• The korean journal of orthodontics
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• 제48권4호
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• pp.245-252
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• 2018

Objective: We aimed to perform in-vitro evaluation to compare 1) shear bond strength (SBS), adhesive remnant index (ARI), and color change between self-etched and acid-etched primers; 2) the SBS, ARI and color change between direct and indirect bonding; and 3) the enamel roughness (ER) between 12-blade bur and aluminum oxide polisher debonding methods. Methods: Seventy bovine incisors were distributed in seven groups: control (no bonding), direct (DTBX), and 5 indirect bonding (ITBX, IZ350, ISONDHI, ISEP, and ITBXp). Transbond XT Primer was used in the DTBX, ITBX, and ITBXp groups, flow resin Z350 in the IZ350 group, Sondhi in the ISONDHI group, and SEP primer in the ISEP group. SBS, ARI, and ER were evaluated. The adhesive remnant was removed using a low-speed tungsten bur in all groups except the ITBXp, in which an aluminum oxide polisher was used. After coffee staining, color evaluations were performed using a spectrophotometer immediately after staining and prior to bonding. Results: ISONDHI and ISEP showed significantly lower SBS (p < 0.01). DTBX had a greater number of teeth with all the adhesive on the enamel (70%), compared with the indirect bonding groups (0-30%). The ER in the ITBX and ITBXp groups was found to be greater because of both clean-up techniques used. Conclusions: Direct and indirect bonding have similar results and all the primers used show satisfactory adhesion strength. Use of burs and polishers increases the ER, but polishers ensure greater integrity of the initial roughness. Resin tags do not change the color of the teeth.

• Journal of dental hygiene science
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• 제9권2호
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• pp.153-160
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• 2009

The purposed of this study was to investigate the effect of Gold bonding agent as intermediate layer between metal substrate and ceramic coating. Gold bonding agent used to seal off any surface porosity, to mask the greyish color of the metal, and to provide an underlying bright golden hue to the ceramic coverage. The adhesion between metal substrate and ceramic is related to diffusion of oxygen during ceramic firing. The oxide layer produced on non-precious alloy anti titanium was considered to have a potentially adverse effect on metal-ceramic bonding. The oxidation characteristics of titanium and non-precious alloys are the main problem. Every group were divided into test and control groups. Control groups are carried out process of degassing for product oxide layer. Au coating was applied on each Ni-Cr, Co-Cr alloys and cp-Ti specimens with difference surface condition or degassing. Specimens surfaces and cutting plane was characterized by SEM/EDS. Results suggested that Au coating is effective barriers to protect metal oxidation during ceramic firing.

• Journal of the Korean Ceramic Society
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• 제38권11호
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• pp.1000-1007
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• 2001

In an evacuated tube solar collector, the stable sealing of the heat pipe to the glass tube is important for the collector to use for a long period of time. The sealing of copper tube to the glass is quite difficult because of the large differences in the physical and chemical properties of the two materials. In this study, therefore, a proper copper oxide layer was induced to improve the chemical bonding of the two materials, and the oxidation state of copper and the interface between copper and glass were examined by XRD, SEM and EDS. Its bonding strength was also measured. Cu$_2$O was formed when the bare copper was heat-treated under 600$^{\circ}C$, while CuO oxide layer was formed above that temperature. The bonding state of CuO to the copper was very poor. The borate treatment of the copper, however, extend the stable forming of Cu$_2$O layer to 800$^{\circ}C$. Borosilicate glass tube was sealed to a copper tube by Housekeeper method only when the sealing part was covered with Cu$_2$O layer. The bonding strength at the interface was measured 354.4N, its thermal shock resistance was acceptable.

• Journal of Welding and Joining
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• 제30권3호
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Journal of Welding and Joining
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• 제33권3호
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Structural Engineering and Mechanics
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• 제87권4호
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• pp.375-389
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• 2023

In many fiber concrete beams with Carbon Fiber Reinforced Polymer (CFRP), debonding occurs between the carbon sheets and the concrete due to the low strength of the bonding resin. A total of 42 fiber concrete beams with a cross-section of 10×10 cm with a span length of 50 cm are fabricated and retrofitted with CFRP and subjected to a 4-point bending test. Graphene Oxide (GO) at 1, 2, and 3 wt% of the resin is used to improve the mechanical properties of the bonding resins, and the effect of length, width, and the number of layers of CFRP and resin material are investigated. The crack pattern, failure mode, and stress-strain curve are analyzed and compared in each case. The results showed that adding GO to polyamine resin could improve the bonding between the resin and the fiber concrete beam. Furthermore, the optimum amount of nanomaterials is equal to 2% by the weight of the resin. Using 2% nanomaterials showed that by increasing the length, width, and number of layers, the bearing and stiffness of fiber concrete beams increased significantly.

• Journal of the Korean Society for Precision Engineering
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• 제31권10호
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• pp.857-863
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• 2014

In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.

• Journal of the Microelectronics and Packaging Society
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• 제14권1호
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• pp.19-26
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 한국전산구조공학회 2011년도 정기 학술대회
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• pp.282-284
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• 2011

Based on graphene oxide and multi-walled carbon nanotube layers, a wireless bi-layer actuator that can be remotely controlled with an electromagnetic induction system has been developed. The graphene-based bi-layer actuator exhibits a large one-way bending deformation under eddy current stimuli due to asymmetrical responses originating from the temperature difference of the two different carbon layers. In order to validate one-way bending actuation, the coefficients of thermal expansion of carbon nanotube and graphene oxide are mathematically formulated in this study based on the atomic bonding energy related to the bonding length. The newly designed graphene-based bi-layer actuator is highly sensitive to electromagnetic wave irradiation thus it can trigger a new actuation mode for the realization of remotely controllable actuators and is expected to have potential applications in various wireless systems.

• Journal of the Korean Crystal Growth and Crystal Technology
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• 제30권5호
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• pp.208-213
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• 2020

In this research, design optimization was investigated using the finite element analysis and the optimal design technique based on the PQRSM algorithm to minimize the thermal deformation of IGZO oxide in a target module in which IGZO oxide and a copper backplate are bonded to each other. In order to apply the optimal design technique in conjunction with finite element analysis, the x-coordinate of lower supports and upper fixed boards used as design valuables, and the optimal design was performed to minimize the thermal displacement of IGZO materials as the objective function. After the optimization process, the thermal displacement within IGZO oxide could be reduced to 42 % comparing with the initial model. The result is thought to be useful in the industry as it can reduce the thermal deformation of target oxides materials only by changing the position of the subsidiary materials during the bonding process.