solder Pastes by Point-to-Surface  

신동원 (금오공과대학교 기계공학부)
Publication Information
Abstract
This work presents a method of point to surface assignment fur 3D metrology of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect assignment. The shape of bounding box fur solder paste brick is variable according to geometry of measured points. The surface geometry of bounding box is obtained by using five peaks selected in the histogram of normalized gradient vectors. By using the bounding box enclosing the solder pastes, the task of point-to-surface assignment has been successfully conducted, then geometrical features are obtained through the task of surface fitting.
Keywords
Metrology; Inspection; Point Cloud; Solder Pastes; Histogram; Gradient; Bounding Box; Surface Fitting;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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